公开(公告)号：EP2863290A1

公开(公告)日：2015-04-22

申请号：EP13189384.4

申请日：2013-10-18

Applicant: Applied Materials, Inc.

Inventor： Morrison, Neil ,  Deppisch, Thomas ,  Lotz, Hans-Georg

IPC: G06F3/041 ,  G06F3/044

CPC classification number: G06F3/03547 ,  G06F3/041 ,  G06F3/044 ,  G06F2203/04103 ,  H05K1/0274 ,  H05K1/0306 ,  H05K2201/0137 ,  H05K2201/0145

Abstract: A layer stack (100; 200) for a touch panel is described. The layer stack includes a substrate (110; 210) including a polymer for depositing one or more layers on the substrate; a patterned transparent conductive oxide (TCO) layer (160; 260) provided over the substrate (110; 210), which comprises areas of TCO and gaps between the areas of TCO; a first dielectric material (170; 270) provided in the gaps of the patterned TCO layer (160; 260); and a dielectric layer (180; 280) being deposited directly on the TCO areas of the TCO layer (160; 260) and directly on the first dielectric material (170; 270). Further, a touch panel including a layer stack and a method for forming a layer stack for a touch panel is described.

Abstract translation: 的层堆叠（100; 200），用于触摸面板进行说明。 该叠层包括一个基片（110; 210）包括需要在沉积在衬底上的一个或多个层的聚合物; 设置在衬底（110; 210），其中TCO的区域之间包括和TCO的区域的间隙;一图案化透明导电氧化物（TCO）层（260 160）; 在图案化的TCO层的间隙提供的;第一电介质材料（270 170）（160; 260）; 和电介质层（180; 280）被直接沉积在TCO层的TCO区域（160; 260），并且直接在所述第一电介质材料（170; 270）。 此外，触摸面板，其包括一个层堆叠和形成用于触摸面板的层堆叠的方法进行说明。

公开(公告)号：EP2869677A4

公开(公告)日：2016-06-15

申请号：EP13808900

申请日：2013-02-28

Applicant: ISHIHARA CHEMICAL CO LTD

Inventor： KAWATO YUICHI ,  MITA TOMOHIRO ,  MAEDA YUSUKE ,  KUDO TOMIO

IPC: H05K3/38 ,  H05K1/09 ,  H05K3/24

CPC classification number: H05K3/38 ,  H05K1/0296 ,  H05K1/0313 ,  H05K1/097 ,  H05K3/245 ,  H05K3/246 ,  H05K3/386 ,  H05K2201/0129 ,  H05K2201/0137 ,  H05K2201/0154 ,  H05K2201/032 ,  H05K2203/1126 ,  H05K2203/1131 ,  Y10T29/49163

公开(公告)号：EP2919287A4

公开(公告)日：2016-05-11

申请号：EP12888036

申请日：2012-11-06

Applicant: NGK INSULATORS LTD

Inventor： YANO SHINSUKE ,  TANI MAKOTO ,  NAKANISHI HIROKAZU

IPC: H01L33/64 ,  H01L33/62

CPC classification number: H05K1/0207 ,  H01L33/62 ,  H01L33/641 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/16245 ,  H01L2933/0066 ,  H05K1/0204 ,  H05K1/0209 ,  H05K1/053 ,  H05K2201/0137 ,  H05K2201/062 ,  H05K2201/068 ,  H05K2201/10106 ,  H05K2201/10416 ,  H05K2203/1126

Abstract: A substrate for a light-emitting diode comprising a metal base with a thickness of a predetermined value or more is constituted so that the thickness of a top conductor for an electrical connection with a light-emitting diode (LED) in a predetermined range falls within a predetermined range and the thickness of an insulation layer which electrically insulates the metal base and the top conductor and the thickness of the top conductor meet a predetermined relation. Thereby, a substrate for a light-emitting diode which can show a high heat dissipation capacity by achieving a low thermal resistance as the total thermal resistance of the whole substrate without reducing insulation reliability and high-humidity reliability of the substrate is provided.

公开(公告)号：EP2863290B1

公开(公告)日：2017-12-06

申请号：EP13189384.4

申请日：2013-10-18

Applicant: Applied Materials, Inc.

Inventor： Morrison, Neil ,  Deppisch, Thomas ,  Lotz, Hans-Georg

IPC: G06F3/041 ,  G06F3/044 ,  H05K1/02 ,  H05K1/03 ,  G06F3/0354

CPC classification number: G06F3/03547 ,  G06F3/041 ,  G06F3/044 ,  G06F2203/04103 ,  H05K1/0274 ,  H05K1/0306 ,  H05K2201/0137 ,  H05K2201/0145

Abstract: A layer stack (100; 200) for a touch panel is described. The layer stack includes a substrate (110; 210) including a polymer for depositing one or more layers on the substrate; a patterned transparent conductive oxide (TCO) layer (160; 260) provided over the substrate (110; 210), which comprises areas of TCO and gaps between the areas of TCO; a first dielectric material (170; 270) provided in the gaps of the patterned TCO layer (160; 260); and a dielectric layer (180; 280) being deposited directly on the TCO areas of the TCO layer (160; 260) and directly on the first dielectric material (170; 270). Further, a touch panel including a layer stack and a method for forming a layer stack for a touch panel is described.

公开(公告)号：EP3157751A1

公开(公告)日：2017-04-26

申请号：EP15735776.5

申请日：2015-06-17

Applicant: Illinois Tool Works Inc.

Inventor： LIAO, Hongchuan ,  BENSON, Chris ,  LIANG, Yong ,  CARLSON, Tom

IPC: B32B27/08 ,  B32B27/18 ,  B32B27/20 ,  H01B17/56 ,  H05K9/00

CPC classification number: H05K1/185 ,  B32B27/08 ,  B32B27/20 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B2250/24 ,  B32B2250/40 ,  B32B2262/106 ,  B32B2264/02 ,  B32B2264/102 ,  B32B2264/105 ,  B32B2264/107 ,  B32B2264/108 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2307/212 ,  B32B2307/302 ,  B32B2457/04 ,  H05K2201/0137 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0183 ,  Y10T428/31507 ,  Y10T428/31681 ,  Y10T428/31692 ,  Y10T428/31721 ,  Y10T428/31725 ,  Y10T428/31728 ,  Y10T428/31736 ,  Y10T428/31757 ,  Y10T428/31786 ,  Y10T428/31797 ,  Y10T428/31913

Abstract: The present invention provides an insulation film and a method for making the insulation film, comprising a film upper layer and a film lower layer, wherein both of the film upper layer and film lower layer are made of a heat conduction plastics material, the heat conduction plastics material contains a heat conduction additive; and a film intermediate layer located between the film upper layer and the film lower layer. The film intermediate layer is made of a heat conduction plastics material, and the heat conduction plastics material contains a conductive additive An upper surface of the film intermediate layer is bound together with a lower surface of the film upper layer, and a lower surface of the film intermediate layer is bound together with an upper surface of the film lower layer.

Abstract translation: 本发明提供一种绝缘薄膜及其制造方法，包括薄膜上层和薄膜下层，其中薄膜上层和薄膜下层均由导热塑料材料制成， 塑料材料含有导热添加剂; 以及位于膜上层和膜下层之间的膜中间层。 薄膜中间层由导热塑料材料制成，导热塑料材料含有导电添加剂。薄膜中间层的上表面与薄膜上层的下表面结合在一起，并且薄膜中间层的下表面 薄膜中间层与薄膜下层的上表面结合在一起。

公开(公告)号：EP2919287A1

公开(公告)日：2015-09-16

申请号：EP12888036.6

申请日：2012-11-06

Applicant: NGK Insulators, Ltd.

Inventor： YANO Shinsuke ,  TANI Makoto ,  NAKANISHI Hirokazu

IPC: H01L33/64

CPC classification number: H05K1/0207 ,  H01L33/62 ,  H01L33/641 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/16245 ,  H01L2933/0066 ,  H05K1/0204 ,  H05K1/0209 ,  H05K1/053 ,  H05K2201/0137 ,  H05K2201/062 ,  H05K2201/068 ,  H05K2201/10106 ,  H05K2201/10416 ,  H05K2203/1126

Abstract: A substrate for a light-emitting diode comprising a metal base with a thickness of a predetermined value or more is constituted so that the thickness of a top conductor for an electrical connection with a light-emitting diode (LED) in a predetermined range falls within a predetermined range and the thickness of an insulation layer which electrically insulates the metal base and the top conductor and the thickness of the top conductor meet a predetermined relation. Thereby, a substrate for a light-emitting diode which can show a high heat dissipation capacity by achieving a low thermal resistance as the total thermal resistance of the whole substrate without reducing insulation reliability and high-humidity reliability of the substrate is provided.

Abstract translation: 包括具有预定值或更大厚度的金属基底的发光二极管的基板被构成为使得与预定范围内的发光二极管（LED）的电连接的顶部导体的厚度在其内 电绝缘金属基体和顶部导体的绝缘层和顶部导体的厚度的预定范围和厚度满足预定关系。 因此，提供了一种发光二极管的基板，其通过在不降低基板的绝缘可靠性和高湿度可靠性的情况下实现作为整个基板的总热阻的低热阻而显示出高的散热能力。

公开(公告)号：EP2869677A1

公开(公告)日：2015-05-06

申请号：EP13808900.8

申请日：2013-02-28

Applicant: Ishihara Chemical Co., Ltd.

Inventor： KAWATO, Yuichi ,  MITA, Tomohiro ,  MAEDA, Yusuke ,  KUDO, Tomio

IPC: H05K3/38 ,  H05K1/09 ,  H05K3/24

CPC classification number: H05K3/38 ,  H05K1/0296 ,  H05K1/0313 ,  H05K1/097 ,  H05K3/245 ,  H05K3/246 ,  H05K3/386 ,  H05K2201/0129 ,  H05K2201/0137 ,  H05K2201/0154 ,  H05K2201/032 ,  H05K2203/1126 ,  H05K2203/1131 ,  Y10T29/49163

Abstract: In a conductive film formed by photo sintering of a film composed of copper particulates, adhesiveness to a base material of the conductive film is improved.
A circuit board 1 includes a circuit including a conductive film 2, and a substrate 3. The circuit board 1 further includes a resin layer 4 between the substrate 3 and the conductive film 2. The substrate 3 is made of a non-thermoplastic base material 31. The resin layer 4 contains a thermoplastic resin. The conductive film 2 is formed by photo sintering of a film composed of copper particulates 21, and thus improving adhesiveness of the conductive film 2 to the base material 31 through the resin layer 4.

Abstract translation: 在通过由铜微粒构成的膜的光烧结而形成的导电膜中，与导电膜的基材的粘合性提高。 电路板1包括具有导电膜2和基板3的电路。电路板1还包括在基板3和导电膜2之间的树脂层4.基板3由非热塑性基材 树脂层4含有热塑性树脂。 导电膜2通过由铜微粒21构成的膜进行光烧结而形成，从而提高导电膜2通过树脂层4与基材31的密合性。