公开(公告)号：EP3148300A1

公开(公告)日：2017-03-29

申请号：EP15186707.4

申请日：2015-09-24

申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

发明人： Weis, Gerald ,  Vockenberger, Christian ,  Sekavcnik, Ronald

IPC分类号： H05K1/18 ,  H05K1/02 ,  H01L23/36

CPC分类号： H01L25/16 ,  H01L23/3677 ,  H01L23/467 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/17 ,  H01L24/19 ,  H01L24/20 ,  H01L25/074 ,  H01L25/105 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/2518 ,  H01L2225/1035 ,  H01L2225/1047 ,  H01L2225/1094 ,  H01L2924/1033 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/1426 ,  H01L2924/1436 ,  H01L2924/153 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19102 ,  H01L2924/19105 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/0212 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/181 ,  H05K1/185 ,  H05K7/20154 ,  H05K2201/10015 ,  H05K2201/10166 ,  Y02P70/611

摘要： In a connection system for electronic components (1) comprising a plurality of insulating layers (2) and conductive layers (3) and further comprising at least one embedded electronic component (4) embedded within at least one of the plurality of insulating layers (2) and conductive layers (3) the at least one embedded electronic component (4) is at least one first transistor having a bulk terminal thereof in thermal contact with a thermal duct (6) comprised of a plurality of vias (7) reaching through at least one of an insulating layer (2) and a conductive layer (3) of the connection system for electronic components (1) and emerging on a first outer surface (8) of the connection system for electronic components (1) under a first surface-mounted component (10).

摘要翻译： 在包括多个绝缘层（2）和导电层（3）的电子部件（1）的连接系统中，还包括嵌入至多个绝缘层（2）中的至少一个中的至少一个嵌入式电子部件（4） ）和导电层（3），所述至少一个嵌入式电子部件（4）是至少一个第一晶体管，其第一晶体管的体积端与热导管（6）热接触，导热管（6）包括多个通孔（7） 用于电子部件（1）的连接系统的绝缘层（2）和导电层（3）中的至少一个并且出现在用于电子部件（1）的连接系统的第一外表面（8）的第一表面 （10）。

公开(公告)号：EP3363048A1

公开(公告)日：2018-08-22

申请号：EP16785621.0

申请日：2016-10-06

申请人： Xilinx, Inc.

发明人： CHAWARE, Raghunandan ,  MAJUMDAR, Amitava ,  O'ROURKE, Glenn ,  SINGH, Inderjit

IPC分类号： H01L25/065 ,  H01L23/48 ,  H01L21/768 ,  H01L23/00

CPC分类号： H01L23/5385 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L22/14 ,  H01L23/3114 ,  H01L23/538 ,  H01L23/5381 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L24/92 ,  H01L24/94 ,  H01L24/96 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/18 ,  H01L2221/68327 ,  H01L2221/68331 ,  H01L2221/68372 ,  H01L2224/03312 ,  H01L2224/0332 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/17181 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/92 ,  H01L2224/94 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/1515 ,  H01L2924/152 ,  H01L2924/153 ,  H01L2924/15311 ,  H01L2224/03 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L21/78 ,  H01L2221/68304 ,  H01L2224/81 ,  H01L21/56 ,  H01L21/304 ,  H01L2224/11 ,  H01L2221/68381 ,  H01L22/00 ,  H01L2224/1181

摘要： Techniques for providing a semiconductor assembly having an interconnect die for die-to-die interconnection, an IC package, a method for manufacturing, and a method for routing signals in an IC package are described. In one implementation, a semiconductor assembly is provided that includes a first interconnect die coupled to a first integrated circuit (IC) die and a second IC die by inter-die connections. The first interconnect die includes solid state circuitry that provides a signal transmission path between the IC dice.