公开(公告)号：EP4434080A2

公开(公告)日：2024-09-25

申请号：EP22817263.1

申请日：2022-11-14

申请人： International Business Machines Corporation

发明人： FAROOQ, Mukta ,  KELLY, James

IPC分类号： H01L21/60 ,  H01L25/065 ,  H01L25/18 ,  H01L23/498 ,  H01L23/48 ,  H01L23/00 ,  H01L25/00

CPC分类号： H01L2224/3222520130101 ,  H01L2224/8300520130101 ,  H01L24/96 ,  H01L2924/1816220130101 ,  H01L2924/181620130101 ,  H01L2224/1210520130101 ,  H01L2224/7320120130101 ,  H01L2224/921220130101 ,  H01L2224/1622720130101 ,  H01L25/0655 ,  H01L25/0652 ,  H01L25/50 ,  H01L2225/0651720130101 ,  H01L2225/0657220130101 ,  H01L2225/0658620130101 ,  H01L25/18 ,  H01L23/49827 ,  H01L2224/9520130101 ,  H01L2224/0410520130101 ,  H01L24/73 ,  H01L2924/1531120130101 ,  H01L2924/1519220130101 ,  H01L2224/2413720130101 ,  H01L24/92 ,  H01L2924/1515320130101 ,  H01L2224/7326720130101 ,  H01L2224/9224420130101 ,  H01L2224/920220130101 ,  H01L24/82 ,  H01L2224/7321720130101 ,  H01L2224/8389620130101 ,  H01L2224/9214420130101 ,  H01L24/24 ,  H01L23/481 ,  H01L2224/21420130101

公开(公告)号：EP4325565A3

公开(公告)日：2024-07-03

申请号：EP23220744.9

申请日：2021-09-13

申请人： INTEL Corporation

发明人： WAIDHAS, Bernd ,  WOLTER, Andreas ,  SEIDEMANN, Georg ,  WAGNER, Thomas

IPC分类号： H01L23/538 ,  H01L21/98 ,  H01L25/065 ,  H01L21/60

CPC分类号： H01L24/96 ,  H01L2224/040120130101 ,  H01L2224/0410520130101 ,  H01L2224/1210520130101 ,  H01L2924/1816220130101 ,  H01L2924/1816120130101 ,  H01L2224/060320130101 ,  H01L2224/7320920130101 ,  H01L2224/1622720130101 ,  H01L2924/1531120130101 ,  H01L24/20 ,  H01L2224/21420130101 ,  H01L2224/8100520130101 ,  H01L2224/13120130101 ,  H01L2224/0822520130101 ,  H01L2224/0814520130101 ,  H01L2224/1614520130101 ,  H01L2224/8000620130101 ,  H01L2924/1910420130101 ,  H01L2224/1626520130101 ,  H01L2224/9212420130101 ,  H01L2224/921220130101 ,  H01L2224/7320120130101 ,  H01L2224/0826520130101 ,  H01L2224/0564720130101 ,  H01L2224/055720130101 ,  H01L2924/1519220130101 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2225/0652420130101 ,  H01L2225/0651320130101 ,  H01L2225/0654120130101 ,  H01L24/73 ,  H01L24/92 ,  H01L2224/8203920130101 ,  H01L24/19 ,  H01L2924/351120130101 ,  H01L23/5385 ,  H01L23/49816 ,  H01L2224/0824520130101 ,  H01L2224/3224520130101 ,  H01L2224/3222520130101 ,  H01L2224/7326720130101 ,  H01L2224/9224420130101 ,  H01L2224/170320130101 ,  H01L2224/1100220130101 ,  H01L24/11 ,  H01L24/13 ,  H01L24/17 ,  H01L25/18 ,  H01L25/105 ,  H01L2225/102920130101 ,  H01L2225/102320130101 ,  H01L2924/38120130101 ,  H01L2224/140320130101 ,  H01L2224/8119320130101 ,  H01L2224/9520130101 ,  H01L2224/1302220130101 ,  H01L2224/1308220130101 ,  H01L2224/9620130101 ,  H01L2224/0555320130101 ,  H01L2224/061220130101 ,  H01L2224/0237520130101 ,  H01L24/14 ,  H01L2224/8139920130101 ,  H01L2224/023920130101 ,  H01L2224/21520130101 ,  H01L2224/1314720130101

摘要： Embodiments disclosed herein include electronic package and methods of forming such packages. In an embodiment, an electronic package comprises a mold layer and a first die embedded in the mold layer. In an embodiment, the first die comprises first pads at a first pitch and second pads at a second pitch. In an embodiment, the electronic package further comprises a second die embedded in the mold layer, where the second die comprises third pads at the first pitch and fourth pads at the second pitch. In an embodiment, a bridge die is embedded in the mold layer, and the bridge die electrically couples the second pads to the fourth pads.