公开(公告)号：EP2628176A4

公开(公告)日：2014-04-09

申请号：EP11832720

申请日：2011-10-10

Applicant: LG INNOTEK CO LTD

Inventor： PARK HYUN GYU ,  CHO IN HEE ,  AN YUN HO ,  PARK JAE MAN ,  KIM EUN JIN ,  KIM HAE YEON ,  LEE HYUK SOO

IPC: H01L23/34 ,  H01L33/64 ,  H05K1/02 ,  H05K3/00 ,  H05K7/20

CPC classification number: H05K7/205 ,  F21V29/70 ,  G02F1/133615 ,  H01L23/3677 ,  H01L25/0753 ,  H01L33/647 ,  H01L2224/16225 ,  H05K1/0204 ,  H05K1/056 ,  H05K1/113 ,  H05K3/30 ,  H05K3/4608 ,  H05K13/00 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2201/10969 ,  Y10T29/4913

Abstract: Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate comprising an integrated metal projection to which the plurality of heat generating devices are attached, an insulation member exposing the integrated metal projection, the insulation member comprising a plurality of insulation layers disposed on the metal plate, and first and second electrode pads disposed on the insulation member, the first and second electrode pads disposed being electrically separated from each other. The first and second electrode pads receives a voltage from circuit wires disposed on the insulation layers different from each other of the insulation member. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.

公开(公告)号：EP2644010A4

公开(公告)日：2017-09-27

申请号：EP11852165

申请日：2011-12-23

Applicant: LG INNOTEK CO LTD

Inventor： LEE SANG MYUNG ,  YOON SUNG WOON ,  LEE HYUK SOO ,  LEE SUNG WON ,  CHUN KI DO

IPC: H05K3/40 ,  H05K3/46

CPC classification number: H05K1/0298 ,  H05K3/46 ,  H05K3/4647 ,  H05K3/465 ,  H05K3/4652 ,  H05K3/4682 ,  H05K2201/0338 ,  H05K2203/0376

Abstract: Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer. The via includes a first part, a second part below the first part, and a third part between the first and second parts, and the third part includes a metal different from a metal of the first and second parts. The inner circuit layer and the via are simultaneously formed.

Abstract translation: 公开了一种印刷电路板及其制造方法。 印刷电路板包括核心绝缘层，穿过核心绝缘层形成的至少一个通孔，埋在核心绝缘层中的内部电路层以及位于核心绝缘层的顶表面或底表面上的外部电路层 。 通孔包括第一部分，在第一部分下方的第二部分以及在第一和第二部分之间的第三部分，并且第三部分包括与第一和第二部分的金属不同的金属。 内部电路层和通孔同时形成，使得处理步骤减少。 由于提供了奇数电路层，印刷电路板具有轻薄的结构。

公开(公告)号：EP2656702A4

公开(公告)日：2018-03-07

申请号：EP11850595

申请日：2011-12-23

Applicant: LG INNOTEK CO LTD

Inventor： LEE SANG MYUNG ,  YOON SUNG WOON ,  LEE HYUK SOO ,  LEE SUNG WON ,  CHUN KI DO

IPC: H05K3/40 ,  H05K3/46

CPC classification number: H05K1/0298 ,  H05K3/202 ,  H05K3/4647 ,  H05K3/465 ,  H05K3/4652 ,  H05K3/4682 ,  H05K2201/098 ,  H05K2203/0323 ,  H05K2203/0376

Abstract: Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer, wherein the via includes a center part having a first width and a contact part having a second width, the contact part makes contact with a surface of the core insulating layer, and the first width is larger than the second width. The inner circuit layer and the via are simultaneously formed so that the process steps are reduced. Since odd circuit layers are provided, the printed circuit board has a light and slim structure.

公开(公告)号：EP2596691A4

公开(公告)日：2015-02-11

申请号：EP11809828

申请日：2011-07-15

Applicant: LG INNOTEK CO LTD

Inventor： AN YUN HO ,  KIM EUN JIN ,  LEE HYUK SOO ,  PARK JAE MAN ,  CHO IN HEE ,  PARK HYUN GYU ,  KIM HAE YEON

IPC: H05K7/20 ,  H05K1/02

CPC classification number: H05K1/181 ,  H01L23/3677 ,  H01L2224/48227 ,  H05K1/0204 ,  H05K1/03 ,  H05K1/09 ,  H05K3/0061 ,  H05K2201/10106 ,  H05K2203/0369

Abstract: Disclosed are a radiant heat circuit board and a method for manufacturing the same. The radiant heat circuit board, which is used to mount a heat emitting device thereon, includes a metallic plate including a metallic protrusion having a solder to which the heat emitting device is attached, a bonding layer on the metallic protrusion, an insulating layer on the metallic plate to expose the metallic protrusion, and a circuit pattern on the insulating layer. Heat emitted from the heat emitting device is directly transferred to the metallic plate by providing the metallic plate including a heat radiation protrusion under the mounting pad, so that heat radiation efficiency is increased. The surface of the heat radiation protrusion is plated with an alloy including copper, thereby improving the adhesive property with respect to the solder, so that the failure rate is reduced.

公开(公告)号：EP2656703A4

公开(公告)日：2017-09-13

申请号：EP11851645

申请日：2011-12-23

Applicant: LG INNOTEK CO LTD

Inventor： LEE SANG MYUNG ,  YOON SUNG WOON ,  LEE HYUK SOO ,  LEE SUNG WON ,  CHUN KI DO

IPC: H05K3/40 ,  H05K3/46

CPC classification number: H05K1/0298 ,  H05K3/064 ,  H05K3/388 ,  H05K3/428 ,  H05K3/4647 ,  H05K3/4652 ,  H05K3/4682 ,  H05K2201/0341 ,  H05K2203/0376

公开(公告)号：EP2625712A4

公开(公告)日：2014-03-26

申请号：EP11830887

申请日：2011-10-05

Applicant: LG INNOTEK CO LTD

Inventor： PARK HYUN GYU ,  CHO IN HEE ,  AN YUN HO ,  PARK JAE MAN ,  KIM EUN JIN ,  KIM HAE YEON ,  LEE HYUK SOO

IPC: H01L23/34 ,  H01L23/367 ,  H01L23/498 ,  H01L25/075 ,  H01L33/64 ,  H05K1/02 ,  H05K1/05 ,  H05K7/20

CPC classification number: H05K1/021 ,  H01L23/3677 ,  H01L23/49838 ,  H01L25/0753 ,  H01L33/642 ,  H01L2224/73203 ,  H05K1/0204 ,  H05K1/056 ,  H05K2201/09054 ,  H05K2201/10106