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    Semiconductor device
    21.
    发明专利
    Semiconductor device 有权
    半导体器件

    公开(公告)号：JP2008166626A

    公开(公告)日：2008-07-17

    申请号：JP2006356799

    申请日：2006-12-29

    Applicant: Denso Corp ,  株式会社デンソー

    Inventor： OKUMURA TOMOMI ,  SAKAMOTO ZENJI

    IPC: H01L23/48

    CPC classification number: H01L24/32 ,  H01L24/33 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/83385 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

    Abstract: PROBLEM TO BE SOLVED: To prevent the generation of a catching void in a solder part between a second metallic body and a third metallic body in a semiconductor device configured by laminating a first metallic body, a semiconductor element, the second metallic body, and the third metallic body and connecting gaps between their laminated components through solder. SOLUTION: The second metallic body 4 and the third metallic body 5 are laminated through solder so that out of end portions in a soldering surface 4a of the second metallic body 4 forming a square, corner portions 41 of which the distance L1 from the center K of the soldering surface 4a is long are superposed to a solder spread preventing groove 10 and side portions 42 of which the distance L2 from the center K is short are arranged on the inner peripheral side of the solder spread preventing groove 10 without being superposed to the groove 10. COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题：为了防止在通过层压第一金属体，半导体元件，第二金属体，第二金属体和第二金属体构成的半导体器件中在第二金属体和第三金属体之间的焊料部分中产生捕获空隙 和第三金属体，并且通过焊料在它们的层压部件之间连接间隙。 解决方案：第二金属体4和第三金属体5通过焊料层压，使得第二金属体4的焊接表面4a中的端部部分形成正方形，角部41的距离L1距离 焊料表面4a的中心K被叠置在防焊槽10上，并且距离中心K的距离L2短的侧部42被布置在焊料防扩散槽10的内周侧，而不是 叠加到凹槽10.版权所有（C）2008，JPO＆INPIT

    Semiconductor device
    22.
    发明专利
    Semiconductor device 审中-公开
    半导体器件

    公开(公告)号：JP2007141948A

    公开(公告)日：2007-06-07

    申请号：JP2005330342

    申请日：2005-11-15

    Applicant: Denso Corp ,  Toyota Motor Corp ,  トヨタ自動車株式会社 ,  株式会社デンソー

    Inventor： TANAHASHI AKIRA ,  SAKAMOTO ZENJI ,  YOSHIDA TOMOMASA ,  OKADA HIDEKI

    IPC: H01L23/40 ,  B23K35/26 ,  C22C12/00 ,  C22C13/00 ,  C22C13/02

    CPC classification number: H01L2924/0002 ,  H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To suppress warpage caused by a difference of linear expansion coefficient between a semiconductor device-mounted substrate and a heat sink in a semiconductor device wherein a Pb-free solder is used to join the semiconductor mounted-substrate and the heat sink. SOLUTION: An Sn-In alloy, an Sn-Bi alloy, an Sn-Zn alloy, an Sn-Zn-Bi alloy, or In whose solidus temperature becomes 200°C or less is used as a Pb-free solder 4. Thus, the Pb-free solder 4 can be prevented from being warped because of the bimetal effect caused by a difference of linear expansion between a heat sink 2 and DBA substrates 1a and 1b after the Pb-free solder 4 is melted and cooled later. Therefore, the occurrence of warpage exceeding the tolerance of warpage can be prevented. COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题：为了抑制半导体器件安装基板和半导体器件中的散热器之间的线膨胀系数的差异引起的翘曲，其中使用无铅焊料来连接半导体安装基板和 散热器。

    解决方案：使用Sn-In合金，Sn-Bi合金，Sn-Zn合金，Sn-Zn-Bi合金或固相线温度为200℃以下的In，作为无铅焊料 因此，无铅焊料4熔融冷却后，由于散热器2与DBA基板1a，1b之间的线膨胀差异引起的双金属效应，可以防止无铅焊料4发生翘曲 后来。 因此，可以防止翘曲超过翘曲公差的发生。 版权所有（C）2007，JPO＆INPIT

    Solder rolling method, and solder rolling mill
    23.
    发明专利
    Solder rolling method, and solder rolling mill 有权
    焊接滚压方法和焊接滚子铣刀

    公开(公告)号：JP2007075863A

    公开(公告)日：2007-03-29

    申请号：JP2005268210

    申请日：2005-09-15

    Applicant: Denso Corp ,  Senju Metal Ind Co Ltd ,  千住金属工業株式会社 ,  株式会社デンソー

    Inventor： HIRANO NAOHIKO ,  TANAHASHI AKIRA ,  SAKAMOTO ZENJI ,  SUKEGAWA SHOJI ,  MUNAKATA OSAMU ,  YOSHIDA KOJIRO ,  WATANABE HIROYUKI ,  KITAURA HIDETOSHI

    IPC: B23K35/40 ,  B21B3/00 ,  B21B28/04

    Abstract: PROBLEM TO BE SOLVED: To solve the problem that a solder is rolled by a rolling mill to obtain a solder material of the predetermined thickness in a process of manufacturing a form solder, oxide powder deposited on the roll of the rolling mill is shifted and adhered to the surface of the solder material, and wet spreading of the solder is not sufficient when soldering is performed by using the form solder made of the soldering material. SOLUTION: In a solder rolling method, the solder is rolled while wiping the surface of a roll of a rolling mill with oxide powder deposited thereon by a wiping material mounted on a pressing device. Further, in the solder rolling mill, pressing components of the pressing device for removing the oxide powder deposited on the roll are an air cylinder, a long screw, a spring or the like, and the wiping material is mounted on the pressing device. COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题为了解决在制造焊料的过程中用轧机轧制焊料以获得预定厚度的焊料材料的问题，沉积在轧机辊上的氧化物粉末是 移动并粘附到焊料的表面，并且当通过使用由焊料制成的焊料进行焊接时，焊料的湿扩散是不够的。 解决方案：在焊接轧制方法中，通过用安装在压制装置上的擦拭材料在其上沉积氧化物粉末的同时擦拭轧机辊的表面来滚动焊料。 此外，在焊料轧制机中，用于除去沉积在辊上的氧化物粉末的加压装置的按压部件是气缸，长螺钉，弹簧等，并且擦拭材料安装在加压装置上。 版权所有（C）2007，JPO＆INPIT

    Brazing method, composite material for brazing and brazed structure
    24.
    发明专利
    Brazing method, composite material for brazing and brazed structure 有权
    BRAZING方法，复合材料的制作和布置结构

    公开(公告)号：JP2006212639A

    公开(公告)日：2006-08-17

    申请号：JP2005024719

    申请日：2005-02-01

    Applicant: Denso Corp ,  Neomax Material:Kk ,  株式会社Neomaxマテリアル ,  株式会社デンソー

    Inventor： HASEGAWA TAKESHI ,  ISHIO MASAAKI ,  KAJIKAWA SHUNJI ,  SAKAMOTO ZENJI ,  HAYASHI TAKAYUKI

    IPC: B23K1/20 ,  B23K1/19 ,  B23K35/30 ,  B23K101/14 ,  B23K103/04 ,  C22C9/06 ,  C22C19/05

    Abstract: PROBLEM TO BE SOLVED: To provide a brazing method which gives a brazed zone having excellent corrosion resistance, to provide a material suitable for its practise, and to provide a brazed structure having excellent corrosion resistance in the brazed zone.
    SOLUTION: The brazing method comprises following steps. A first joining member 1 is formed with a diffusion suppression layer 13 formed of an Ni-Cr alloy comprising 20 to 40% Cr is stacked and formed on a substrate 12 of a steel material 12. On the side of the first joining member 1 facing the side of the above diffusion suppression layer 13, a second joining member 2 is arranged via a brazing filler metal 14 of a Cu-Ni-Sn alloy comprising 10 to 20% Ni and 1.0 to 3.0% Sn, so as to assemble a temporarily assembled body. The temporarily assembled body is held at a temperature of ≥1,170°C so as to melt the brazing filler metal 14, on the melted brazing filler metal, a brazed zone 6 into which Ni atoms and Cr atoms are diffused from the diffusion suppression layer 13 is formed, and the melting point of the brazing filler metal in the brazed zone 6 is raised by the increase of the contents of Ni and Cr, thus the brazed zone 6 is solidified for itself and is thereafter cooled.
    COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题：提供一种钎焊方法，其提供具有优异耐腐蚀性的钎焊区域，以提供适合于其实践的材料，并提供在钎焊区域中具有优异耐腐蚀性的钎焊结构。 解决方案：钎焊方法包括以下步骤。 第一接合构件1形成有由Ni-Cr合金形成的扩散抑制层13，该扩散抑制层13包含20〜40％的Cr层叠并形成在钢材12的基板12上。在第一接合构件1的面对 上述扩散抑制层13的一侧，通过包含10〜20％Ni和1.0〜3.0％Sn的Cu-Ni-Sn合金的钎料14配置第2接合构件2，以便组装临时 组装体。 将临时组装的体保持在≥1,170℃的温度下，熔融钎焊金属上的钎料14，从扩散抑制层13扩散Ni原子和Cr原子的钎焊区6 并且通过Ni和Cr的含量的增加，钎焊区6中的钎料的熔点升高，因此钎焊区6自身固化，然后冷却。 版权所有（C）2006，JPO＆NCIPI

    METHOD FOR MANUFACTURING CORROSION RESISTANT HEAT EXCHANGER
    25.
    发明专利
    METHOD FOR MANUFACTURING CORROSION RESISTANT HEAT EXCHANGER 失效

    公开(公告)号：JP2002028775A

    公开(公告)日：2002-01-29

    申请号：JP2001057725

    申请日：2001-03-02

    Applicant: DENSO CORP

    Inventor： MAEDA AKIHIRO ,  SAKAMOTO ZENJI ,  OBAYASHI SHINKICHI ,  KAJIKAWA SHUNJI

    IPC: F28F9/02 ,  B23K1/00 ,  B23K1/19 ,  B23K1/20 ,  B23K35/00 ,  B23K35/30 ,  B23K35/32 ,  B23K101/14 ,  F02M25/07 ,  F28D1/06 ,  F28D7/16 ,  F28F3/02 ,  F28F21/08

    Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing an inexpensive, highly corrosion resistant heat exchanger formed of stainless steel. SOLUTION: A chromium brazing filler metal layer 21 is formed after applying the Cr electroplating of a plating thickness of 15 μm on both end faces of first and second forming stainless steel plates 1 and 2 alternately stacked on each other in the thickness direction, and then a nickel brazing filler metal layer 22 is formed after applying the Ni-P plating of a plating thickness of 35 μm on the chromium brazing filler metal layer 21. The highly corrosion resistant heat exchanger is manufactured by applying the integral brazing with the chromium brazing filler metal layer 21 and the nickel brazing filler metal layer 22 interposed between the first and second forming plates 1 and 2. A highly corrosion resistant brazing filler metal 31 having an alloy composition consisting of Ni-Cr28-P8, etc., is obtained on both end faces of the first and second forming plates 1 and 2. A fine metal structure in the highly corrosion resistant brazing filler metal 31 can be realized, and generation of cracks in the interface of the metal structure can be reduced.

    Solder paste and soldering packaging method
    26.
    发明专利
    Solder paste and soldering packaging method 有权
    焊膏和焊接包装方法

    公开(公告)号：JP2014117737A

    公开(公告)日：2014-06-30

    申请号：JP2012276041

    申请日：2012-12-18

    Applicant: Nippon Handa Kk ,  ニホンハンダ株式会社 ,  Denso Corp ,  株式会社デンソー

    Inventor： YAMAMOTO MUTSUYUKI ,  ONO MASAFUMI ,  TOMINAGA TAKAYUKI ,  SAKAMOTO ZENJI ,  YAMAMOTO MASAYASU

    IPC: B23K35/363 ,  B23K35/26 ,  C22C13/00 ,  C22C13/02 ,  H01L21/52 ,  H01L23/373 ,  H05K3/34

    Abstract: PROBLEM TO BE SOLVED: To provide a method of packaging electronic parts on a substrate by soldering using a lead-free solder paste which can suppress occurrence of void.SOLUTION: A solder paste contains (A) a powder lead-free Sn-based alloy solder and (B) a liquid or paste flux. The flux is one of (a) an active agent comprising (k1) a hydrogen iodide salt of an organic amine and (k2) a six-membered-ring aromatic or aliphatic monocarboxylic acid or a six-membered-ring aromatic and aliphatic dicarboxylic acid, (b) an active agent comprising (k1) a hydrogen iodide salts of organic amine and (k3) an imidazole compound or its carboxylic acid salt or (c) an active agent comprising (k1) a hydrogen iodide salt of an organic amine, (k2) a six-membered-ring aromatic or aliphatic monocarboxylic acid or a six-membered-ring aromatic and aliphatic dicarboxylic acid and (k3) an imidazole compound or its carboxylic acid salt. A soldering packaging method using the solder paste is also provided.

    Abstract translation: 要解决的问题：提供一种通过使用能够抑制空隙发生的无铅焊膏进行焊接来将电子部件封装在基板上的方法。解决方案：焊膏含有（A）无粉末锡的Sn系合金 焊料和（B）液体或糊状焊剂。 助熔剂是（a）活性剂，其包含（k1）有机胺的碘化氢盐和（k2）六元环芳族或脂族一元羧酸或六元环芳族和脂族二羧酸 ，（b）活性剂，其包含（k1）有机胺的碘化氢盐和（k3）咪唑化合物或其羧酸盐，或（c）活性剂，其包含（k1）有机胺的碘化氢盐， （k2）六元环芳族或脂族一元羧酸或六元环芳族和脂族二羧酸和（k3）咪唑化合物或其羧酸盐。 还提供了使用焊膏的焊接包装方法。

    Laser soldering method
    28.
    发明专利
    Laser soldering method 有权
    激光焊接方法

    公开(公告)号：JP2011029659A

    公开(公告)日：2011-02-10

    申请号：JP2010222557

    申请日：2010-09-30

    Applicant: Denso Corp ,  株式会社デンソー

    Inventor： SUZUKI ICHIRO ,  SAKAMOTO ZENJI ,  TANAHASHI AKIRA ,  OSHIRO MASARU ,  INOMATA SUMITOMO

    IPC: H05K3/34 ,  B23K1/00 ,  B23K1/005 ,  B23K3/06 ,  B23K35/26 ,  B23K35/363 ,  B23K101/42 ,  C22C13/00

    Abstract: PROBLEM TO BE SOLVED: To provide a laser soldering method which improves performance and reliability of soldering.
    SOLUTION: (1) When soldering by laser radiation, an insert position of a lead 12 to a through-hole 15 is detected, and a material of a solder is supplied from a direction of a long distance between the lead 12 and land 14. (2) The lead is passed through the shielding board shielding the laser light, thereafter inserted into the through-hole. (3) The soldering is performed using oval shaped laser light whose size does not expand off from an oval shaped land. (4) A projection length L of the lead from the circuit board is determined so that the reflection light reflected by the lead side face is incident on the land. (5) The wavelength of the laser light is set to a wavelength with lower absorption ratio by the circuit board. (6) A flux-containing solder including distilled and purified rosin or synthetic resin is used.
    COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 要解决的问题：提供提高焊接性能和可靠性的激光焊接方法。 （1）当通过激光辐射焊接时，检测到引线12到通孔15的插入位置，并且从引线12和引线12之间的长距离的方向供给焊料的材料 （2）引线穿过屏蔽板屏蔽激光，然后插入通孔。 （3）使用椭圆形的激光进行焊接，其尺寸不会从椭圆形的焊盘伸出。 （4）确定来自电路板的引线的突出长度L，使得由引线侧面反射的反射光入射到焊盘上。 （5）通过电路板将激光的波长设定为具有较低吸收率的波长。 （6）使用含有蒸馏精制松香或合成树脂的含助焊剂的焊剂。 版权所有（C）2011，JPO＆INPIT

    METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    30.
    发明专利
    METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开

    公开(公告)号：JP2003151998A

    公开(公告)日：2003-05-23

    申请号：JP2001351522

    申请日：2001-11-16

    Applicant: DENSO CORP

    Inventor： NOMURA KAZUHITO ,  SAKAMOTO ZENJI ,  HIRAI YASUYOSHI

    IPC: H01L21/52

    Abstract: PROBLEM TO BE SOLVED: To provide a connecting method which reduces occurrence of a void in a center, immediately under the heating region of a semiconductor chip, in a method for manufacturing a semiconductor device. SOLUTION: When soldering 5, before being heated and melted, is arranged at a position avoiding the center of the heating region 6 as shown in Fig. (a), the void will not exists in a region corresponding to the center of the heating region 6 of the semiconductor chip 2, as shown in Fig. (b). Even if voids 7 generate, the generated position of it is only a region corresponding to the position, avoiding the center of the heating region 6 of the semiconductor chip 2. Thus, even if the heating region 6 generates heat, when the semiconductor chip 2 is operated, the center of the heating region 6 of the semiconductor chip 2 is prevented from being heated to a high temperature, due to the existence of the void 7. Thus, at the center of the heating region 6 of the semiconductor chip 2, heat is radiated equally to eliminate a locally high-temperature part. Thus, the deterioration in the characteristics and deterioration of breaking strength are prevented, to secure a long service life.

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