公开(公告)号：EP2492956A1

公开(公告)日：2012-08-29

申请号：EP10824628.1

申请日：2010-10-13

申请人： Sumitomo Bakelite Co., Ltd.

发明人： MEURA, Toru ,  NIKAIDO, Hiroki ,  MAEJIMA, Kenzou ,  ISHIMURA, Yoji ,  YOSHIDA, Kenji

IPC分类号： H01L21/60 ,  H01L21/02 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18

CPC分类号： H01L24/81 ,  C08L63/00 ,  C09D163/00 ,  H01L24/75 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/13023 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/29191 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/7511 ,  H01L2224/75283 ,  H01L2224/7531 ,  H01L2224/7598 ,  H01L2224/81193 ,  H01L2224/81209 ,  H01L2224/8121 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83209 ,  H01L2224/83801 ,  H01L2224/83855 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06565 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01055 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/181 ,  Y10T29/41 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05552

摘要： Disclosed is a method of manufacturing an electronic device, the method includes obtaining a stack (4) of the first electronic component (1) and the second electronic component (2), while placing a resin layer (3) which contains a flux-active compound and a thermosetting resin, between the first terminals (11) and the second terminals (21); bonding the first terminals (11) and the second terminals (21) with solder, by heating the stack (4) at a temperature not lower than the melting point of solder layers (112) on the first terminals (11), while pressurizing the stack (4) using a fluid; and curing the resin layer (3), wherein in the process of bonding the first terminals (11) and the second terminals (21) with solder, the duration from the point of time immediately after the start of heating of the stack (4), up to the point of time when the temperature of the stack (4) reaches the melting point of the solder layers (112), is set to 5 seconds or longer, and 15 minutes or shorter.

摘要翻译： 本发明公开了制造电子器件的方法，该方法包括获取一个堆（4）在第一电子部件（1）和第二电子元件（2），同时将一个树脂层（3），其含有一个助熔剂活性 化合物和热固性树脂，所述第一端子（11）和第二端子（21）之间; 接合第一端子（11）和第二端子（21）与焊料，通过在不低于所述第一端子（11）焊料层（112）的熔点低的温度下加热所述堆组（4），而加压 堆组（4），使用的流体; 并固化树脂层（3），在栈中的加热开始后，立即从所述时间点处的第一端子（11）和第二端子（21）与，持续时间结合的过程worin焊料（4） ，最多的时间点直到堆栈（4）的温度达到焊料层的熔点（112）被设置为5秒或更长，15分钟或更短。

公开(公告)号：EP3061125A1

公开(公告)日：2016-08-31

申请号：EP14793344.4

申请日：2014-10-01

申请人： Raytheon Company

发明人： GERBER, Kenneth, Allen ,  GETTY, Jonathan ,  RAMIREZ, Aaron, M. ,  MILLER, Scott, S.

IPC分类号： H01L21/603 ,  H01L21/67 ,  H01L27/146

CPC分类号： H01L31/0203 ,  H01L24/26 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L27/144 ,  H01L27/14634 ,  H01L27/1465 ,  H01L27/1469 ,  H01L2224/16145 ,  H01L2224/75101 ,  H01L2224/81193 ,  H01L2224/81209 ,  H01L2224/8182 ,  H01L2924/351

摘要： A method for bonding a first semiconductor body (10) having a plurality of electromagnetic radiation detectors to a second semiconductor body (14) having read out integrated circuits for the detectors. The method includes: aligning electrical contacts (17) for the plurality of electromagnetic radiation detectors with electrical contacts (18) of the read out integrated circuits; tacking the aligned electrical contacts for the plurality of electromagnetic radiation detectors with electrical contacts of the read out integrated circuits to form an intermediate stage structure; packaging the intermediate stage structure into a vacuum sealed electrostatic shielding container (22) having flexible walls; inserting the package with the intermediate stage structure therein into an isostatic pressure chamber (24); and applying the isostatic pressure to the intermediate stage structure through walls of the container. The container includes a stand-off to space walls of the container from edges of the first semiconductor body.

公开(公告)号：EP1139410A3

公开(公告)日：2003-09-24

申请号：EP01103502.9

申请日：2001-02-15

申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

发明人： Tsukamoto, Masahide

IPC分类号： H01L21/56 ,  H01L21/60

CPC分类号： H01L24/75 ,  H01L21/563 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75315 ,  H01L2224/7598 ,  H01L2224/81209 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/284 ,  H05K3/303 ,  H05K2203/0278 ,  H05K2203/085 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53191 ,  H01L2924/00 ,  H01L2224/05599

摘要： Bump components mounted on a circuit board on a supporting substrate is covered with a flexible separation wall. A pressure difference is provided between the inner and outer sides of the separation wall and thus the bump components are pressed against the circuit board. When heating is carried out in this state, the bump components and the circuit board are connected with a conductive adhesive or solder. During the heating, the circuit board is not deformed. Therefore, a bump-component mounted body can be manufactured with high yield.

公开(公告)号：EP2455965A1

公开(公告)日：2012-05-23

申请号：EP10799595.3

申请日：2010-07-09

申请人： Sumitomo Bakelite Company Limited

发明人： MAEJIMA, Kenzou ,  KATSURAYAMA, Satoru ,  MEURA, Toru

IPC分类号： H01L21/60

CPC分类号： C09D163/00 ,  H01L21/563 ,  H01L24/13 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81091 ,  H01L2224/81093 ,  H01L2224/81097 ,  H01L2224/81121 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81204 ,  H01L2224/81209 ,  H01L2224/81211 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/8349 ,  H01L2224/83862 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/00 ,  H01L2924/3512

摘要： Provided is a method for manufacturing an electronic component by using a solder joining method for bonding a first electronic component having a metal electrode for connection purposes with a second electronic component having a solder electrode for connection purposes, the method comprising the steps (i) to (iv) in this order: (i) forming a resin layer containing a thermosetting resin on at least one of the solder joint surfaces of said first electronic component and said second electronic component; (ii) positioning, after the formation of said resin layer containing a thermosetting resin, said metal electrode for connection purposes of said first electronic component and said solder electrode for connection purposes of said second electronic component to face each other, heating said positioned electrodes at a temperature lower than the melting point of said solder of said solder electrode for connection purposes and applying pressure, and thereby bringing said metal electrode for connection purposes and said solder electrode for connection purposes into contact; (iii) heating said first electronic component and said second electronic component that have been brought into contact at a temperature higher than the melting point of said solder of said solder electrode for connection purposes while applying pressure using a pressurized fluid, and thereby fusion bonding said solder of said solder electrode for connection purposes to said metal electrode for connection purposes; and (iv) heating said resin layer containing a thermosetting resin at a temperature lower than the melting point of said solder of said solder electrode for connection purposes, and thereby curing said resin layer.

摘要翻译： 本发明提供一种电子部件的制造方法，其特征在于，通过使用焊接方法，将具有用于连接用的金属电极的第一电子部件与具有用于连接目的的焊料电极的第二电子部件接合，所述方法包括以下步骤（i）〜 （iv）按照以下顺序：（i）在所述第一电子部件和所述第二电子部件的至少一个焊点表面上形成含有热固性树脂的树脂层; （ii）在形成包含热固性树脂的所述树脂层之后，为了所述第一电子部件和所述焊料电极的连接目的而将所述金属电极定位为用于所述第二电子部件的连接目的彼此面对，将所述定位的电极加热到 用于连接目的的低于所述焊料电极的焊料的熔点的温度并施加压力，从而使用于连接目的的所述金属电极和用于连接目的的所述焊料电极接触; （iii）在使用加压流体施加压力的同时，为了连接目的，在高于所述焊料电极的焊料的熔点的温度下加热所述第一电子部件和所述第二电子部件接触，从而将所述 用于连接目的的所述焊料电极的焊料到所述金属电极用于连接目的; 和（iv）为了连接目的，在低于所述焊料电极的焊料的熔点的温度下加热含有热固性树脂的树脂层，从而固化所述树脂层。

公开(公告)号：EP0444820A2

公开(公告)日：1991-09-04

申请号：EP91301354.6

申请日：1991-02-20

申请人： RAYTHEON COMPANY

发明人： Lehman, George R. ,  Miller, Steven W. ,  Bilski, Stacey M.

IPC分类号： H01L23/66 ,  H01L23/04 ,  H01L25/07

CPC分类号： H01L23/66 ,  H01L2224/45144 ,  H01L2224/75101 ,  H01L2224/81091 ,  H01L2224/81193 ,  H01L2224/81209 ,  H01L2224/8182 ,  H01L2924/16152 ,  H01L2924/3011 ,  H01L2924/00

摘要： A package for electronic components, especially MMIC components, is constructed from layers (12,14,16,18,20)) of ceramic cofired to form an annular piece. Metal pieces (10,22,24) are brazed onto the top and bottom of the annular piece to hermetically seal the package. Certain of the ceramic pieces (12,14,16,18,20) are coated with patterns of conductive material before cofiring. The conductive material forms DC power distribution lines (32A, 32B) to electronic components (28A, 28B) within the package and low loss RF feedthroughs (50A, 50B) into the package.

摘要翻译： 用于电子部件，特别是MMIC部件的包装由共同燃烧以形成环形件的陶瓷层（12,14,16,18,20）构成。 将金属片（10,22,24）钎焊到环形片的顶部和底部上以气密地密封包装。 某些陶瓷片（12,14,16,18,20）在共烧之前涂覆有导电材料的图案。 导电材料形成到封装内的电子部件（28A，28B）和低损耗RF馈通（50A，50B）的直流配电线（32A，32B）。

公开(公告)号：EP1139410A2

公开(公告)日：2001-10-04

申请号：EP01103502.9

申请日：2001-02-15

申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

发明人： Tsukamoto, Masahide

IPC分类号： H01L21/56 ,  H01L21/60

CPC分类号： H01L24/75 ,  H01L21/563 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75315 ,  H01L2224/7598 ,  H01L2224/81209 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/284 ,  H05K3/303 ,  H05K2203/0278 ,  H05K2203/085 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53191 ,  H01L2924/00 ,  H01L2224/05599

摘要： Bump components mounted on a circuit board on a supporting substrate is covered with a flexible separation wall. A pressure difference is provided between the inner and outer sides of the separation wall and thus the bump components are pressed against the circuit board. When heating is carried out in this state, the bump components and the circuit board are connected with a conductive adhesive or solder. During the heating, the circuit board is not deformed. Therefore, a bump-component mounted body can be manufactured with high yield.

摘要翻译： 凸块安装在电路板上的支撑衬底部件覆盖有柔性分隔壁。 压力差在分离壁的内侧和外侧，从而凸块部件被按压在电路板之间提供。 当加热是在该状态下进行时，该凸块部件和所述电路板用导电粘合剂或焊料连接。 在加热过程中，电路板也不会变形。 因此，凸块零部件组装体能够以高成品率地制造。

公开(公告)号：EP0444820A3

公开(公告)日：1992-07-08

申请号：EP91301354.6

申请日：1991-02-20

申请人： RAYTHEON COMPANY

发明人： Lehman, George R. ,  Miller, Steven W. ,  Bilski, Stacey M.

IPC分类号： H01L23/66 ,  H01L23/04 ,  H01L25/07

CPC分类号： H01L23/66 ,  H01L2224/45144 ,  H01L2224/75101 ,  H01L2224/81091 ,  H01L2224/81193 ,  H01L2224/81209 ,  H01L2224/8182 ,  H01L2924/16152 ,  H01L2924/3011 ,  H01L2924/00

摘要： A package for electronic components, especially MMIC components, is constructed from layers (12,14,16,18,20)) of ceramic cofired to form an annular piece. Metal pieces (10,22,24) are brazed onto the top and bottom of the annular piece to hermetically seal the package. Certain of the ceramic pieces (12,14,16,18,20) are coated with patterns of conductive material before cofiring. The conductive material forms DC power distribution lines (32A, 32B) to electronic components (28A, 28B) within the package and low loss RF feedthroughs (50A, 50B) into the package.

摘要翻译： 用于电子部件，特别是MMIC部件的包装由共同燃烧以形成环形件的陶瓷层（12,14,16,18,20）构成。 将金属片（10,22,24）钎焊到环形片的顶部和底部上以气密地密封包装。 某些陶瓷片（12,14,16,18,20）在共烧之前涂覆有导电材料的图案。 导电材料形成到封装内的电子部件（28A，28B）和低损耗RF馈通（50A，50B）的直流配电线（32A，32B）。