公开(公告)号：EP4294767B1

公开(公告)日：2024-11-06

申请号：EP22707087.7

申请日：2022-02-18

发明人： REINERT, Wolfgang ,  STENCHLY, Vanessa ,  QUENZER, Hans-Joachim ,  KÄHLER, Dirk

IPC分类号： C03B23/035 ,  C03B25/02 ,  C03B40/00 ,  C03C17/06 ,  B81B7/00 ,  B81C1/00 ,  C03C17/00 ,  C03C27/00 ,  H01L25/16 ,  H01L31/0203 ,  H01L33/44 ,  H01L33/48 ,  H01L33/58 ,  H01L33/62 ,  H01S5/02208 ,  H01S5/02257 ,  H01S5/0683

公开(公告)号：EP4379256A3

公开(公告)日：2024-10-30

申请号：EP24167975.2

申请日：2017-06-22

申请人： Laserssel Co., Ltd

发明人： CHOI, Jae Joon ,  KIM, Byung Rock

IPC分类号： H01L21/52 ,  H01L21/268 ,  H01L23/00 ,  H01L21/677 ,  H01L21/60 ,  H01L23/13 ,  H01L25/065 ,  H01L33/48 ,  B60Q1/26 ,  H05K13/00 ,  B23K37/047 ,  H01L21/673 ,  H01L21/68 ,  H05K13/04 ,  H05K13/08 ,  H01L21/67 ,  F21S41/151 ,  F21S41/19 ,  F21S43/14 ,  F21S43/15 ,  F21S43/19

摘要： Disclosed are a laser bonding apparatus and a laser bonding method capable of bonding an electronic component to a three-dimensional structure having a regular or irregular shape in a curved portion such as an automobile tail lamp or a headlamp. The laser bonding apparatus and method for a three-dimensional structure may prevent misalignment and poor bonding of the electronic component with respect to the three-dimensional structure.

公开(公告)号：EP4443503A1

公开(公告)日：2024-10-09

申请号：EP22901767.8

申请日：2022-11-30

申请人： Seoul Viosys Co., Ltd.

发明人： LEE, Chung Hoon ,  BAEK, Yong Hyun ,  MIN, Dae Hong ,  KANG, Ji Hun

IPC分类号： H01L25/075 ,  H01L33/50 ,  H01L33/48 ,  H01L33/62 ,  H01L33/04

CPC分类号： H01L25/075 ,  H01L33/48 ,  H01L33/04 ,  H01L33/50 ,  H01L33/62

摘要： A light-emitting device and a light-emitting module comprising same are provided. The light-emitting device according to an embodiment includes: a first conductivity type semiconductor layer; a second conductivity type semiconductor layer; and an active layer arranged between the first conductivity type semiconductor layer and the second conductivity type semiconductor layer. In operation, the active layer emits light of a first peak wavelength and light of a second peak wavelength, wherein the first peak wavelength is in a range of about 400 nm to about 415 nm, and the second peak wavelength is about 440 nm or more.

公开(公告)号：EP4441118A1

公开(公告)日：2024-10-09

申请号：EP22902028.4

申请日：2022-11-21

申请人： Ticona LLC

发明人： KIM, Young Shin

IPC分类号： C08G63/06 ,  C08K13/02 ,  C08L67/03 ,  H05K3/10 ,  H01Q21/06 ,  H01L33/48 ,  H01B3/02

CPC分类号： C08K3/11 ,  C08K7/10 ,  C08K2201/01620130101 ,  C08K2201/00320130101 ,  C08K2201/00420130101 ,  C08K2201/01920130101 ,  C08K9/12 ,  H01Q1/38 ,  H01L23/66

公开(公告)号：EP4432360A1

公开(公告)日：2024-09-18

申请号：EP22892995.6

申请日：2022-09-06

申请人： LG Electronics Inc. ,  LG Display Co., Ltd.

发明人： CHOI, Wonseok ,  LEE, Sul ,  KIM, Minseok

IPC分类号： H01L27/12 ,  H01L25/075 ,  H01L33/62 ,  H01L33/48

CPC分类号： H01L25/075 ,  H01L33/48 ,  H01L33/62 ,  H01L27/12

摘要： A display device according to an embodiment includes: a substrate; a plurality of assembly lines disposed on the substrate and including first assembly lines and second assembly lines which are alternately arranged; a planarization layer having a plurality of openings which overlap the plurality of assembly lines respectively; a plurality of light-emitting elements disposed in the plurality of openings respectively; and a plurality of conductive connection members disposed in the plurality of openings respectively to electrically connect the plurality of assembly lines and the plurality of light-emitting elements to each other, wherein the planarization layer protrudes more inwardly of the plurality of openings than one end of the respective assembly lines, and one end of the respective assembly lines is exposed from the planarization layer and comes into contact with the plurality of conductive connection members.

公开(公告)号：EP3978904B1

公开(公告)日：2024-09-11

申请号：EP20815038.3

申请日：2020-01-31

IPC分类号： G01N21/25 ,  H01L25/075 ,  H01L33/60 ,  H01L33/48

CPC分类号： G01N2201/062720130101 ,  G01N2201/06420130101 ,  G01N21/255 ,  G01N2201/080620130101 ,  H01L25/0753 ,  H01L33/60 ,  H01L33/486

公开(公告)号：EP4418321A1

公开(公告)日：2024-08-21

申请号：EP23796580.1

申请日：2023-01-25

申请人： Samsung Electronics Co., Ltd.

发明人： HAN, Seungryong ,  KIM, Jaeseok ,  PARK, Jaehoo ,  IM, Sangkyun ,  JUNG, Kilsoo

IPC分类号： H01L27/12 ,  H01L27/15 ,  H01L25/075 ,  G09G3/32 ,  H01L33/48 ,  H01L33/58 ,  H01L33/52

CPC分类号： G09G3/32 ,  H01L25/075 ,  H01L27/12 ,  H01L27/15 ,  H01L33/48 ,  H01L33/52 ,  H01L33/58

摘要： A transparent display module includes: a transparent substrate; a line pattern provided on the transparent substrate in a form of a two-dimensional grid; a plurality of micro-pixel integrated circuits (ICs) provided on the line pattern; a plurality of inorganic light emitting elements provided on the line pattern or the plurality of micro-pixel ICs; a plurality of transparent areas formed in areas in which the line pattern is not provided, and at least one pixel circuit configured to supply a driving current to the plurality of inorganic light emitting elements.

公开(公告)号：EP4413619A1

公开(公告)日：2024-08-14

申请号：EP22888184.3

申请日：2022-10-27

申请人： Avicenatech Corp.

发明人： KALMAN, Robert ,  MA, Yong ,  PEZESHKI, Bardia ,  TSELIKOV, Alexander ,  DANESH, Cameron

IPC分类号： H01L31/12 ,  G02B6/26 ,  H01L23/14 ,  H01L23/15 ,  H01L33/62 ,  H01L33/48

CPC分类号： G02B6/4249 ,  G02B6/4246 ,  G02B6/4214 ,  B32B2457/0020130101 ,  B32B3/08 ,  B32B9/005 ,  H01L31/14 ,  H01L31/16

公开(公告)号：EP3751627B1

公开(公告)日：2024-07-24

申请号：EP20174132.9

申请日：2010-02-23

IPC分类号： H01L33/40 ,  H01L33/38 ,  H01L33/48 ,  H01L33/62 ,  H01L33/46 ,  H01L33/20 ,  H01L33/42 ,  H01L33/22 ,  H01L33/60

CPC分类号： H01L33/20 ,  H01L33/22 ,  H01L33/382 ,  H01L33/42 ,  H01L33/46 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/006620130101 ,  H01L2924/000220130101 ,  H01L33/38 ,  H01L33/405

公开(公告)号：EP4399745A1

公开(公告)日：2024-07-17

申请号：EP22867915.5

申请日：2022-08-31

申请人： Lumileds LLC

发明人： WILDESON, Isaac ,  LOTFI, Hossein ,  BONNE, Ronald ,  LOPEZ, Toni

IPC分类号： H01L27/15 ,  H01L25/075 ,  H01L33/38 ,  H01L33/62 ,  H01L33/44 ,  H01L27/12 ,  H01L33/48

CPC分类号： H01L33/62 ,  H01L27/156 ,  H01L33/385 ,  H01L33/387