公开(公告)号：EP2224444A2

公开(公告)日：2010-09-01

申请号：EP10153156.4

申请日：2010-02-10

申请人： Rohm and Haas Electronic Materials, L.L.C.

发明人： Greer, Edward C. ,  Bu, Lujia

IPC分类号： G11B7/26 ,  G11B7/24

CPC分类号： G11B7/263 ,  G11B7/24038 ,  G11B7/241 ,  G11B7/266 ,  Y10T428/21

摘要： Provided are methods of forming multi-layered optical data storage media which include a high-density data layer, as well as multi-layered optical data storage media that can be formed by such methods.

摘要翻译： 提供了形成包括高密度数据层的多层光学数据存储介质的方法以及可以通过这种方法形成的多层光学数据存储介质。

公开(公告)号：EP2216683A2

公开(公告)日：2010-08-11

申请号：EP10152673.9

申请日：2010-02-04

申请人： Rohm and Haas Electronic Materials, L.L.C.

发明人： Cameron, James F. ,  Sung, Jin Wuk ,  Amara, John P. ,  Prokopowicz, Gregory P. ,  Valei, David A.

IPC分类号： G03F7/09 ,  G03F7/20

CPC分类号： G03F7/091 ,  B05D1/005 ,  B05D3/0254 ,  B05D3/06 ,  B05D5/061 ,  B05D7/54 ,  C08F220/36 ,  C09D5/006 ,  C09D133/12 ,  G03F7/11 ,  G03F7/16 ,  G03F7/20 ,  G03F7/322

摘要： Organic coating compositions, particularly antireflective coating compositions, are provided that comprise that comprise a diene/dienophile reaction product. Preferred compositions of the invention are useful to reduce reflection of exposing radiation from a substrate back into an overcoated photoresist layer and/or function as a planarizing, conformal or via-fill layer.

摘要翻译： 提供有机涂层组合物，特别是抗反射涂层组合物，也包括没有包括服务/亲双烯体的反应产物。 本发明的优选组合物是，以减少从背面基板曝光辐射成外涂光刻胶层和/或作为平面化，保形或通孔填充层的反射是有用的。

公开(公告)号：EP1772482B1

公开(公告)日：2009-06-17

申请号：EP07001282.8

申请日：2005-04-09

申请人： Rohm and Haas Electronic Materials, L.L.C.

发明人： Shelnut, James G. ,  Pugliano, Nicola ,  Moynihan, Matthew L. ,  Zheng, Hai Bin ,  Lundy, Daniel E. ,  Pawlowski, Nathan

IPC分类号： C08K5/00 ,  G03F7/075 ,  C09D183/04 ,  G02B1/04 ,  G02B6/12

CPC分类号： G02B1/045 ,  C09D183/04 ,  C08L83/04 ,  C08L2666/02

公开(公告)号：EP1845416A3

公开(公告)日：2009-05-20

申请号：EP07007293.9

申请日：2007-04-10

申请人： Rohm and Haas Electronic Materials, L.L.C.

发明人： Gallagher, Michael K. ,  Zampini, Anthony ,  Ongayi, Owendi

IPC分类号： G03F7/11 ,  G03F7/09 ,  G03F7/32

CPC分类号： G03F7/11 ,  G03F7/038 ,  G03F7/039 ,  G03F7/091 ,  G03F7/162 ,  G03F7/168 ,  G03F7/20 ,  G03F7/32 ,  G03F7/322 ,  G03F7/38 ,  G03F7/40 ,  H01L21/0275 ,  H01L21/0276

摘要： In a first aspect, methods are provided that comprise : (a) applying a curable composition on a substrate; (b) applying a hardmask composition above the curable composition; (c) applying a photoresist composition layer above the hard mask composition, wherein one or more of the compositions are removed in an ash-free process. In a second aspect, methods are provided that comprise (a) applying an organic composition on a substrate; (b) applying a photoresist composition layer above the organic composition, wherein the organic composition comprises a material that produce an alkaline-soluble group upon thermal and/or radiation treatment. Related compositions also are provided.

公开(公告)号：EP1772901A3

公开(公告)日：2009-04-01

申请号：EP06255157.7

申请日：2006-10-05

申请人： Rohm and Haas Electronic Materials, L.L.C.

发明人： Goela, Jitendra S. ,  Pickering, Michael A. ,  Fahey, James T. ,  Strickland, Melinda S.

IPC分类号： H01L21/687

CPC分类号： H01L21/68735 ,  C23C16/345 ,  C23C16/4581 ,  C30B25/12 ,  H01L21/67306 ,  H01L21/67309 ,  H01L21/68757 ,  H01L21/68785

摘要： The present invention is directed to semiconductor wafer processing to provide semiconductor wafers having reduced defects. More specifically, the present invention is directed to semiconductor wafer processing to provide semicondutor wafers having reduced defects processed in wafer holding articles with reduced surface roughness.

公开(公告)号：EP1467004B1

公开(公告)日：2009-03-11

申请号：EP04251946.2

申请日：2004-04-01

申请人： Rohm and Haas Electronic Materials, L.L.C.

发明人： Beica, Rozalia ,  Brown, Neil D. ,  Wang, Kai

IPC分类号： C25D3/60

CPC分类号： C25D3/60 ,  H01L2224/11

公开(公告)号：EP1646072A3

公开(公告)日：2009-03-04

申请号：EP05256278.2

申请日：2005-10-07

申请人： Rohm and Haas Electronic Materials, L.L.C.

发明人： Cahalen, John P. ,  Rzeznik, Maria Anna ,  Schemenaur, John E. ,  Hariharan, Rajan

IPC分类号： H01L21/02 ,  H01L29/92 ,  H01G4/005 ,  H05K1/16

CPC分类号： H05K1/162 ,  H01G4/005 ,  H01L28/75 ,  H05K3/384 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2203/0723

摘要： Structures including a capacitor dielectric material disposed on the surface of an electrode suitable for use in forming capacitors are disclosed. Methods of forming such structures are also disclosed.
The invention provides a structure including an electrode having first and second surfaces and a capacitor dielectric material disposed on the first surface of the electrode, wherein the first surface of first electrode has an average roughness or Ra value of ≤ 200 nm, an average maximum peak-to-valley height or Rz (din) value of ≤ 2000 nm, and a waviness or W value of ≤ 250 nm.
Also provided by the present invention is a structure including an electrode having first and second surfaces, a barrier layer disposed on the first surface of the elctrode and a capacitor dielectric material disposed on the barrier layer, wherein the barrier layer is an electrodeposited nickel layer and containing

公开(公告)号：EP1813986A3

公开(公告)日：2008-11-05

申请号：EP07250347.7

申请日：2007-01-29

申请人： Rohm and Haas Electronic Materials, L.L.C.

发明人： Vohra, Vaishali Raghu ,  Thackeray, James W. ,  Wayton, Gerald B.

IPC分类号： G03F7/09

CPC分类号： G03F7/11 ,  G03F7/091

摘要： Antireflective underlying coating compositions are provided for use with an overcoated photoresist composition. In one aspect, the coating composition can be crosslinked and comprise one or more components that contain one or more acid-labile groups and/or one or more base-reactive groups that are reactive following crosslinking. In another aspect, underlying coating composition are provided that can be treated to provide a modulated water contact angle. Preferred underlying coating compositions can exhibit enhanced etch rates in plasma etchants. Additional preferred coating compositions can enhance lithographic performance of an associated photoresist composition.

公开(公告)号：EP1978051A1

公开(公告)日：2008-10-08

申请号：EP08251282.3

申请日：2008-04-02

申请人： Rohm and Haas Electronic Materials, L.L.C.

发明人： Reddington, Erik ,  Desmaison, Gonzalo Urrutia ,  Niazimbetova, Zukhra I. ,  Cleary, Donald E. ,  Lefebvre, Mark

IPC分类号： C08G65/00 ,  C08G65/32 ,  C08G65/329 ,  C08G65/333 ,  C08G73/00 ,  C08G73/02 ,  C23C18/00 ,  C23C18/16 ,  C25D3/00 ,  C25D3/38

CPC分类号： C25D3/02 ,  C08G65/3322 ,  C08G65/33306 ,  C08G2650/50 ,  C08G2650/58 ,  C08L71/02 ,  C25D3/32 ,  C25D3/38 ,  C25D3/56

摘要： Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.

摘要翻译： 公开了金属镀覆组合物和方法。 金属电镀组合物提供良好的流平性能和投掷力。

公开(公告)号：EP1970762A1

公开(公告)日：2008-09-17

申请号：EP08250839.1

申请日：2008-03-12

申请人： Rohm and Haas Electronic Materials, L.L.C.

发明人： Cameron, James F.

IPC分类号： G03F7/039 ,  C08K5/43 ,  H01L21/027 ,  H01L21/266 ,  H01L21/60 ,  C08F222/12 ,  C09D5/44

CPC分类号： G03F7/0392 ,  C08F220/10 ,  C08F220/14 ,  C08F220/18 ,  C08F220/30 ,  C08F222/12 ,  C08F2220/301 ,  C08K5/03 ,  C08K5/42 ,  G03F7/0007 ,  G03F7/0397 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  G03F7/40 ,  H01L21/266 ,  H01L24/11 ,  H01L2224/1147 ,  H01L2224/11472 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

摘要： The present invention relates to new polymers that contain phenolic groups spaced from a polymer backbone and photoacid-labile group. Preferred polymers of the invention are useful as a component of chemically-amplified positive-acting resists.

摘要翻译： 本发明涉及含有与聚合物主链和光致酸不稳定基团隔开的酚基的新聚合物。 本发明优选的聚合物可用作化学放大的正性作用抗蚀剂的组分。