公开(公告)号：EP2440684B1

公开(公告)日：2018-10-31

申请号：EP10724759.5

申请日：2010-06-03

Applicant: The Swatch Group Research and Development Ltd.

Inventor： STEINMÜLLER, Detlef ,  STEINMÜLLER, Doris ,  DREXEL, Herwig ,  GHODBANE, Slimane ,  RICHARD, David ,  CUSIN, Pierre

IPC: C23C16/27 ,  C23C16/26 ,  G04D3/00 ,  B81B3/00 ,  C23C16/56

CPC classification number: C23C16/277 ,  B81B3/0008 ,  B81B2201/035 ,  B81C2201/112 ,  C23C16/27 ,  C23C16/56 ,  G04D3/0074 ,  Y10T428/30

Abstract: Method for coating micromechanical components of a micromechanical system, in particular a watch movement, comprising: providing a substrate component to be coated; providing said component with a diamond coating; wherein said diamond coating conductivity is increased in order to reduce dust attraction by the coated component when used in said micromechanical system. Corresponding micromechanical components and systems are also provided.

公开(公告)号：EP2751301A1

公开(公告)日：2014-07-09

申请号：EP12770186.0

申请日：2012-08-31

Applicant: Memsstar Limited

Inventor： O'HARA, Anthony

IPC: C23C16/44

CPC classification number: B81C1/00952 ,  B81C1/0038 ,  B81C2201/112 ,  C23C16/44

Abstract: The present invention describes a deposition method suitable for depositing a coating on a device. The method is particularly suited for depositing a self assembled monolayer (SAM) coating on a micro electro-mechanical structures (MEMS). The method employs carrier gases in order to form a deposition vapour in a process chamber within which the device is located wherein the deposition vapour comprises controlled amounts of a vapour precursor material and a vapour reactant material. Employing the described technique avoids the problematic effects of particulate contamination of the device even when the volumetric ratio of the reactant material to the precursor material is significantly higher than those ratios previously employed in the art. The vapour precursor material can be of a type that provides the MEMS with an anti-stiction coating with the associated vapour reactant material comprising water.

公开(公告)号：EP1781566B1

公开(公告)日：2012-03-14

申请号：EP05726508.4

申请日：2005-06-21

Applicant: ROBERT BOSCH GMBH

Inventor： LÄRMER, Franz ,  REICHENBACH, Ralf

IPC: B81C1/00 ,  B81B3/00

CPC classification number: B81C1/0096 ,  B81B3/0005 ,  B81C2201/112 ,  B81C2201/117

Abstract: The invention relates to a method for depositing a nonstick coating onto the surface of micromechanical structures (5a; 7a) on a substrate (Sub), whereby the material or precursor material to be deposited is supplied to the structures (5a; 7a) in a solvent and transport medium. The solvent and transport medium used is a supercritical CO2 fluid. Deposition of the material or precursor material is brought about by a physical change of state of the CO2 fluid or by a surface reaction between the surface and the precursor material. The inventive method allows to coat the micromechanical structures (5a; 7a) in a cavern (14) or in a cavity after their encapsulation, whereby the material to be deposited is supplied via access channels (15) or perforation holes.

公开(公告)号：EP1381523A1

公开(公告)日：2004-01-21

申请号：EP01975475.3

申请日：2001-09-25

Applicant: California Institute of Technology

Inventor： TAI, Yu Chong,California Institute of Technology ,  YAO, Tze-Jung,California Institute of Technology ,  YANG, Xing,California Institute of Technology

IPC: B44C1/22 ,  B41J2/04 ,  A61B19/00 ,  H01L21/00

CPC classification number: B81B3/001 ,  B81C2201/112

Abstract: An anti stiction structure for cantilever formation technique. In one embodiment, the cantilever (130) includes downwardly extending plurality of legs (131 and 132) which preventing the substrate (100) from sticking to the cantilever. In another embodiment, the polymer cantilever (215) is prevented from sticking to the substrate (200) by at amortized stick layer (205) on the substrate and during the formation of the cantilever, the stick layer is removed later as a sacrificial layer.

公开(公告)号：EP0746013A3

公开(公告)日：1999-10-27

申请号：EP96108733.5

申请日：1996-05-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Wallace, Robert M. ,  Douglas, Monte A.

IPC: H01L21/306 ,  G02B26/08

CPC classification number: B81C1/0096 ,  B08B7/00 ,  B08B7/0021 ,  B81B3/0005 ,  B81C1/00857 ,  B81C2201/112 ,  B81C2201/117 ,  G02B26/0841

Abstract: A method of cleaning and treating a device, including those of the micromechanical (10) and semiconductor type. The surface of a device, such as the landing electrode (22) of a digital micromirror device (10), is first cleaned with a supercritical fluid (SCF) in a chamber (50) to remove soluble chemical compounds, and then maintained in the SCF chamber until and during the subsequent passivation step. Passivants including PFDA and PFPE are suitable for the present invention. By maintaining the device in the SCF chamber, and without exposing the device to, for instance, the ambient of a clean room, organic and inorganic contaminants cannot be deposited upon the cleaned surface prior to the passivation step. The present invention derives technical advantages by providing an improved passivated surface that is suited to extend the useful operation life of devices, including those of the micromechanical type, reducing stiction forces between contacting elements such as a mirror and its landing electrode. The present invention is also suitable for cleaning and passivating other surfaces including a surface of semiconductor wafers, and the surface of a hard disk memory drive.

公开(公告)号：EP2746217B1

公开(公告)日：2016-10-12

申请号：EP13196313.4

申请日：2013-12-09

Applicant: Freescale Semiconductor, Inc.

Inventor： Montez, Ruben B. ,  Steimle, Robert F.

IPC: B81C1/00

CPC classification number: B81B3/0005 ,  B81B2201/0221 ,  B81B2201/0235 ,  B81B2203/0181 ,  B81B2203/06 ,  B81C1/0038 ,  B81C1/00952 ,  B81C2201/0169 ,  B81C2201/112 ,  G01P15/0802 ,  G01P2015/0871 ,  G01P2015/0874

公开(公告)号：EP1381523A4

公开(公告)日：2006-09-06

申请号：EP01975475

申请日：2001-09-25

Applicant: CALIFORNIA INST OF TECHN

Inventor： TAI YU CHONG ,  YAO TZE-JUNG ,  YANG XING

IPC: B81B3/00 ,  B81C1/00 ,  B44C1/22 ,  A61B19/00 ,  B41J2/04 ,  H01L21/00

CPC classification number: B81B3/001 ,  B81C2201/112

Abstract: An anti stiction structure for cantilever formation technique. In one embodiment, the cantilever (130) includes downwardly extending plurality of legs (131 and 132) which preventing the substrate (100) from sticking to the cantilever. In another embodiment, the polymer cantilever (215) is prevented from sticking to the substrate (200) by at amortized stick layer (205) on the substrate and during the formation of the cantilever, the stick layer is removed later as a sacrificial layer.

公开(公告)号：EP1640315A2

公开(公告)日：2006-03-29

申请号：EP05255681.8

申请日：2005-09-14

Applicant: IDC, LLC

Inventor： Sampsell, Jeffrey B.

IPC: B81B3/00 ,  G02B26/08

CPC classification number: B81C1/00944 ,  B81B2201/047 ,  B81C2201/112 ,  B82Y30/00 ,  G02B26/001

Abstract: In various embodiments of the invention, a regenerating protective coating is formed on at least one surface of an interior cavity of a MEMS device 80. Particular embodiments provide a regenerating protective coating 170 on one or more mirror surfaces of an interferometric light modulation device, also known as an iMoD in some embodiments. The protective coating can be regenerated through the addition of heat or energy to the protective coating.

Abstract translation: 在本发明的各种实施例中，再生保护涂层形成在MEMS装置80的内腔的至少一个表面上。具体实施例在干涉式光调制装置的一个或多个镜面上提供再生保护涂层170，也 在一些实施例中称为iMoD。 保护涂层可以通过加热或能量再生到保护涂层上。

公开(公告)号：EP0646246B1

公开(公告)日：1997-03-26

申请号：EP93911119.1

申请日：1993-05-06

Applicant: ANALOG DEVICES, INCORPORATED

Inventor： TSANG, Robert, W., K. ,  CORE, Theresa, A. ,  SHERMAN, Steven, J. ,  BROKAW, A., Paul

IPC: G01P15/08

CPC classification number: B81B3/001 ,  B81C1/00246 ,  B81C2201/014 ,  B81C2201/053 ,  B81C2201/112 ,  B81C2203/0742 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/131 ,  G01P2015/0814

Abstract: The invention comprises a method for fabricating a monolithic chip containing integrated circuitry as well as a suspended polysilicon microstructure. The inventive method comprises 67 processes which are further broken down into approximately 330 steps. The processes and their arrangement allow for compatible fabrication of transistor circuitry and the suspended polysilicon microstructure on the same chip.

公开(公告)号：EP0746013A2

公开(公告)日：1996-12-04

申请号：EP96108733.5

申请日：1996-05-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Wallace, Robert M. ,  Douglas, Monte A.

IPC: H01L21/306 ,  G02B26/08

CPC classification number: B81C1/0096 ,  B08B7/00 ,  B08B7/0021 ,  B81B3/0005 ,  B81C1/00857 ,  B81C2201/112 ,  B81C2201/117 ,  G02B26/0841

Abstract: A method of cleaning and treating a device, including those of the micromechanical (10) and semiconductor type. The surface of a device, such as the landing electrode (22) of a digital micromirror device (10), is first cleaned with a supercritical fluid (SCF) in a chamber (50) to remove soluble chemical compounds, and then maintained in the SCF chamber until and during the subsequent passivation step. Passivants including PFDA and PFPE are suitable for the present invention. By maintaining the device in the SCF chamber, and without exposing the device to, for instance, the ambient of a clean room, organic and inorganic contaminants cannot be deposited upon the cleaned surface prior to the passivation step. The present invention derives technical advantages by providing an improved passivated surface that is suited to extend the useful operation life of devices, including those of the micromechanical type, reducing stiction forces between contacting elements such as a mirror and its landing electrode. The present invention is also suitable for cleaning and passivating other surfaces including a surface of semiconductor wafers, and the surface of a hard disk memory drive.

Abstract translation: 一种清洁和处理包括微机械（10）和半导体类型的装置的方法。 首先在腔室（50）中用超临界流体（SCF）清洁诸如数字微镜装置（10）的着陆电极（22）的装置的表面以除去可溶性化合物，然后保持在 SCF室直到和在随后的钝化步骤期间。 包括PFDA和PFPE的钝化剂适用于本发明。 通过将装置保持在SCF室中，并且不将装置暴露于例如洁净室的环境中，在钝化步骤之前，有机和无机污染物不能沉积在清洁的表面上。 本发明通过提供一种改进的钝化表面来提供技术优点，该钝化表面适于延长包括微机械型的装置的有用使用寿命，从而降低诸如反射镜和其着陆电极的接触元件之间的静摩擦力。 本发明还适用于清洁和钝化包括半导体晶片的表面的其它表面以及硬盘存储器驱动器的表面。