公开(公告)号：EP3981025B1

公开(公告)日：2024-08-28

申请号：EP20753854.7

申请日：2020-06-09

IPC分类号： H01L23/498 ,  H01L21/48

CPC分类号： H01L21/4857 ,  H01L23/49822 ,  H01L23/49833 ,  H01L2924/18120130101 ,  H01L2924/1531120130101 ,  H01L25/10 ,  H01L25/16 ,  H01L25/18 ,  H01L24/16 ,  H01L2224/1622720130101 ,  H01L2224/13120130101 ,  H01L24/05 ,  H01L2224/040120130101 ,  H01L2224/02320130101 ,  H05K3/007 ,  H05K3/0097 ,  H05K2203/02520130101 ,  H05K3/045 ,  H05K3/4614 ,  H05K2203/06120130101 ,  H05K2201/036720130101 ,  H01L2924/38120130101

公开(公告)号：EP3391409B1

公开(公告)日：2024-05-22

申请号：EP16876775.4

申请日：2016-12-16

IPC分类号： H01L23/485 ,  H01L21/48 ,  H01L21/60 ,  H01L25/065

CPC分类号： H01L25/0657 ,  H01L2225/0655520130101 ,  H01L25/50 ,  H01L2225/0651320130101 ,  H01L2225/0659320130101 ,  H01L2224/0823820130101 ,  H01L2224/0823720130101 ,  H01L24/05 ,  H01L24/08 ,  H01L24/80 ,  H01L2224/0554120130101 ,  H01L2224/0555120130101 ,  H01L2224/0555220130101 ,  H01L2224/0557120130101 ,  H01L2224/0557320130101 ,  H01L2224/0557820130101 ,  H01L2224/05620130101 ,  H01L2224/0563920130101 ,  H01L2224/0564420130101 ,  H01L2224/0564720130101 ,  H01L2224/0565520130101 ,  H01L2224/0568420130101 ,  H01L2224/080720130101 ,  H01L2224/0814620130101 ,  H01L2224/8089520130101 ,  H01L2224/8089620130101 ,  H01L2224/0811120130101 ,  H01L2224/0812120130101 ,  H01L2224/0814820130101 ,  H01L2224/8003520130101 ,  H01L2224/8093520130101 ,  H01L2224/0420130101 ,  H01L2224/0566420130101 ,  H01L2224/8001320130101 ,  H01L2224/0512420130101 ,  H01L2224/0507320130101 ,  H01L2224/8001120130101 ,  H01L2224/0560920130101 ,  H01L2224/0561120130101 ,  H01L2224/8081520130101 ,  H01L2224/0568720130101 ,  H01L2224/0568820130101 ,  H01L2224/0341620130101 ,  H01L2224/03520130101 ,  H01L24/03 ,  H01L2224/0360220130101 ,  H01L2224/0361620130101 ,  H01L2224/0346420130101 ,  H01L2224/0361220130101 ,  H01L2224/0515520130101 ,  H01L2924/38120130101 ,  H01L2924/351220130101 ,  H01L2224/0566920130101 ,  H01L2224/0514420130101 ,  H01L2224/803420130101 ,  H01L2224/8098620130101 ,  H01L2224/0556920130101 ,  H01L2224/0814520130101

公开(公告)号：EP3940772B1

公开(公告)日：2024-07-17

申请号：EP20893357.2

申请日：2020-06-15

IPC分类号： H01L23/485 ,  H01L21/60 ,  H01L23/31

CPC分类号： H01L23/3192 ,  H01L24/13 ,  H01L24/11 ,  H01L2224/1308420130101 ,  H01L2224/040120130101 ,  H01L2224/0555820130101 ,  H01L2224/1301820130101 ,  H01L2224/1301720130101 ,  H01L2224/1301620130101 ,  H01L2224/1190320130101 ,  H01L2224/1314720130101 ,  H01L2224/8181520130101 ,  H01L2224/1014520130101 ,  H01L2224/13120130101 ,  H01L2224/0564720130101 ,  H01L2224/0556820130101 ,  H01L2224/0557220130101 ,  H01L2224/034520130101 ,  H01L2224/0516620130101 ,  H01L2224/0508220130101 ,  H01L2224/1146220130101 ,  H01L2224/114720130101 ,  H01L2224/1183120130101 ,  H01L2224/1315520130101 ,  H01L2224/114520130101 ,  H01L2224/116120130101 ,  H01L2224/0391220130101 ,  H01L2224/036120130101 ,  H01L2224/11920130101 ,  H01L24/03 ,  H01L24/05 ,  H01L24/81 ,  H01L2224/130820130101 ,  H01L2224/1365520130101 ,  H01L2224/1307620130101 ,  H01L2924/384120130101 ,  H01L2924/351120130101 ,  H01L2224/1623720130101 ,  H01L2224/1622720130101 ,  H01L2224/1610520130101 ,  H01L2224/1605720130101 ,  H01L2224/1605820130101 ,  H01L2224/0362220130101 ,  H01L2224/0512420130101 ,  H01L2224/0514720130101 ,  H01L2224/0566620130101 ,  H01L2224/0568420130101 ,  H01L2224/1311120130101 ,  H01L2924/38120130101

公开(公告)号：EP3176814B1

公开(公告)日：2024-05-01

申请号：EP16201313.0

申请日：2016-11-30

IPC分类号： H01L21/60 ,  H01L27/146 ,  H01L21/98 ,  H01L23/485 ,  H01L23/544 ,  H01L25/065

CPC分类号： H01L27/14634 ,  H01L2224/1413120130101 ,  H01L2224/811320130101 ,  H01L2224/8194820130101 ,  H01L23/544 ,  H01L23/562 ,  H01L24/06 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0613120130101 ,  H01L2224/8113220130101 ,  H01L2224/8181520130101 ,  H01L2924/35120130101 ,  H01L2924/38120130101 ,  H01L2224/8104820130101 ,  H01L2224/8112220130101 ,  H01L2224/8112920130101 ,  H01L2224/1610520130101 ,  H01L2224/1310920130101 ,  H01L2224/8119420130101 ,  H01L2224/1610820130101 ,  H01L2223/544220130101 ,  H01L2223/5442620130101 ,  H01L2223/5447320130101 ,  H01L2225/0651320130101 ,  H01L2225/0659320130101 ,  H01L27/1469 ,  H01L27/14636

公开(公告)号：EP4406014A1

公开(公告)日：2024-07-31

申请号：EP22777129.2

申请日：2022-08-23

申请人： QUALCOMM INCORPORATED

发明人： LI, Yue ,  LISK, Durodami ,  SUN, Jinying

IPC分类号： H01L23/485 ,  H01L21/60 ,  H01L25/065

CPC分类号： H01L24/02 ,  H01L2224/1622720130101 ,  H01L2224/1314720130101 ,  H01L2224/13120130101 ,  H01L2224/1308220130101 ,  H01L2224/1614620130101 ,  H01L2924/1531120130101 ,  H01L24/14 ,  H01L2224/1413120130101 ,  H01L2224/0512420130101 ,  H01L2224/023920130101 ,  H01L2224/034520130101 ,  H01L2224/0555820130101 ,  H01L2224/0501820130101 ,  H01L2224/039120130101 ,  H01L2224/0616720130101 ,  H01L2224/1413220130101 ,  H01L24/06 ,  H01L2224/040120130101 ,  H01L2224/0613120130101 ,  H01L2224/0613220130101 ,  H01L2224/8181520130101 ,  H01L2224/141120130101 ,  H01L2224/114720130101 ,  H01L24/03 ,  H01L24/11 ,  H01L2224/0554820130101 ,  H01L2224/0500820130101 ,  H01L2224/036120130101 ,  H01L2224/0362220130101 ,  H01L2224/0231320130101 ,  H01L2224/1184920130101 ,  H01L2224/8119120130101 ,  H01L2224/1718120130101 ,  H01L2224/1614520130101 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2225/0651720130101 ,  H01L2225/0651320130101 ,  H01L2225/0656820130101 ,  H01L2924/142120130101 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2924/38120130101 ,  H01L2224/06120130101 ,  H01L2224/0238120130101 ,  H01L2224/0613720130101 ,  H01L2924/1531320130101 ,  H01L2224/023520130101 ,  H01L2224/0616820130101 ,  H01L2224/0616920130101

公开(公告)号：EP4325565A3

公开(公告)日：2024-07-03

申请号：EP23220744.9

申请日：2021-09-13

申请人： INTEL Corporation

发明人： WAIDHAS, Bernd ,  WOLTER, Andreas ,  SEIDEMANN, Georg ,  WAGNER, Thomas

IPC分类号： H01L23/538 ,  H01L21/98 ,  H01L25/065 ,  H01L21/60

CPC分类号： H01L24/96 ,  H01L2224/040120130101 ,  H01L2224/0410520130101 ,  H01L2224/1210520130101 ,  H01L2924/1816220130101 ,  H01L2924/1816120130101 ,  H01L2224/060320130101 ,  H01L2224/7320920130101 ,  H01L2224/1622720130101 ,  H01L2924/1531120130101 ,  H01L24/20 ,  H01L2224/21420130101 ,  H01L2224/8100520130101 ,  H01L2224/13120130101 ,  H01L2224/0822520130101 ,  H01L2224/0814520130101 ,  H01L2224/1614520130101 ,  H01L2224/8000620130101 ,  H01L2924/1910420130101 ,  H01L2224/1626520130101 ,  H01L2224/9212420130101 ,  H01L2224/921220130101 ,  H01L2224/7320120130101 ,  H01L2224/0826520130101 ,  H01L2224/0564720130101 ,  H01L2224/055720130101 ,  H01L2924/1519220130101 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2225/0652420130101 ,  H01L2225/0651320130101 ,  H01L2225/0654120130101 ,  H01L24/73 ,  H01L24/92 ,  H01L2224/8203920130101 ,  H01L24/19 ,  H01L2924/351120130101 ,  H01L23/5385 ,  H01L23/49816 ,  H01L2224/0824520130101 ,  H01L2224/3224520130101 ,  H01L2224/3222520130101 ,  H01L2224/7326720130101 ,  H01L2224/9224420130101 ,  H01L2224/170320130101 ,  H01L2224/1100220130101 ,  H01L24/11 ,  H01L24/13 ,  H01L24/17 ,  H01L25/18 ,  H01L25/105 ,  H01L2225/102920130101 ,  H01L2225/102320130101 ,  H01L2924/38120130101 ,  H01L2224/140320130101 ,  H01L2224/8119320130101 ,  H01L2224/9520130101 ,  H01L2224/1302220130101 ,  H01L2224/1308220130101 ,  H01L2224/9620130101 ,  H01L2224/0555320130101 ,  H01L2224/061220130101 ,  H01L2224/0237520130101 ,  H01L24/14 ,  H01L2224/8139920130101 ,  H01L2224/023920130101 ,  H01L2224/21520130101 ,  H01L2224/1314720130101

摘要： Embodiments disclosed herein include electronic package and methods of forming such packages. In an embodiment, an electronic package comprises a mold layer and a first die embedded in the mold layer. In an embodiment, the first die comprises first pads at a first pitch and second pads at a second pitch. In an embodiment, the electronic package further comprises a second die embedded in the mold layer, where the second die comprises third pads at the first pitch and fourth pads at the second pitch. In an embodiment, a bridge die is embedded in the mold layer, and the bridge die electrically couples the second pads to the fourth pads.