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    Capacitor holder
    41.
    发明专利
    Capacitor holder 有权
    电容器

    公开(公告)号：JP2012049253A

    公开(公告)日：2012-03-08

    申请号：JP2010188509

    申请日：2010-08-25

    Applicant: Kitagawa Ind Co Ltd ,  北川工業株式会社

    Inventor： NAKAMURA TATSUYA

    IPC: H01G2/06 ,  H01G9/08 ,  H01G9/12 ,  H05K1/18

    CPC classification number: H01G2/10 ,  H01G2/06 ,  H01G9/08 ,  H01G9/12 ,  H05K3/301 ,  H05K3/3447 ,  H05K2201/10462 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/10651

    Abstract: PROBLEM TO BE SOLVED: To provide a capacitor holder capable of reducing a gap that should be maintained between adjacent capacitors more significantly than a conventional holder when mounting multiple capacitors in series.SOLUTION: A capacitor holder 1 comprises: a body part 3 formed in a shape into which a tip end of a capacitor 6 can be fitted; and lead parts 5 which are fixed to the body part 3 and can be soldered to a predetermined fitting location. The body part 3 is formed in a shape having: an opening 19 from which a pressure valve 6B provided on the tip end of the capacitor 6 is exposed when the tip end of the capacitor 6 is fitted inside; and an end face abutment portion 13 which abuts in recesses 21 and 23 against an end face of the capacitor in the vicinity of the pressure valve 6B. The lead parts 5 are fixed to the body part 3 at a position opposite to the capacitor 6 across a reference plane, which is a plane including the end face of the capacitor 6 abutting against the end face abutment portion 13.

    Abstract translation: 要解决的问题：提供一种电容器保持器，当电容器串联安装多个电容器时，能够比常规的保持器更显着地减小相邻电容器之间应保持的间隙。 电容器支架1包括：主体部分3，其形成为能够安装电容器6的末端的形状; 以及引导部件5，它们固定到主体部分3上，并且可以被焊接到预定的安装位置。 主体部3形成为：当电容器6的前端装配在内部时，设置在电容器6的前端的压力阀6B露出的开口19; 以及抵靠在压力阀6B附近的电容器的端面上的凹部21和23中的端面抵接部13。 引线部5在与电容器6的与端面抵接部13抵接的端面的平面的基准面上，在与电容器6相反的位置固定在主体部3上。 （C）2012，JPO＆INPIT

    Printed circuit board
    44.
    发明专利
    Printed circuit board 有权
    印刷电路板

    公开(公告)号：JP2008270466A

    公开(公告)日：2008-11-06

    申请号：JP2007110356

    申请日：2007-04-19

    Applicant: Yazaki Corp ,  矢崎総業株式会社

    Inventor： YOSHIDA MASAOKI ,  NAKAYAMA TAKUYA ,  KAMIYAMA KOJI

    IPC: H05K3/34

    CPC classification number: H05K1/116 ,  H05K1/0256 ,  H05K3/3447 ,  H05K2201/09363 ,  H05K2201/09463 ,  H05K2201/0969 ,  H05K2201/09718 ,  H05K2201/10651 ,  H05K2203/1446

    Abstract: PROBLEM TO BE SOLVED: To provide a printed circuit board capable of certainly preventing the damage of a conductor pattern caused by a terminal.
    SOLUTION: A printed circuit board 1a includes a substrate 2, a conductor pattern 6, a through-hole 4, and a non-conductor portion 5. A lead line 22b of a resistor 22 mounted on a printed circuit board 1a is inserted in the through-hole 4. The lead line 22b is bent so that the line protrudes toward the surface 2a of the substrate 2 and the line comes near the surface 2a of the substrate 2. The resistor 22 is attached to the printed circuit board 1a. The non-conductor portion 5 is formed substantially into the shape of a fan which expands with the through-hole 4 at the center as it is closer to the leading end of the lead line 22b. The bent lead line 22b is arranged in the non-conductor portion 5. The non-conductor portion 5 prevents the lead line 22b from coming into contact with the conductor pattern 6 and damaging the conductor pattern 6.
    COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题：提供能够肯定地防止由端子引起的导体图案的损坏的印刷电路板。 解决方案：印刷电路板1a包括基板2，导体图案6，通孔4和非导体部分5.安装在印刷电路板1a上的电阻器22的引线22b是 插入通孔4.引线22b被弯曲，使得线朝向基板2的表面2a突出，并且线接近基板2的表面2a。电阻器22附接到印刷电路板 1A。 非导体部分5基本上形成为随着通孔4随着更靠近引线22b的前端而在中心膨胀的风扇形状。 弯曲引线22b布置在非导体部分5中。非导体部分5防止引线22b与导体图案6接触并损坏导体图案6.版权所有（C） 2009年，日本特许厅和INPIT

    Electronic component and packaging structure thereof, and inverter device
    45.
    发明专利
    Electronic component and packaging structure thereof, and inverter device 有权
    电子元器件及其包装结构及逆变器器件

    公开(公告)号：JP2008227102A

    公开(公告)日：2008-09-25

    申请号：JP2007062401

    申请日：2007-03-12

    Applicant: Tdk Corp ,  Tdk株式会社

    Inventor： SHIRAKAWA YUKIHIKO ,  MIURA IWAO

    IPC: H01G4/228

    CPC classification number: H01G2/06 ,  H01C1/14 ,  H01G4/228 ,  H01G9/008 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/10462 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/611 ,  Y02P70/613

    Abstract: PROBLEM TO BE SOLVED: To provide an electronic component that can be easily surface-mounted to a circuit board, to provide a packaging structure of the electronic component, and to provide an inverter device. SOLUTION: The surface-mount type electronic component 1 comprises: a dielectric element body 12; electrodes 14, 16; extraction conductors 18, 20; and lead terminals 26, 28. The dielectric element body 12 has main surfaces 12a, 12b, and sides 12c-12f. The electrode 14 is formed on the main surface 12a, and the electrode 16 is formed on the main surface 12b, and the electrodes 14, 16 oppose each other. A first part 18a in the extraction conductor 18 is arranged on the side 12d. A first part 20a in the extraction conductor 20 is arranged on the side 12c. A first part 26a in a lead wire 26 is connected to a first part 18a in the extraction conductor 18. A first part 28a in a lead wire 28 is connected to the first part 20a in the extraction conductor 20. COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种能够容易地表面安装到电路板的电子部件，以提供电子部件的封装结构，并提供逆变器装置。 表面安装型电子部件1包括：电介质元件主体12; 电极14,16; 提取导体18,20; 和引线端子26,28。电介质元件主体12具有主表面12a，12b和边12c-12f。 电极14形成在主表面12a上，电极16形成在主表面12b上，电极14,16彼此相对。 提取导体18中的第一部分18a布置在侧面12d上。 提取导体20中的第一部分20a布置在侧面12c上。 引线26中的第一部分26a连接到提取导体18中的第一部分18a。引线28中的第一部分28a连接到提取导体20中的第一部分20a。版权所有（ C）2008，JPO＆INPIT

    Structure of light-emitting diode and its assembling method
    46.
    发明专利
    Structure of light-emitting diode and its assembling method 审中-公开
    发光二极管的结构及其组装方法

    公开(公告)号：JP2008211163A

    公开(公告)日：2008-09-11

    申请号：JP2007158677

    申请日：2007-06-15

    Applicant: Yiguang Electronic Ind Co Ltd ,  億光電子工業股▲ふん▼有限公司

    Inventor： SHEU SHENG-JIA ,  PEI CHIEN-CHANG

    IPC: H01L33/54 ,  H01L33/56 ,  H01L33/62

    CPC classification number: H05K3/326 ,  H01L33/62 ,  H01L2924/0002 ,  H05K3/202 ,  H05K2201/0382 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/10818 ,  H05K2201/1084 ,  Y10T29/41 ,  H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To provide a structure of a light-emitting diode for providing a light-emitting diode device of low cost, high throughput and high yield, whose manufacture process is easy and efficient without the need of any soldering process at all, and an assembling method thereof. SOLUTION: The structure of the light-emitting diode comprises: the light-emitting diode; two leadframes respectively electrically connected to the anode and cathode of the light-emitting diode and respectively provided with a fixing hole; two substrates 108 and 108'; and two protrusive pillars 110a and 110a' respectively arranged on the substrates 108 and 108'. Each of the protrusive pillars 110a and 110a' is inserted into the fixing hole, deformed and then respectively engaged with each of the fixing holes. COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题：为了提供一种用于提供低成本，高产量和高产量的发光二极管器件的发光二极管的结构，其制造工艺容易且高效，而不需要任何焊接工艺 以及其组装方法。

    解决方案：发光二极管的结构包括：发光二极管; 两个引线框分别电连接到发光二极管的阳极和阴极，并分别设有固定孔; 两个基板108和108'; 和分别布置在基板108和108'上的两个突出支柱110a和110a'。 每个突出柱110a和110a'插入到固定孔中，变形，然后分别与每个固定孔接合。 版权所有（C）2008，JPO＆INPIT

    Electronic component and its manufacturing process, electronic component assembly and electronic device
    48.
    发明专利
    Electronic component and its manufacturing process, electronic component assembly and electronic device 有权
    电子元件及其制造工艺，电子元件组件和电子设备

    公开(公告)号：JP2008140792A

    公开(公告)日：2008-06-19

    申请号：JP2006322460

    申请日：2006-11-29

    Applicant: Fujitsu Ltd ,  富士通株式会社

    Inventor： ITO MASAYUKI ,  ISHIKAWA TAKAO ,  NAKAJIMA YUICHI

    IPC: H01L33/62 ,  H05K1/18

    CPC classification number: H05K1/182 ,  H01L33/483 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H05K2201/10106 ,  H05K2201/10651 ,  H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To obtain an electronic component such as a light emitting diode and its manufacturing process, and to obtain an electronic component assembly having that electronic component and an electronic device having that electronic component assembly in which stabilized driving is achieved regardless of the thickness of the substrate.
    SOLUTION: In an electronic component comprising a light emitting diode chip 20 inserted into an opening 16 formed in a substrate 12, and a pair of leads 15 having a supporting portion 15b being bonded thereto and an electrode portion 15a being bonded to a pad 14, the light emitting surface 18 of the light emitting diode chip 20 is located on the side for bonding the electrode portion 15a and the pad 14 when the light emitting diode chip 20 is bonded to the lead 15.
    COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题：为了获得诸如发光二极管的电子部件及其制造方法，并且获得具有该电子部件的电子部件组件和具有实现稳定驱动的电子部件组件的电子设备 不管衬底的厚度如何。 解决方案：在包括插入到形成在基板12中的开口16中的发光二极管芯片20的电子部件和具有与其接合的支撑部分15b的一对引线15和与其接合的电极部分15a 垫14，当发光二极管芯片20接合到引线15时，发光二极管芯片20的发光表面18位于用于接合电极部分15a和焊盘14的一侧。 C）2008，JPO＆INPIT

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