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公开(公告)号：EP2680193A1
公开(公告)日：2014-01-01
申请号：EP13186179.1
申请日：2008-07-18
Applicant: MURATA MANUFACTURING CO., LTD.
Inventor： Kato, Noboru , Ishino, Satoshi , Kataya, Takeshi , Kimura, Ikuhei , Ikemoto, Nobuo , Dokai, Yuya
IPC: G06K19/077 , H01Q1/44 , H01Q1/24 , H01Q1/50 , H01Q7/00 , H01Q9/30 , H04B5/02 , H05K1/14 , H01Q1/36 , H01Q1/38 , H01Q1/42 , H01Q9/16 , H01Q13/10 , H05K1/02 , H05K1/16
CPC classification number: G06K19/07749 , G06K19/06187 , G06K19/0723 , G06K19/07756 , G06K19/07773 , G06K19/07779 , G06K19/07783 , G06K19/07784 , G06K19/07786 , H01L23/49838 , H01L23/552 , H01L23/66 , H01L2223/6655 , H01L2223/6677 , H01L2224/16227 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01Q1/36 , H01Q1/38 , H01Q1/42 , H01Q1/44 , H01Q7/00 , H01Q9/16 , H01Q9/30 , H01Q13/10 , H05K1/0216 , H05K1/0237 , H05K1/0239 , H05K1/141 , H05K1/16 , H05K1/181 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10098 , H05K2201/10371 , H05K2201/10522 , H01L2924/00014 , H01L2924/00
Abstract: To provide a radio IC device miniaturized without degrading the radiation characteristics.
A radio IC device includes an electromagnetic coupling module (1) including a radio IC chip (5) processing transmitted and received signals and a feed circuit board (10) having an inductance element. The feed circuit board (10) has an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case (28) or a wiring cable. The shielding case (28) or the wiring cable functions as a radiation plate. The radio IC chip (5) is operated by a signal received by the shielding case (28) or the wiring, and the answer signal from the radio IC chip (5) is radiated from the shielding case (28) or the wiring cable to the outside. A metal component may function as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board (20).Abstract translation: 提供小型化的无线电IC装置，而不降低辐射特性。 无线IC器件包括：电磁耦合模块（1），包括处理发送和接收信号的无线IC芯片（5）和具有电感元件的馈电电路板（10）。 馈电电路板（10）具有与馈电电路电磁耦合的外部电极，外部电极电连接到屏蔽壳（28）或布线电缆。 屏蔽壳（28）或布线电缆用作辐射板。 无线IC芯片（5）由屏蔽壳（28）或布线接收的信号进行操作，来自无线IC芯片（5）的应答信号从屏蔽壳（28）或布线电缆辐射到 外。 金属部件可以用作辐射板，并且金属部件可以是布置在印刷线路板（20）上的接地电极。
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公开(公告)号：EP2568419B1
公开(公告)日：2015-02-25
申请号：EP12195562.9
申请日：2008-07-18
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kato, Noboru , Ishino, Satoshi , Kataya, Takeshi , Kimura, Ikuhei , Ikemoto, Nobuo , Dokai, Yuya
IPC: G06K19/077 , H01Q1/44 , H01Q1/24 , H01Q1/50 , H01Q7/00 , H01Q9/30 , H04B5/02 , H05K1/14 , H01Q1/36
CPC classification number: G06K19/07749 , G06K19/06187 , G06K19/0723 , G06K19/07756 , G06K19/07773 , G06K19/07779 , G06K19/07783 , G06K19/07784 , G06K19/07786 , H01L23/49838 , H01L23/552 , H01L23/66 , H01L2223/6655 , H01L2223/6677 , H01L2224/16227 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01Q1/36 , H01Q1/38 , H01Q1/42 , H01Q1/44 , H01Q7/00 , H01Q9/16 , H01Q9/30 , H01Q13/10 , H05K1/0216 , H05K1/0237 , H05K1/0239 , H05K1/141 , H05K1/16 , H05K1/181 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10098 , H05K2201/10371 , H05K2201/10522 , H01L2924/00014 , H01L2924/00
Abstract: To provide a radio IC device miniaturized without degrading the radiation characteristics. A radio IC device includes an electromagnetic coupling module (1) including a radio IC chip (5) processing transmitted and received signals and a feed circuit board (10) having an inductance element. The feed circuit board (10) has an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case (28) or a wiring cable. The shielding case (28) or the wiring cable functions as a radiation plate. The radio IC chip (5) is operated by a signal received by the shielding case (28) or the wiring, and the answer signal from the radio IC chip (5) is radiated from the shielding case (28) or the wiring cable to the outside. A metal component may function as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board (20).
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公开(公告)号：EP2204882B1
公开(公告)日：2020-04-22
申请号：EP10158746.7
申请日：2007-01-12
Applicant: MURATA MANUFACTURING CO., LTD.
Inventor： Dokai, Yuya , Ishino, Satoshi , Kato, Noboru
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公开(公告)号：EP2375494A1
公开(公告)日：2011-10-12
申请号：EP11164413.4
申请日：2007-01-12
Applicant: MURATA MANUFACTURING CO., LTD.
Inventor： Dokai, Yuya , Kato, Noboru , Ishino, Satoshi
IPC: H01Q1/50 , G06K19/07 , G06K19/077 , H01Q1/38 , H01Q1/46 , H01Q9/16 , H04B5/02 , H04B5/00 , H01Q1/22
CPC classification number: H01Q1/38 , G06K19/07749 , G06K19/07756 , H01Q1/2208 , H01Q1/2225 , H01Q9/16 , H04B5/0012 , H04B5/0056 , Y02D70/122 , Y02D70/166 , Y02D70/42
Abstract: A wireless IC device and a component for a wireless IC device having a stable frequency characteristic are provided.
The wireless IC device includes a wireless IC chip (5), a power feeding circuit board (10) having the wireless IC chip (5) mounted thereon and including a power feeding circuit (16), where the power feeding circuit (16) includes a resonance circuit having a predetermined resonance frequency, and a radiating plate (20) bonded to a lower surface of the power feeding circuit board (10).
The resonance circuit is composed of an LC resonance circuit including an inductance element (L) and capacitance elements (C1) and (C2). The power feeding circuit board (10) is a rigid multilayer board or a rigid single-layer board. The power feeding circuit board (10) is connected to the wireless IC chip (5) and the radiating plate (20) via DC connection, magnetic coupling, or capacitive coupling.Abstract translation: 提供了具有稳定频率特性的无线IC器件和用于无线IC器件的部件。 无线IC器件包括无线IC芯片（5），安装有无线IC芯片（5）并且包括供电电路（16）的供电电路板（10），其中供电电路（16）包括 具有预定谐振频率的谐振电路，以及结合到供电电路板（10）的下表面的辐射板（20）。 谐振电路由包括电感元件（L）和电容元件（C1）和（C2）的LC谐振电路组成。 馈电电路板（10）是刚性多层板或刚性单层板。 馈电电路板（10）经由直流连接，磁耦合或电容耦合连接到无线IC芯片（5）和散热板（20）。
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公开(公告)号：EP2226893A1
公开(公告)日：2010-09-08
申请号：EP10166024.9
申请日：2007-01-12
Applicant: MURATA MANUFACTURING CO., LTD.
Inventor： Dokai, Yuya , Kato, Noburo , Ishino, Satoshi
CPC classification number: H01Q1/38 , G06K19/07749 , G06K19/07756 , H01Q1/2208 , H01Q1/2225 , H01Q9/16 , H04B5/0012 , H04B5/0056 , Y02D70/122 , Y02D70/166 , Y02D70/42
Abstract: A feed circuit for feeding a signal with a specified frequency to a radiation pattern and/or to receive a signal with a specified frequency from the radiation pattern comprises a resonant circuit having a predetermined resonant frequency, so that the feed circuit can feed and/or receive a signal with a frequency that is substantially equal to the resonant frequency of the resonant circuit to and/or from the radiation pattern. The resonant circuit comprises a first resonant circuit having a first inductor element and a second resonant circuit having a second inductor element. The first inductor element and the second inductor element are electrically connected to each other in parallel and are magnetically coupled with each other.
Abstract translation: 用于将具有指定频率的信号馈送到辐射图案和/或从辐射图案接收具有指定频率的信号的馈电电路包括具有预定谐振频率的谐振电路，使得馈电电路可以馈送和/或 接收具有与谐振电路的谐振频率基本上等于和/或来自辐射图案的频率的信号。 谐振电路包括具有第一电感器元件的第一谐振电路和具有第二电感器元件的第二谐振电路。 第一电感器元件和第二电感器元件彼此并联电连接并且彼此磁耦合。
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Patent Agency Ranking
公开(公告)号：EP2375493B1
公开(公告)日：2018-03-21
申请号：EP11164410.0
申请日：2007-01-12
Applicant: MURATA MANUFACTURING CO., LTD.
Inventor： Dokai, Yuya , Kato, Noboru , Ishino, Satoshi
IPC: H01Q1/50 , G06K19/07 , G06K19/077 , H01Q1/38 , H01Q1/46 , H01Q9/16 , H04B5/02 , H04B5/00 , H01Q1/22
CPC classification number: H01Q1/38 , G06K19/07749 , G06K19/07756 , H01Q1/2208 , H01Q1/2225 , H01Q9/16 , H04B5/0012 , H04B5/0056 , Y02D70/122 , Y02D70/166 , Y02D70/42
Abstract: A wireless IC device comprises a wireless IC chip (5), a power supply circuit board (140) connected to the wireless IC chip and a radiation plate (20), to which the power supply circuit board is adhered or disposed adjacent thereto. The power supply circuit board includes a power supply circuit including a resonant circuit having a predetermined resonant frequency. The radiation plate is arranged to perform at least one of radiation of a transmission signal supplied from the power supply circuit, and receiving of a reception signal and supplying of the reception signal to the power supply circuit. The resonant circuit is a distributed-constant resonant circuit.
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公开(公告)号：EP2226893B8
公开(公告)日：2014-10-08
申请号：EP10166024.9
申请日：2007-01-12
Applicant: MURATA MANUFACTURING CO., LTD.
Inventor： Dokai, Yuya , Kato, Noboru , Ishino, Satoshi
CPC classification number: H01Q1/38 , G06K19/07749 , G06K19/07756 , H01Q1/2208 , H01Q1/2225 , H01Q9/16 , H04B5/0012 , H04B5/0056 , Y02D70/122 , Y02D70/166 , Y02D70/42
Abstract: A wireless IC device comprises a wireless IC chip (5), a power supply circuit board (140) connected to the wireless IC chip and a radiation plate (20), to which the power supply circuit board is adhered or disposed adjacent thereto. The power supply circuit board includes a power supply circuit including a resonant circuit having a predetermined resonant frequency. The radiation plate is arranged to perform at least one of radiation of a transmission signal supplied from the power supply circuit, and receiving of a reception signal and supplying of the reception signal to the power supply circuit. The resonant circuit is a distributed-constant resonant circuit.
Abstract translation: 提供了具有稳定的频率特性的无线IC器件和用于无线IC器件的部件。 无线IC器件包括无线IC芯片（5），其上安装有无线IC芯片（5）的馈电电路板（10），并且包括馈电电路（16），其中馈电电路（16）包括 具有预定谐振频率的谐振电路，以及接合到馈电电路板（10）的下表面的辐射板（20）。 辐射板（20）辐射从供电电路（16）提供的传输信号。 辐射板（20）进一步接收并传送接收信号给供电电路（16）。 谐振电路由包括电感元件（L）和电容元件（C1）和（C2）的LC谐振电路构成。 馈电电路板（10）是刚性多层板或刚性单层板。 馈电电路板（10）通过直流连接，磁耦合或电容耦合与无线IC芯片（5）和辐射板（20）连接。
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公开(公告)号：EP2385579A1
公开(公告)日：2011-11-09
申请号：EP11164408.4
申请日：2007-01-12
Applicant: MURATA MANUFACTURING CO., LTD.
Inventor： Dokai, Yuya , Kato, Noboru , Ishino, Satoshi
IPC: H01Q1/50 , G06K19/07 , G06K19/077 , H01Q1/38 , H01Q1/46 , H01Q9/16 , H04B5/02 , H04B5/00 , H01Q1/22
CPC classification number: H01Q1/38 , G06K19/07749 , G06K19/07756 , H01Q1/2208 , H01Q1/2225 , H01Q9/16 , H04B5/0012 , H04B5/0056 , Y02D70/122 , Y02D70/166 , Y02D70/42
Abstract: A wireless IC device and a component fora wireless IC device having a stable frequency characteristic are provided.
The wireless IC device includes a wireless IC chip (5) , a power feeding circuit board (10) having the wireless IC chip (5) mounted thereon and including a power feeding circuit (16), where the power feeding circuit (16) includes a resonance circuit having a predetermined resonance frequency, and a radiating plate (20) bonded to a lower surface of the power feeding circuit board (10).
The resonance circuit is composed of an LC resonance circuit including an inductance element (L) and capacitance elements (C1) and (C2). The power feeding circuit board (10) is a rigid multilayer board or a rigid single-layer board. The power feeding circuit board (10) is connected to the wireless IC chip (5) and the radiating plate (20) via DC connection, magnetic coupling, or capacitive coupling.Abstract translation: 提供具有稳定的频率特性的无线IC器件和无线IC器件的部件。 无线IC器件包括无线IC芯片（5），安装有无线IC芯片（5）并且包括供电电路（16）的供电电路板（10），其中供电电路（16）包括 具有预定谐振频率的谐振电路，以及结合到供电电路板（10）的下表面的辐射板（20）。 谐振电路由包括电感元件（L）和电容元件（C1）和（C2）的LC谐振电路组成。 馈电电路板（10）是刚性多层板或刚性单层板。 馈电电路板（10）经由直流连接，磁耦合或电容耦合连接到无线IC芯片（5）和散热板（20）。
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公开(公告)号：EP2375495A1
公开(公告)日：2011-10-12
申请号：EP11164415.9
申请日：2007-01-12
Applicant: MURATA MANUFACTURING CO., LTD.
Inventor： Kato, Noboru , Dokai, Yuya , Ishino, Satoshi
IPC: H01Q1/50 , G06K19/07 , G06K19/077 , H01Q1/38 , H01Q1/46 , H01Q9/16 , H04B5/02 , H04B5/00 , H01Q1/22
CPC classification number: H01Q1/38 , G06K19/07749 , G06K19/07756 , H01Q1/2208 , H01Q1/2225 , H01Q9/16 , H04B5/0012 , H04B5/0056 , Y02D70/122 , Y02D70/166 , Y02D70/42
Abstract: A wireless IC device and a component for a wireless IC device having a stable frequency characteristic are provided.
The wireless IC device includes a wireless IC chip (5), a power feeding circuit board (10) having the wireless IC chip (5) mounted thereon and including a power feeding circuit (16), where the power feeding circuit (16) includes a resonance circuit having a predetermined resonance frequency, and a radiating plate (20) bonded to a lower surface of the power feeding circuit board (10). The resonance circuit is composed of an LC resonance circuit including inductance elements (L1,L2) and capacitance elements (C1) and (C2). The power feeding circuit board (10) is a rigid multilayer board or a rigid single-layer board. The power feeding circuit board (10) is connected to the wireless IC chip (5) and the radiating plate (20) via DC connection, magnetic coupling, or capacitive coupling.Abstract translation: 提供了具有稳定的频率特性的无线IC器件和用于无线IC器件的部件。 无线IC器件包括无线IC芯片（5），其上安装有无线IC芯片（5）的馈电电路板（10），并且包括馈电电路（16），其中馈电电路（16）包括 具有预定谐振频率的谐振电路，以及接合到馈电电路板（10）的下表面的辐射板（20）。 谐振电路由包括电感元件（L1，L2）和电容元件（C1）和（C2）的LC谐振电路构成。 馈电电路板（10）是刚性多层板或刚性单层板。 馈电电路板（10）通过直流连接，磁耦合或电容耦合与无线IC芯片（5）和辐射板（20）连接。
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公开(公告)号：EP2375493A1
公开(公告)日：2011-10-12
申请号：EP11164410.0
申请日：2007-01-12
Applicant: MURATA MANUFACTURING CO., LTD.
Inventor： Dokai, Yuya , Kato, Noboru , Ishino, Satoshi
IPC: H01Q1/50 , G06K19/07 , G06K19/077 , H01Q1/38 , H01Q1/46 , H01Q9/16 , H04B5/02 , H04B5/00 , H01Q1/22
CPC classification number: H01Q1/38 , G06K19/07749 , G06K19/07756 , H01Q1/2208 , H01Q1/2225 , H01Q9/16 , H04B5/0012 , H04B5/0056 , Y02D70/122 , Y02D70/166 , Y02D70/42
Abstract: A wireless IC device and a component for a wireless IC device having a stable frequency characteristic are provided.
The wireless IC device includes a wireless IC chip (5), a power feeding circuit board (150) having the wireless IC chip (5) mounted thereon and including a distributed constant resonant circuit of an inverted F antenna configuration or an inverted L antenna configuration, and a radiating plate (20) magnetically and capacitively coupled to the distributed constant resonant circuit.Abstract translation: 提供了具有稳定频率特性的无线IC器件和用于无线IC器件的部件。 无线IC器件包括无线IC芯片（5），安装有无线IC芯片（5）的馈电电路板（150），并且包括倒F天线配置或倒L天线配置的分布式恒定谐振电路 以及磁性和电容耦合到分布式恒定谐振电路的辐射板（20）。
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