Abstract:
A flexible film is provided. The flexible film includes a dielectric film; and a metal layer disposed on the dielectric film, wherein the dielectric film has a thermal expansion coefficient of about 3 to 25 ppm/°C. The flexible film is robust against temperature variations and has excellent thermal resistance and excellent dimension stability.
Abstract:
Provided is a flexible film which includes a dielectric film, a metal layer formed on the dielectric film, circuit patterns formed on the metal layer, and a tin-based bonding layer formed on the circuit patterns. Thus, it is possible to improve the reliability, thermal resistance, and dimension stability of a flexible film and enhance the adhesion between circuit patterns and an integrated circuit (IC) of a flexible film and between circuit patterns and circuit electrodes of a display device.
Abstract:
A flexible film (100a,100e) is provided. The flexible film includes a dielectric film (110a,110e); and a metal layer (120a,130a,120e) disposed on the dielectric film, wherein the water absorbency of the dielectric film is about 0.01-3.5 %. The flexible film is robust against humidity variations and can efficiently transmit image signals having a high scan rate.
Abstract:
A flexible film (100c) is provided. The flexible film includes a dielectric film (110c), a first metal layer (120c), which is formed on the dielectric film, and a second metal layer (130c), which is formed on the first metal layer, wherein the surface of the dielectric film is modified so as to provide a haze of 2-25%. Therefore, it is possible to improve the peel strength of a dielectric film with respect to a metal layer and facilitate the testing of circuit patterns on a flexible film.
Abstract:
A flexible film is provided. The flexible film includes a dielectric film (110a), a metal layer (120a,130a) disposed on the dielectric film, and at least one hole (140a) formed through the dielectric film and the metal layer. Therefore, it is possible to facilitate the alignment of circuit patterns on a flexible film with an electrode of a panel of a display device or a circuit of a driving unit of a display device.
Abstract:
A flexible film (210) is provided. The flexible film includes a dielectric film (212); and a metal layer (214) disposed on the dielectric film, wherein the ratio of the thickness of the metal layer to the thickness of the dielectric film is about 1:3 to 1:10. Therefore, it is possible to improve the peel strength, dimension stability, and tensile strength of a flexible film by limiting the ratio of the thicknesses of a dielectric film and a metal layer of the flexible film.
Abstract:
A flexible film is provided. The flexible film includes a dielectric film; and a metal layer disposed on the dielectric film, wherein the dielectric film has a thermal expansion coefficient of about 3 to 25 ppm/°C. The flexible film is robust against temperature variations and has excellent thermal resistance and excellent dimension stability.
Abstract:
A flexible film (100c) is provided. The flexible film includes a dielectric film (110c), a first metal layer (120c), which is formed on the dielectric film, and a second metal layer (130c), which is formed on the first metal layer, wherein the surface of the dielectric film is modified so as to provide a haze of 2-25%. Therefore, it is possible to improve the peel strength of a dielectric film with respect to a metal layer and facilitate the testing of circuit patterns on a flexible film.
Abstract:
A flexible film is provided. The flexible film includes a dielectric film; and a metal layer disposed on the dielectric film, wherein the ratio of the thickness of the metal layer to the thickness of the dielectric film is about 1:1.5 to 1:10. The flexible film has excellent plating, adhesive strength, thermal resistance, folding endurance and chemical resistance properties.