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1.发明公开AZOLE SILANE COMPOUND, SURFACE TREATMENT SOLUTION, SURFACE TREATMENT METHOD, AND USE THEREOF 审中-公开亚历山大·波多黎各，OBERFLÄCHENBEHANDLUNGSLÖSUNG，OBERFLÄCHENBEHANDLUNGSVERFAHRENUND VERWENDUNG DAVON
公开(公告)号：EP3018137A1
公开(公告)日：2016-05-11
申请号：EP14820454.8
申请日：2014-06-30
发明人： MIURA, Shozo , MURAI, Takayuki , OKUMURA, Naoto , TANIOKA, Miya , KATSUMURA, Masato , YAMAJI, Noriaki
CPC分类号： C07F7/1804 , B32B37/12 , B32B37/14 , B32B2311/12 , B32B2315/02 , B32B2315/08 , B32B2333/04 , B32B2363/00 , B32B2377/00 , B32B2457/08 , C08K5/5442 , C09J5/02 , C09J2400/163 , C09J2400/166 , C09J2400/226 , C09J2400/228 , C09J2433/008 , C09J2463/008 , C09J2479/088 , H05K1/0306 , H05K1/09 , H05K3/28 , H05K3/389 , H05K2201/0154 , H05K2203/124
摘要： Objects are to provide a novel azole silane compound, a synthesis method thereof, and a silane coupling agent containing the azole silane compound as a component, and to provide a surface treatment solution using the azole silane compound, a surface treatment method, and a bonding method of two materials different in the quality of material. The azole silane compound of the present invention is a compound represented by the specific chemical formula (I-1) or (II-1).
摘要翻译： 目的是提供一种新型的吡咯硅烷化合物及其合成方法以及含有唑类硅烷化合物作为成分的硅烷偶联剂，提供使用该唑类硅烷化合物的表面处理溶液，表面处理方法和接合 两种材料的材料质量不同的方法。 本发明的唑类硅烷化合物是由具体化学式（I-1）或（II-1）表示的化合物。
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公开(公告)号：EP4459006A1
公开(公告)日：2024-11-06
申请号：EP22915902.5
申请日：2022-12-22
发明人： YAMAJI, Noriaki , TANIOKA, Miya , KOGA, Tatsuya , IIDA, Shusaku , NAGAMORI, Tatsuya , KATSUMURA, Masato
摘要： The present invention provides a surface treatment liquid that can form an organic film sufficiently excellent in adhesive properties between metal and resin and is also excellent in chemical resistance properties, the surface treatment liquid being excellent in storage stability. The present invention relates to a metal surface treatment liquid for forming an organic film on a metal surface, wherein the surface treatment liquid contains a silane coupling agent and an acid and has a pH of 1.9 or less.
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公开(公告)号：EP4459007A1
公开(公告)日：2024-11-06
申请号：EP22915904.1
申请日：2022-12-22
发明人： YAMAJI, Noriaki , TANIOKA, Miya , KOGA, Tatsuya , IIDA, Shusaku , NAGAMORI, Tatsuya , KATSUMURA, Masato
摘要： The present invention provides an organic film that is sufficiently excellent in adhesive properties between a metal and a resin. The present invention relates to an organic film disposed on a metal surface, wherein the organic film comprises a silane coupling agent, and the organic film has a protrusion protruding to a side opposite to the metal.
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4.发明授权
公开(公告)号：EP2714962B1
公开(公告)日：2015-07-08
申请号：EP12727173.2
申请日：2012-05-23
CPC分类号： H05K1/09 , B23K35/365 , B23K2201/42 , B23K2203/12 , C07D233/56 , C07D235/08 , C07D409/04 , C07D409/06 , C23C22/52 , C23F11/149 , C23F11/165 , H05K1/0346 , H05K3/282 , H05K13/00
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5.发明公开
公开(公告)号：EP2714962A1
公开(公告)日：2014-04-09
申请号：EP12727173.2
申请日：2012-05-23
CPC分类号： H05K1/09 , B23K35/365 , B23K2201/42 , B23K2203/12 , C07D233/56 , C07D235/08 , C07D409/04 , C07D409/06 , C23C22/52 , C23F11/149 , C23F11/165 , H05K1/0346 , H05K3/282 , H05K13/00
摘要： A surface treating composition for copper or a copper alloy comprising an imidazole compound and means for using the composition in the soldering of electronic parts to printed wiring boards are disclosed.
摘要翻译： 公开了一种包含咪唑化合物的铜或铜合金的表面处理组合物和用于将电子部件焊接到印刷线路板上的组合物的装置。
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公开(公告)号：EP4026931A1
公开(公告)日：2022-07-13
申请号：EP20861657.3
申请日：2020-09-01
发明人： YAMAJI, Noriaki , KOGA, Tatsuya , HIRAO, Hirohiko
摘要： The present invention provides a surface treatment liquid for metal having a sufficiently high film-forming property. The present invention relates to a surface treatment liquid for metal comprising an azole silane coupling agent, the surface treatment liquid further comprises (A) an organic acid ion having one to three acidic groups in one molecule; (B) an inorganic acid (or mineral acid) ion; (C) an alkali metal ion and/or an ammonium ion; and (D) a copper ion.
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7.发明授权
公开(公告)号：EP3018137B1
公开(公告)日：2018-10-17
申请号：EP14820454.8
申请日：2014-06-30
发明人： MIURA, Shozo , MURAI, Takayuki , OKUMURA, Naoto , TANIOKA, Miya , KATSUMURA, Masato , YAMAJI, Noriaki
CPC分类号： C07F7/1804 , B32B37/12 , B32B37/14 , B32B2311/12 , B32B2315/02 , B32B2315/08 , B32B2333/04 , B32B2363/00 , B32B2377/00 , B32B2457/08 , C08K5/5442 , C09J5/02 , C09J2400/163 , C09J2400/166 , C09J2400/226 , C09J2400/228 , C09J2433/008 , C09J2463/008 , C09J2479/088 , H05K1/0306 , H05K1/09 , H05K3/28 , H05K3/389 , H05K2201/0154 , H05K2203/124
摘要： Objects are to provide a novel azole silane compound, a synthesis method thereof, and a silane coupling agent containing the azole silane compound as a component, and to provide a surface treatment solution using the azole silane compound, a surface treatment method, and a bonding method of two materials different in the quality of material. The azole silane compound of the present invention is a compound represented by the specific chemical formula (I-1) or (II-1).
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8.发明授权SURFACE TREATING COMPOSITION FOR COPPER AND COPPER ALLOY AND UTILIZATION THEREOF 有权铜及铜合金表面处理组合物及其应用
公开(公告)号：EP2721195B1
公开(公告)日：2015-07-08
申请号：EP12727174.0
申请日：2012-05-23
CPC分类号： B23K1/20 , B01D2252/20473 , B23K1/0016 , B23K1/203 , B23K35/36 , B23K35/3615 , B23K2201/42 , C07D233/64 , C23C22/52 , C23F11/149 , C23F11/165 , H05K1/09 , H05K3/282
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9.发明公开
公开(公告)号：EP2721195A1
公开(公告)日：2014-04-23
申请号：EP12727174.0
申请日：2012-05-23
CPC分类号： B23K1/20 , B01D2252/20473 , B23K1/0016 , B23K1/203 , B23K35/36 , B23K35/3615 , B23K2201/42 , C07D233/64 , C23C22/52 , C23F11/149 , C23F11/165 , H05K1/09 , H05K3/282
摘要： A surface treating composition for copper or a copper alloy comprising an imidazole compound and means for using the composition in the soldering of electronic parts to printed wiring boards are disclosed.
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