公开(公告)号：EP2704537A1

公开(公告)日：2014-03-05

申请号：EP12777596.3

申请日：2012-02-01

Applicant: NGK Spark Plug Co., Ltd.

Inventor： HASEGAWA, Masami ,  HIRAYAMA, Satoshi ,  KITO, Naoki

IPC: H05K1/02 ,  H05K3/00 ,  H01L23/12

CPC classification number: H05K1/0306 ,  C04B41/0036 ,  H01L23/10 ,  H01L23/13 ,  H01L23/15 ,  H01L23/49805 ,  H01L2224/97 ,  H01L2924/0002 ,  H05K1/14 ,  H05K3/0029 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/403 ,  H05K2201/017 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/0909 ,  H05K2201/09154 ,  H01L2924/00

Abstract: Provided are a wiring substrate including a substrate main body and a metalized layer provided on the front surface of the substrate main body so as to extend along side surfaces thereof, in which a plating film and a brazing material layer covering the surface of the metalized layer are not damaged; a multi-piece wiring substrate array for simultaneously providing a plurality of the wiring substrates; and a method for producing the multi-piece wiring substrate array.
The wiring substrate 1a includes a substrate main body 2 which is formed of a ceramic laminate S and has a rectangular shape in plan view, and which has a front surface 3 and a back surface 4 and has four side surfaces 5, each being located between the front surface 3 and the back surface 4, and having a groove surface 7 located on a side toward the front surface 3 and a fracture surface 6 located on a side toward the back surface 4; and a metalized layer 11 which is formed on the front surface 3 of the substrate main body 2 so as to extend along the four side surfaces 5, and which has a rectangular frame shape in plan view, wherein a horizontal surface 13 of the ceramic laminate S of the substrate main body 2 is exposed between the metalized layer 11 and the groove surface 7 of each side surface 5 of the substrate main body 2.

Abstract translation: 本发明提供一种配线基板，其包括基板主体和设置在该基板主体的前表面上的金属化层，以沿着其侧表面延伸，其中镀覆膜和覆盖该金属化层的表面的钎焊材料层 没有损坏; 多片布线基板阵列，用于同时提供多个布线基板; 以及制造该多件式布线基板阵列的方法。 布线基板1a包括：由陶瓷层叠体S形成的俯视呈矩形形状的基板主体2，其具有前表面3和后表面4，并具有四个侧表面5，每个侧表面位于 前表面3和后表面4，并且具有位于前表面3一侧的凹槽表面7和位于背表面4一侧的断裂表面6; 以及在基板主体2的表面3上沿着四个侧面5延伸而形成的俯视矩形框状的金属化层11，其中，陶瓷层叠体的水平面13 基板主体2的S在金属化层11与基板主体2的各侧面5的槽面7之间露出。

公开(公告)号：EP2712281B1

公开(公告)日：2020-05-13

申请号：EP12785591.4

申请日：2012-02-01

Applicant: NGK Spark Plug Co., Ltd.

Inventor： HASEGAWA, Masami ,  HIRAYAMA, Satoshi ,  KITO, Naoki

IPC: H05K1/02 ,  H05K3/00

公开(公告)号：EP2704537B1

公开(公告)日：2019-07-10

申请号：EP12777596.3

申请日：2012-02-01

Applicant: NGK Spark Plug Co., Ltd.

Inventor： HASEGAWA, Masami ,  HIRAYAMA, Satoshi ,  KITO, Naoki

IPC: H05K3/00 ,  H01L23/10 ,  H01L23/13 ,  H01L23/15 ,  H01L23/498 ,  H05K3/40 ,  C04B41/00 ,  H05K1/03

公开(公告)号：EP2712281A1

公开(公告)日：2014-03-26

申请号：EP12785591.4

申请日：2012-02-01

Applicant: NGK Spark Plug Co., Ltd.

Inventor： HASEGAWA, Masami ,  HIRAYAMA, Satoshi ,  KITO, Naoki

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K1/0306 ,  H05K1/113 ,  H05K3/0044 ,  H05K3/0052 ,  H05K3/381 ,  H05K3/403 ,  H05K2201/0909 ,  H05K2201/09181 ,  H05K2201/09845 ,  H05K2203/107 ,  Y10T29/49124 ,  Y10T428/24479 ,  Y10T428/24612

Abstract: Provided are a wiring substrate having few burrs in the vicinity of a notch located on a side surface of a substrate main body, in which breakage of a conductor layer provided on the inner wall of the notch is suppressed; a multi-piece wiring substrate array for providing a plurality of the wiring substrates; and a method for reliably producing the multi-piece wiring substrate array.
The wiring substrate 1a includes a substrate main body kp which is formed of a plurality of stacked ceramic layers S, which has a rectangular shape in plan view, which has a pair of opposite first and second main surfaces 3 and 2, and which has side surfaces 4 each being located between the paired main surfaces 3 and 2, and having a groove surface 6 located on a side toward the first main surface (back surface) 3 and a fracture surface 5 located between the groove surface 6 and the second main surface 2; and a notch 11 which has a concave shape in plan view, and which is provided on a side surface 4 only on a side toward the first main surface 3 so as to extend in a thickness direction of the side surface 4, wherein, in the side surface 4 having the notch 11, the boundary 7 between the groove surface 6 and the fracture surface 5 has first curved portions R1 on opposite sides of the notch 11, the first curved portions R1 being convex toward the first main surface 3 of the substrate main body kp in side view; and also has a second curved portion R2 on a second-main-surface side of the notch 11, the second curved portion R2 being convex toward the second main surface (front surface) 2 of the substrate main body kp in side view.

Abstract translation: 提供一种布线基板，其在位于基板主体的侧面的凹口附近具有较少的毛刺，其中抑制了设置在凹口内壁上的导体层的断裂; 用于提供多个所述布线基板的多片式布线基板阵列; 以及可靠地制造多片式布线基板阵列的方法。 布线基板1a包括由平面图形成为矩形形状的多个层叠陶瓷层S形成的基板主体kp，该堆叠陶瓷层S具有一对相对的第一主面3和第二主面2，并且具有侧面 表面4位于成对的主表面3和2之间，并且具有位于朝向第一主表面（背面）3的一侧的槽表面6和位于槽表面6和第二主表面之间的断裂表面5 2; 以及在俯视图中具有凹形形状的凹口11，并且仅在侧面4上设置在侧面4的侧面上，以沿着侧面4的厚度方向延伸，其中，在 具有凹口11的侧面4，槽表面6与断裂面5之间的边界7在凹口11的相对侧上具有第一弯曲部分R1，第一弯曲部分R1朝向基底的第一主表面3凸出 主体kp在侧视图; 并且在凹口11的第二主表面侧上还具有第二弯曲部分R2，第二弯曲部分R2在侧视图中朝向基板主体kp的第二主表面（前表面）2凸出。