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公开(公告)号：EP4355036A1
公开(公告)日：2024-04-17
申请号：EP23198243.0
申请日：2023-09-19
申请人： InnoLux Corporation
发明人： KAO, Ker-Yih , FAN, Kuang-Ming , YANG, Chia-Lin , YUEH, Jui-Jen , WANG, Ju-Li
CPC分类号： H05K1/0268 , H05K1/141 , H05K1/115 , H05K2201/1037820130101 , H05K2201/019520130101
摘要： Disclosed are a conductive film (100) and a test component (10). A conductive film (100) includes a supporting layer (110), a circuit layer (CL) and a protective layer (150). The supporting layer (110) has a first surface (111) and a second surface (112) opposite to the first surface (111). The supporting layer (110) supports the circuit layer (CL). The circuit layer (CL) includes a first protruding part (120), a second protruding part (130) and a connecting part (140). The first protruding part (120) is disposed on the first surface (111). The second protruding part (130) is disposed on the second surface (112). The connecting part (140) is disposed between the first protruding part (120) and the second protruding part (130). The first protruding part (120) is connected to the second protruding part (130) through the connecting part (140). The protective layer (150) covers the first protruding part (120). The conductive film (100) and the test component (10) of the disclosed embodiments may have a buffering effect or increase the service life.
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公开(公告)号：EP3846283B1
公开(公告)日：2024-05-01
申请号：EP21158778.7
申请日：2018-10-26
CPC分类号： H01Q1/2283 , H01Q1/243 , H05K1/0251 , H05K1/116 , H05K1/144 , H05K2201/04220130101 , H05K2201/0961820130101 , H05K2201/0962720130101 , H05K2201/1037820130101 , H05K1/115 , H05K1/0222
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4.发明公开
公开(公告)号：EP4415486A1
公开(公告)日：2024-08-14
申请号：EP23168106.5
申请日：2023-04-14
发明人： GANGULY, Gautam , KUGEL, Valery , AHMED, Omar , HUTCHINSON, Leif , SU, Peng , TWAROG, Matthew , ARANYOSI, Attila I. , OWEN, David K. , WU, Chang-Hong , HASSANZADEH, Aliaskar , REYNOV, Boris , SAGARWALA, Muhammad
IPC分类号： H05K1/02 , H01L23/498 , H01L23/00 , H05K1/18 , H05K3/34
CPC分类号： H05K2201/1037820130101 , H05K2201/201820130101 , H05K1/0271 , H05K3/3436 , H05K2201/1073420130101 , H05K1/181 , H05K2201/1033320130101 , H05K2201/1070420130101 , H05K2201/1071920130101 , H01L23/49816 , H01L23/562 , H05K1/183 , H05K2201/0904520130101 , H05K2201/0903620130101 , H05K2201/1032520130101
摘要： An apparatus (202), includes a PCB (204), a semiconductor package (102) that includes a substrate (104) and a stiffener (108) with an opening, and at least one connection component (206). The stiffener (108) is disposed on a top surface of the PCB (204). The at least one connection component (206) is configured to connect the PCB (204) to the semiconductor package (102). The at least one connection component (206) may include another PCB (206) that is disposed on the substrate (104) within the opening of the stiffener (108) and on the PCB (204). The at least one connection component may include an array of connectors that are disposed on the substrate within the opening of the stiffener, and may include a socket disposed on the PCB. The at least one connection component may include a BGA that is disposed on the substrate within the opening of the stiffener and on the PCB and on a pedestal portion of a surface of the PCB.
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公开(公告)号：EP4437587A1
公开(公告)日：2024-10-02
申请号：EP22822236.0
申请日：2022-10-28
IPC分类号： H01L23/538 , H01L25/10 , H05K1/14 , H01L25/065 , H01L25/18 , H01L23/00
CPC分类号： H01L25/105 , H01L25/0657 , H01L25/18 , H01L23/5383 , H01L23/5385 , H01L23/5387 , H01L23/5386 , H01L24/16 , H05K1/147 , H01L2224/1622720130101 , H01L2924/1533120130101 , H01L2924/1531120130101 , H01L2924/1519220130101 , H01L2223/667720130101 , H01L2225/0651720130101 , H01L2225/102320130101 , H01L2225/105820130101 , H05K1/144 , H05K2201/04220130101 , H05K2201/1037820130101
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6.发明授权
公开(公告)号：EP3912438B1
公开(公告)日：2024-09-11
申请号：EP20760043.8
申请日：2020-02-10
CPC分类号： H04M1/0202 , H05K1/144 , H05K2201/1037820130101 , H05K2201/04220130101 , H05K2201/1040920130101 , H05K7/142
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公开(公告)号：EP4266837A3
公开(公告)日：2024-06-05
申请号：EP23187766.3
申请日：2017-08-11
申请人： Apple Inc.
发明人： STANLEY, Craig M. , PORTER, Simon K. , SHEERIN, John H. , TRAINER, Glenn K. , DELLA ROSA, Jason C. , HUWE, Ethan L. , MCINTOSH, Sean T. , WANG, Erik L. , STRINGER, Christopher J. , ANDERSON, Molly J. , PARKER, Samuel G. , WU, Meiting , MENDEZ, Javier , LIU, Rong , COUSINS, Benjamin A. , SUN, Yupin , QI, Jun , BRINSFIELD, Jason W.
IPC分类号： H04R1/02 , G06F3/01 , H04R1/26 , H04R1/28 , H04R1/30 , H04R1/40 , H04R3/12 , H04R5/02 , H04R31/00 , H04R9/02
CPC分类号： H04R1/026 , H04R1/26 , H04R1/30 , H04R5/02 , H04R31/006 , H04R2201/40120130101 , H04R2400/1320130101 , H04R2420/0720130101 , H03K17/962 , H05K1/0274 , H05K1/141 , H05K2201/0906320130101 , H05K2201/1010620130101 , H05K2201/1037820130101 , G06F3/0202 , G06F3/041 , G06F3/03547 , H03K2217/96078520130101 , H04R1/025 , H04R1/403 , H04R3/12 , H04R2201/3420130101 , H04R1/2826 , G06F3/044 , H04R9/022 , H04R2201/02820130101
摘要： This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.
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公开(公告)号：EP4424118A1
公开(公告)日：2024-09-04
申请号：EP22797648.7
申请日：2022-10-17
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公开(公告)号：EP4255125A3
公开(公告)日：2024-04-17
申请号：EP23187797.8
申请日：2017-08-11
申请人： Apple Inc.
发明人： STANLEY, Craig M. , PORTER, Simon K. , SHEERIN, John H. , TRAINER, Glenn K. , DELLA ROSA, Jason C. , HUWE, Ethan L. , MCINTOSH, Sean T. , WANG, Erik L. , STRINGER, Christopher J. , ANDERSON, Molly J. , PARKER, Samuel G. , WU, Meiting , MENDEZ, Javier , LIU, Rong , COUSINS, Benjamin A. , SUN, Yupin , QI, Jun , BRINSFIELD, Jason W.
IPC分类号： H04R1/02 , G06F3/01 , H04R1/26 , H04R1/28 , H04R1/30 , H04R1/40 , H04R3/12 , H04R5/02 , H04R31/00 , H04R9/02
CPC分类号： H04R1/026 , H04R1/26 , H04R1/30 , H04R5/02 , H04R31/006 , H04R2201/40120130101 , H04R2400/1320130101 , H04R2420/0720130101 , H03K17/962 , H05K1/0274 , H05K1/141 , H05K2201/0906320130101 , H05K2201/1010620130101 , H05K2201/1037820130101 , G06F3/0202 , G06F3/041 , G06F3/03547 , H03K2217/96078520130101 , H04R1/025 , H04R1/403 , H04R3/12 , H04R2201/3420130101 , H04R1/2826 , G06F3/044 , H04R9/022 , H04R2201/02820130101
摘要： This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.
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