公开(公告)号：EP3277453A1

公开(公告)日：2018-02-07

申请号：EP16719889.4

申请日：2016-03-31

申请人： Alpha Assembly Solutions Inc.

发明人： VENKATAGIRIYAPPA, Ramakrishna Hosur ,  DE AVILA RIBAS, Morgana ,  DAS, Barun ,  SIDDAPPA, Harish Hanchina ,  MUKHERJEE, Sutapa ,  SARKAR, Siuli ,  SINGH, Bawa ,  RAUT, Rahul ,  PANDHER, Ranjit

IPC分类号： B23K1/00 ,  B23K35/00 ,  C08K3/00 ,  C08K3/04 ,  C08K5/00 ,  C08K7/02 ,  C08L83/04 ,  H01L21/00 ,  H01L23/00

CPC分类号： C08K3/04 ,  B23K1/0016 ,  B23K1/20 ,  B23K35/00 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/3602 ,  B23K2101/42 ,  C08K3/013 ,  C08K3/042 ,  C08K5/00 ,  C08K7/02 ,  H01L23/295 ,  H01L23/296 ,  H01L24/11 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/1131 ,  H01L2224/11312 ,  H01L2224/1132 ,  H01L2224/1141 ,  H01L2224/11418 ,  H01L2224/11422 ,  H01L2224/1301 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/13311 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13386 ,  H01L2224/13387 ,  H01L2224/13393 ,  H01L2224/13439 ,  H01L2224/13444 ,  H01L2224/13447 ,  H01L2224/13486 ,  H01L2224/13487 ,  H01L2224/1349 ,  H01L2224/13499 ,  H01L2224/2731 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/2741 ,  H01L2224/27418 ,  H01L2224/27422 ,  H01L2224/27436 ,  H01L2224/27602 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/29311 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29386 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29486 ,  H01L2224/29487 ,  H01L2224/2949 ,  H01L2224/29499 ,  H01L2224/73204 ,  H01L2224/8184 ,  H01L2224/81856 ,  H01L2224/81862 ,  H01L2224/81874 ,  H01L2224/8321 ,  H01L2224/83851 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2924/12041 ,  H01L2924/3841 ,  C08L63/00 ,  C08L83/04 ,  C08K5/092 ,  C08K5/18 ,  C08K5/49 ,  C08L2205/025 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01006 ,  H01L2924/00012 ,  H01L2924/05341 ,  H01L2924/07001 ,  H01L2924/0715 ,  H01L2924/0675 ,  H01L2924/0665 ,  H01L2924/06 ,  H01L2924/01079 ,  H01L2924/053 ,  H01L2924/01102 ,  H01L2924/01103 ,  H01L2924/01109 ,  H01L2924/01009 ,  H01L2924/0503 ,  H01L2924/01005 ,  H01L2924/066 ,  H01L2924/0635 ,  H01L2924/061 ,  H01L2924/05432 ,  H01L2924/04642 ,  H01L2924/05032 ,  H01L2924/05442 ,  H01L2924/0542 ,  H01L2924/0103

摘要： A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein: the organic medium comprises a polymer; the filler comprises one or more of graphene, functionalised graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminium oxide, zinc oxide, aluminium nitride, boron nitride, silver, nano fibres, carbon fibres, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and the composition comprises from 0.001 to 40 wt.% of the filler based on the total weight of the composition.

公开(公告)号：EP2664226A1

公开(公告)日：2013-11-20

申请号：EP11815823.7

申请日：2011-12-20

申请人： Harris Corporation

发明人： RENDEK, Louis Joseph, Jr. ,  WEATHERSPOON, Michael ,  RODRIGUEZ, Casey Philip ,  NICOL, David

IPC分类号： H05K3/34 ,  H01L23/498

CPC分类号： H01L24/83 ,  H01L23/3157 ,  H01L23/49822 ,  H01L23/49894 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/33 ,  H01L24/81 ,  H01L24/94 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/11422 ,  H01L2224/1148 ,  H01L2224/13021 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16237 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06568 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/01327 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/0306 ,  H05K3/281 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/0141 ,  H05K2201/10674 ,  H05K2203/063 ,  Y10T29/49144 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/31721 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/014 ,  H01L2924/00

摘要： A method for making an electronic device includes forming an interconnect layer stack on a rigid wafer substrate having a plurality of patterned electrical conductor layers, a dielectric layer between adjacent patterned electrical conductor layers, and at least one solder pad on an uppermost patterned electrical conductor layer. An LCP solder mask having at least one aperture therein alignable with the at least one solder pad is formed. The LCP solder mask and interconnect layer stack are aligned and laminated together. Solder is positioned in the at least one aperture. At least one circuit component is attached to the at least one solder pad using the solder.