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    Structure of attaching electronic component to board
    5.
    发明专利
    Structure of attaching electronic component to board 审中-公开
    将电子元件连接到板的结构

    公开(公告)号：JP2012134224A

    公开(公告)日：2012-07-12

    申请号：JP2010283149

    申请日：2010-12-20

    Applicant: Panasonic Corp ,  パナソニック株式会社

    Inventor： KINUGASA NORIAKI ,  KONISHI ATSUSHI ,  OGAWA MASAISA

    IPC: H05K1/18

    CPC classification number: H05K3/308 ,  H05K3/3447 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/1078

    Abstract: PROBLEM TO BE SOLVED: To provide a structure of attaching an electronic component to a board which allows for attachment of the electronic component having a round contour to the board at a predetermined position while keeping a predetermined margin of a lead.SOLUTION: An electronic component 11 is attached to a board 30 by inserting a lead 12 of the electronic component 11 into a lead hole 31 of the board 30. The lead 12 has a proximal part 16 extending from an electronic component body 13, a support 17 which is bent from the proximal part 16 and abuts against an electronic component attachment surface 30A of the board 30 over a predetermined length thus supporting the electronic component body 13, and an insertion part 18 which is bent from the support 17 and inserted into the lead hole 31 of the board 30.

    Abstract translation: 要解决的问题：提供一种将电子部件附接到板的结构，其允许在保持预定的引线边缘的同时将具有圆形轮廓的电子部件连接到板上的预定位置。 解决方案：电子部件11通过将电子部件11的引线12插入到板30的引线孔31中而附接到板30。引线12具有从电子部件主体13延伸的近端部16 ，从基部部分16弯曲并与基板30的电子部件安装面30A邻接预定长度，从而支撑电子部件主体13的支撑体17以及从支撑体17弯曲的插入部18， 插入板30的导孔31中。版权所有（C）2012，JPO＆INPIT

    Electronic circuit component mounting structure and manufacturing method thereof
    8.
    发明专利
    Electronic circuit component mounting structure and manufacturing method thereof 审中-公开
    电子电路组件安装结构及其制造方法

    公开(公告)号：JP2009071071A

    公开(公告)日：2009-04-02

    申请号：JP2007238524

    申请日：2007-09-13

    Applicant: Denso Corp ,  株式会社デンソー

    Inventor： YASUDA AKIO ,  YOSHINO MUTSUMI

    IPC: H05K1/02 ,  H01L25/07 ,  H01L25/18

    CPC classification number: H05K1/0263 ,  H01L2924/0002 ,  H05K1/056 ,  H05K1/144 ,  H05K3/202 ,  H05K3/3447 ,  H05K2201/0397 ,  H05K2201/10272 ,  H05K2201/10409 ,  H05K2201/10689 ,  H05K2201/10757 ,  Y10T29/49117 ,  H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To provide an electronic circuit component mounting structure that excellently absorbs thermal stress based upon the difference in coefficient of linear expansion between a printed circuit board and a bus bar. SOLUTION: The bus bar 3A is fixed onto the board with an insulating sheet interposed, and a resin mold IC is joined to the bus bar 3A. The bus bar 3A has a parallel main portion 31 extending in an X direction and a bent end portion 32 bent from the tip of the parallel main portion 31 to reach the printed circuit board 6 and having its tip soldered to the printed circuit board 6. The bent end portion 32 has a first bend portion whose thickness direction matches the X direction, i.e. the length direction of the parallel main portion 31 of the bus bar 3A and a second bend portion whose thickness direction matches a Y direction, i.e. the width direction of the parallel main portion 31 of the bus bar 3A. Consequently, the thermal stress based upon the difference in coefficient of linear expansion between the printed circuit board and bus bar can excellently be absorbed, thereby improving the temperature cycle life of a soldering portion between the printed circuit board 6 and bus bar 3. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种基于印刷电路板和汇流条之间的线性膨胀系数差异优异地吸收热应力的电子电路部件安装结构。 解决方案：母线3A被固定在板上，绝缘片被插入，并且树脂模具IC接合到汇流条3A。 汇流条3A具有沿X方向延伸的平行主体部分31和从平行主体部分31的顶端弯曲的弯曲端部32，以到达印刷电路板6并且其顶端焊接到印刷电路板6。 弯曲端部32具有厚度方向与X方向一致的第一弯曲部，即母线3A的平行主体31的长度方向和厚度方向与Y方向一致的第二弯曲部，即宽度方向 的母线3A的平行主要部分31。 因此，基于印刷电路板和母线之间的线膨胀系数的差异的热应力可以被极好地吸收，从而提高印刷电路板6和母线3之间的焊接部分的温度循环寿命。

    版权所有（C）2009，JPO＆INPIT

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