公开(公告)号：EP1338584A4

公开(公告)日：2006-12-06

申请号：EP01978916

申请日：2001-10-25

申请人： YAMATAKE CORP

发明人： MASUDA TAKASHI

IPC分类号： C04B37/00 ,  C04B35/111 ,  C09J1/00 ,  C30B30/06 ,  G01L9/00

CPC分类号： C04B35/111 ,  C04B35/01 ,  C04B2235/3217 ,  C04B2235/3409 ,  C04B2235/441 ,  C04B2235/762 ,  C04B2235/763 ,  C04B2235/80 ,  G01L9/0075

摘要： A coating film (102) is formed on a substrate (101) of sapphire by coating the substrate with a jointing material prepared by mixing and dissolving Al(OC2H5) and B(OCH3) into xylene. The substrate (101) is heated to about 450°C and the coating film (102) is irradiated with, e.g., ultraviolet radiation having a wavelength of 172 nm. Thus, the xylene in the coating film (102) is vaporized, and the Al(OC2H5) and B(OCH3) are thermally dissociated. As a result, a jointing material composed of amorphous or η-phase alumina (Al2O3) and amorphous boron oxide (B2O3) is manufactured.

公开(公告)号：EP1403832A4

公开(公告)日：2004-07-28

申请号：EP01947842

申请日：2001-07-04

申请人： YAMATAKE CORP

发明人： MASUDA TAKASHI ,  YOSHIKAWA YASUHIDE

IPC分类号： H02H9/00 ,  G08C19/00

CPC分类号： H02H9/008

摘要： An intrinsically safe explosion−proof sensor circuit is realized through a simple system. An intrinsically safe explosion−proof sensor signal processing circuit is characterized by comprising a sensor section for measuring a physical quantity of an object disposed in a dangerous place and a safety keeping circuit disposed in an explosion−proof case in a no dangerous or a dangerous place and provided with driving and feedback operational amplifier circuits and a current limiting resistor connected in series with each signal line connected with the sensor section and with the output terminal and the negative input terminal of the corresponding operational amplifier. Alternatively, the explosion−proof sensor signal processing circuit is characterized in that blocking capacitors are employed in place of the current limiting resistor.

公开(公告)号：EP0986098A4

公开(公告)日：2006-04-05

申请号：EP99909344

申请日：1999-03-29

申请人： YAMATAKE CORP

发明人： MASUDA TAKASHI

IPC分类号： H01L23/488 ,  H01L21/52

CPC分类号： H01L23/488 ,  H01L24/48 ,  H01L2224/48137 ,  H01L2224/4823 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/15151 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A die-bonding solder material according to the present invention is so arranged as to be an eutectic including tin and gold with such a substantial composition ratio as having the eutectic point with a more content of tin than the content that of gold.

公开(公告)号：EP1329960A4

公开(公告)日：2007-01-24

申请号：EP01970321

申请日：2001-10-01

申请人： YAMATAKE CORP

发明人： MASUDA TAKASHI

IPC分类号： G01L9/12 ,  G01L9/00 ,  G01L9/04 ,  G01L9/06 ,  H01L29/84

CPC分类号： G01L9/04 ,  G01L9/0075 ,  G01L9/06

摘要： A method for manufacturing a pressure sensor which comprises jointing a cover plate (130), which is a plate member made of sapphire, to a pressure sensor tip (110) having a cushioning member (120) fixed thereto by the use of a coating solution prepared by adding titanium dioxide to an aqueous solution of boehmite (AlO(OH)) which is a hydroxymineral of aluminum.

公开(公告)号：EP1327617A4

公开(公告)日：2005-07-27

申请号：EP01970320

申请日：2001-10-01

申请人： YAMATAKE CORP

发明人： MASUDA TAKASHI

IPC分类号： C04B35/645 ,  C04B37/00 ,  C30B33/00 ,  C30B33/06 ,  G01L9/00 ,  C30B30/06 ,  G01L9/12

CPC分类号： C04B37/005 ,  B32B2315/02 ,  C04B35/645 ,  C04B37/006 ,  C04B2235/3217 ,  C04B2235/3218 ,  C04B2235/322 ,  C04B2235/441 ,  C04B2237/064 ,  C04B2237/343 ,  C30B29/16 ,  C30B29/20 ,  C30B33/00 ,  C30B33/06 ,  G01L9/0042 ,  G01L9/0075

摘要： A substrate (101) is coated with an aqueous solution of boehmite (AlO(OH)) which is an aluminum hydroxide to form a coating film (102), and the property of the coating film (102) is modified into alpha -alumina, thereby joining the substrate (101) to a substrate (103).

公开(公告)号：EP0982576A4

公开(公告)日：2007-07-18

申请号：EP99939217

申请日：1999-03-11

申请人： YAMATAKE CORP

发明人： KIHARA TAKASHI ,  ISHIKURA YOSHIYUKI ,  MASUDA TAKASHI

IPC分类号： G01L9/12 ,  G01L9/00 ,  G01P1/02 ,  G01P15/08 ,  G01P15/125 ,  H01L21/60 ,  H01L29/84

CPC分类号： G01P15/125 ,  G01L9/0075 ,  G01P1/023 ,  G01P15/0802 ,  H01L21/76897 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/16235 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15174 ,  H01L2924/30105 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05669

摘要： Pads (24, 25) joined to a connection member are opposed to electrode lead-out holes (4a to 4c). An adhesive (12) having a low wettability with the surfaces of electrodes (1, 3) is used, and the pads (24, 25) are surfaced with a material having a high wettability with the adhesive (12). Thus, the connection member can be firmly joined to the electrodes (1, 3), preventing the short-circuit between the electrodes (1, 3).