公开(公告)号：EP3811398B1

公开(公告)日：2024-09-04

申请号：EP19823023.7

申请日：2019-06-20

IPC分类号： G01B11/06 ,  H01L21/02 ,  H01L21/66 ,  H01L21/67 ,  H01L21/3213 ,  H01L23/485

CPC分类号： H01L21/67253 ,  H01L21/67046 ,  H01L21/6708 ,  H01L22/26 ,  H01L21/32134 ,  H01L22/12 ,  H01L2224/040120130101 ,  H01L2224/0391220130101 ,  H01L2224/114620130101 ,  H01L2224/114720130101 ,  H01L2224/1184920130101 ,  H01L2224/1147220130101 ,  H01L2224/1301720130101 ,  H01L2224/036120130101 ,  H01L2224/0361420130101 ,  H01L2224/74120130101 ,  H01L24/03 ,  H01L24/11 ,  H01L2224/0520130101 ,  H01L2224/1302220130101 ,  H01L2224/1313920130101 ,  H01L2224/0518420130101 ,  H01L2224/1315520130101 ,  H01L2224/1316420130101 ,  H01L2224/1311620130101 ,  H01L2224/0564720130101 ,  H01L2224/0514720130101 ,  H01L2224/0516620130101 ,  H01L2224/1311120130101 ,  H01L2224/1314720130101 ,  H01L2224/1314420130101 ,  G01B11/06

公开(公告)号：EP3885468B1

公开(公告)日：2024-08-14

申请号：EP19886247.6

申请日：2019-11-19

IPC分类号： C23F1/18 ,  C23F1/02 ,  H01L21/308 ,  H01L21/3213 ,  H01L21/768 ,  H01L23/00

CPC分类号： C23F1/18 ,  H01L21/32134 ,  C23F1/02 ,  H01L21/76898 ,  H01L24/11 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/1302220130101 ,  H01L2224/0361420130101 ,  H01L2224/0516620130101 ,  H01L2224/0564720130101 ,  H01L2224/0507320130101 ,  H01L2224/114720130101 ,  H01L2224/1315520130101 ,  H01L2224/1311120130101 ,  H01L2224/1314420130101 ,  H01L2224/1314720130101 ,  H01L2224/1146220130101 ,  H01L2224/0391220130101 ,  H01L2224/040120130101

公开(公告)号：EP4325565A3

公开(公告)日：2024-07-03

申请号：EP23220744.9

申请日：2021-09-13

申请人： INTEL Corporation

发明人： WAIDHAS, Bernd ,  WOLTER, Andreas ,  SEIDEMANN, Georg ,  WAGNER, Thomas

IPC分类号： H01L23/538 ,  H01L21/98 ,  H01L25/065 ,  H01L21/60

CPC分类号： H01L24/96 ,  H01L2224/040120130101 ,  H01L2224/0410520130101 ,  H01L2224/1210520130101 ,  H01L2924/1816220130101 ,  H01L2924/1816120130101 ,  H01L2224/060320130101 ,  H01L2224/7320920130101 ,  H01L2224/1622720130101 ,  H01L2924/1531120130101 ,  H01L24/20 ,  H01L2224/21420130101 ,  H01L2224/8100520130101 ,  H01L2224/13120130101 ,  H01L2224/0822520130101 ,  H01L2224/0814520130101 ,  H01L2224/1614520130101 ,  H01L2224/8000620130101 ,  H01L2924/1910420130101 ,  H01L2224/1626520130101 ,  H01L2224/9212420130101 ,  H01L2224/921220130101 ,  H01L2224/7320120130101 ,  H01L2224/0826520130101 ,  H01L2224/0564720130101 ,  H01L2224/055720130101 ,  H01L2924/1519220130101 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2225/0652420130101 ,  H01L2225/0651320130101 ,  H01L2225/0654120130101 ,  H01L24/73 ,  H01L24/92 ,  H01L2224/8203920130101 ,  H01L24/19 ,  H01L2924/351120130101 ,  H01L23/5385 ,  H01L23/49816 ,  H01L2224/0824520130101 ,  H01L2224/3224520130101 ,  H01L2224/3222520130101 ,  H01L2224/7326720130101 ,  H01L2224/9224420130101 ,  H01L2224/170320130101 ,  H01L2224/1100220130101 ,  H01L24/11 ,  H01L24/13 ,  H01L24/17 ,  H01L25/18 ,  H01L25/105 ,  H01L2225/102920130101 ,  H01L2225/102320130101 ,  H01L2924/38120130101 ,  H01L2224/140320130101 ,  H01L2224/8119320130101 ,  H01L2224/9520130101 ,  H01L2224/1302220130101 ,  H01L2224/1308220130101 ,  H01L2224/9620130101 ,  H01L2224/0555320130101 ,  H01L2224/061220130101 ,  H01L2224/0237520130101 ,  H01L24/14 ,  H01L2224/8139920130101 ,  H01L2224/023920130101 ,  H01L2224/21520130101 ,  H01L2224/1314720130101

摘要： Embodiments disclosed herein include electronic package and methods of forming such packages. In an embodiment, an electronic package comprises a mold layer and a first die embedded in the mold layer. In an embodiment, the first die comprises first pads at a first pitch and second pads at a second pitch. In an embodiment, the electronic package further comprises a second die embedded in the mold layer, where the second die comprises third pads at the first pitch and fourth pads at the second pitch. In an embodiment, a bridge die is embedded in the mold layer, and the bridge die electrically couples the second pads to the fourth pads.

公开(公告)号：EP3163613B1

公开(公告)日：2024-08-21

申请号：EP16188869.8

申请日：2016-09-15

IPC分类号： H01L23/485 ,  H01L21/60 ,  H01L25/065 ,  H01L23/31 ,  H01L23/433 ,  H01L23/552 ,  H01L21/98

CPC分类号： H01L2224/0556920130101 ,  H01L2224/1300520130101 ,  H01L2224/8101120130101 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/3192 ,  H01L23/4334 ,  H01L21/561 ,  H01L23/552 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/0500820130101 ,  H01L2224/0554820130101 ,  H01L2224/0556720130101 ,  H01L2224/0561120130101 ,  H01L2224/0562420130101 ,  H01L2224/0563920130101 ,  H01L2224/0564420130101 ,  H01L2224/0564720130101 ,  H01L2224/0565520130101 ,  H01L2224/0566420130101 ,  H01L2224/113220130101 ,  H01L2224/114520130101 ,  H01L2224/1145220130101 ,  H01L2224/114620130101 ,  H01L2224/114720130101 ,  H01L2224/1301320130101 ,  H01L2224/1301420130101 ,  H01L2224/1302220130101 ,  H01L2224/1308220130101 ,  H01L2224/1311120130101 ,  H01L2224/1311320130101 ,  H01L2224/1311620130101 ,  H01L2224/1312420130101 ,  H01L2224/1313920130101 ,  H01L2224/1314420130101 ,  H01L2224/1314720130101 ,  H01L2224/1315520130101 ,  H01L2224/1318420130101 ,  H01L2224/1605720130101 ,  H01L2224/1623820130101 ,  H01L2224/3224520130101 ,  H01L2224/7325320130101 ,  H01L2224/8102420130101 ,  H01L2224/8119120130101 ,  H01L2224/8181520130101 ,  H01L2224/9420130101 ,  H01L2224/9720130101 ,  H01L2924/384120130101 ,  H01L2224/1316620130101 ,  H01L23/49827 ,  H01L2924/18120130101 ,  H01L25/0655

公开(公告)号：EP4388584A1

公开(公告)日：2024-06-26

申请号：EP22753965.7

申请日：2022-07-20

申请人： QUALCOMM INCORPORATED

发明人： MA, Lei ,  ZHANG, Wenyue Lydia ,  SCUDERI, Antonino ,  PEATMAN, William Clinton Burling

IPC分类号： H01L23/367 ,  H01L29/737

CPC分类号： H01L23/3677 ,  H01L2224/1308220130101 ,  H01L2224/1314720130101 ,  H01L2224/13120130101 ,  H01L2224/1302220130101 ,  H01L2224/1451920130101 ,  H01L24/13 ,  H01L2224/040120130101 ,  H01L2224/130220130101