Composite electronic component, and method of manufacturing same
    1.
    发明专利
    Composite electronic component, and method of manufacturing same 有权
    复合电子元件及其制造方法

    公开(公告)号:JP2007149757A

    公开(公告)日:2007-06-14

    申请号:JP2005338830

    申请日:2005-11-24

    Abstract: PROBLEM TO BE SOLVED: To provide a composite electronic component structured of a composite porous thin material, comprising a porous material with a resin impregnated and excellent in flexibility used as a magnetic substrate.
    SOLUTION: The composite electronic component 100 includes the composite porous material, and a conductive pattern 20 formed on the surface of the composite porous material. The conductive pattern 20 is formed, for example, by selectively removing a metallic foil formed entirely on the surface of the porous material by a method such as etching. The conductive pattern 20 is spiral for example, and has a terminal electrode formed at a terminal end. The composite porous material has a structure in which a porous material body 1 and the metallic foil 4 are laminated. The body 1 is constituted of a particulate structure 2 and a resin phase 3. The particulate structure 2 has a structure in which a plurality of particles P are bonded with one another.
    COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 解决的问题:提供一种由复合多孔薄材料构成的复合电子部件,其包括具有浸渍的树脂的多孔材料和用作磁性基材的柔性优异。 解决方案:复合电子部件100包括复合多孔材料和形成在复合多孔材料的表面上的导电图案20。 导电图案20例如通过选择性地去除通过诸如蚀刻的方法在多孔材料的表面上完全形成的金属箔来形成。 导电图案20例如是螺旋状的,并且在端部形成有端子电极。 复合多孔材料具有层叠多孔质体1和金属箔4的结构。 主体1由颗粒结构2和树脂相3构成。颗粒结构2具有多个颗粒P彼此结合的结构。 版权所有(C)2007,JPO&INPIT

    Electronic component module and laminated substrate for it
    2.
    发明专利
    Electronic component module and laminated substrate for it 审中-公开
    电子元件模块和层叠基板

    公开(公告)号:JP2007019292A

    公开(公告)日:2007-01-25

    申请号:JP2005199816

    申请日:2005-07-08

    Abstract: PROBLEM TO BE SOLVED: To miniaturize capacitors to make a laminated substrate small while keeping good electrical characteristics (higher self-resonance frequency) of inductors in the laminated substrate having the built-in capacitors and inductors.
    SOLUTION: This laminated substrate for an electronic component module includes capacitors C1, C2 and inductors L1, L2 within the laminated substrate having a plurality of wiring layers A1-A6. The capacitors C1, C2 include a first capacitance electrode and a second capacitance electrode opposite to each other through an insulating layer. The first capacitance electrode and at least some of inductor conductors L11, L12, L21, L22 constituting the inductors L1, L2 are provided in the same wiring layer. The first capacitance electrode is provided to be embedded in the insulating layer, forms an electrostatic capacity with the second capacitance electrode, and is thicker than the inductor conductors L11, L12, L21, L22 provided in the same wiring layer. Sometimes, the first capacitance electrode has an area larger than that of the second capacitance electrode when being viewed from the plane.
    COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题:为了使电容器小型化以使层压基板小,同时保持具有内置电容器和电感器的层叠基板中的电感器的良好的电特性(较高的自谐振频率)。 解决方案:该电子部件模块用叠层基板包括具有多个布线层A1-A6的层叠基板内的电容器C1,C2和电感器L1,L2。 电容器C1,C2包括通过绝缘层彼此相对的第一电容电极和第二电容电极。 构成电感器L1,L2的第一电容电极和电感器导体L11,L12,L21,L22的至少一部分设置在同一布线层中。 第一电容电极被设置为嵌入在绝缘层中,与第二电容电极形成静电电容,并且比设置在同一布线层中的电感器导体L11,L12,L21,L22厚。 有时,从平面观察时,第一电容电极的面积大于第二电容电极的面积。 版权所有(C)2007,JPO&INPIT

    Printed-wiring board and electronic component
    3.
    发明专利
    Printed-wiring board and electronic component 审中-公开
    印刷线路板和电子元件

    公开(公告)号:JP2006059999A

    公开(公告)日:2006-03-02

    申请号:JP2004239966

    申请日:2004-08-19

    Abstract: PROBLEM TO BE SOLVED: To provide a printed-wiring board comprising a material having a low dielectric loss tangent, a high glass-transition temperature, high flame retardance hard to increase a dielectric constant and the dielectric loss tangent in a high-humidity environment, and to provide an electronic component. SOLUTION: Each the printed-wiring board and the electronic component comprises an epoxy resin; a polyester comprising an aromaic multiple carboxylic residue, and an aromatic multiple hydroxy compound residue having an aryloxy carbonyl group or an aryl carbonyl oxide group at a molecular chain end; a resin layer composed of at least one of an insulating layer comprising an organic insulating material including a hardening accelerator and a flame retardant, and a dielectric layer further including dielectric powder and a surface preparation agent in the organic insulating material; and at least one conductive element provided at least one of the insulating layer and the dielectric layer of the resin layer, and constituting a capacitor element or an inductor element. COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题:提供一种印刷电路板,其包括具有低介电损耗角正切,高玻璃化转变温度,高阻燃性的材料,难以提高介电常数和介电损耗角正切, 湿度环境,并提供电子元件。 解决方案:印刷电路板和电子部件各自包含环氧树脂; 包含芳香族多元羧酸残基的聚酯和在分子链端具有芳氧基羰基或芳基羰基氧基的芳族多羟基化合物残基; 由包含硬化促进剂和阻燃剂的有机绝缘材料的绝缘层和在有机绝缘材料中还包含电介质粉末和表面处理剂的介电层中的至少一个构成的树脂层; 以及至少一个导电元件,其设置有树脂层的绝缘层和电介质层中的至少一个,并且构成电容器元件或电感器元件。 版权所有(C)2006,JPO&NCIPI

    Inductive device and its manufacturing method
    4.
    发明专利
    Inductive device and its manufacturing method 审中-公开
    电感器件及其制造方法

    公开(公告)号:JP2005276878A

    公开(公告)日:2005-10-06

    申请号:JP2004083904

    申请日:2004-03-23

    Abstract: PROBLEM TO BE SOLVED: To improve the yield of an inductive device wherein mass production is easy, and there is less displacement of a conductor pattern, and an inductance with narrow tolerance is obtained.
    SOLUTION: The inductive device includes a plurality of first main conductors 111 to 118 provided, directly or via an insulating layer, on one principal surface of a core substrate and arranged mutually in parallel; a plurality of second main conductors 121 to 127 provided , directly or via an insulating layer, on the other principal surface of the core substrate and arranged mutually in parallel; and a plurality of crosslinking conductors 132 to 138, 142 to 148 arranged mutually in parallel for connecting the first main conductors 111 to 118 and the second main conductors 121 to 127. The first main conductors 111 to 118 and the second main conductors 121 to 127 are mutually non-parallel, so that it is possible to simplify the pattern shape of the crosslinking conductors, for example, to make its extension direction substantially perpendicular to the one or the other principal surface of the core substrate.
    COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题:为了提高容易生产的电感器件的产率,并且导体图案的位移较小,并且获得具有窄公差的电感。 电感器件包括多个第一主导体111至118,其直接地或经由绝缘层设置在芯基板的一个主表面上并且彼此平行布置; 多个第二主导体121〜127,直接地或经由绝缘层设置在芯基板的另一个主表面上并且彼此平行地布置; 以及多个并联布置的交联导体132至138,142至148,用于连接第一主导体111至118和第二主导体121至127.第一主导体111至118和第二主导体121至127 相互不平行,从而可以简化交联导体的图案形状,例如使其延伸方向基本上垂直于芯基板的一个或另一个主表面。 版权所有(C)2006,JPO&NCIPI

    Substrate having conductor line, its manufacturing method and electronic component

    公开(公告)号:JP2004327612A

    公开(公告)日:2004-11-18

    申请号:JP2003118662

    申请日:2003-04-23

    Abstract: PROBLEM TO BE SOLVED: To reduce the loss of high-frequency current by improving the sectional shape of a conductor line in a substrate.
    SOLUTION: A substrate conductor layer 11 is formed on the main surface of an insulating plate 10, a resist layer 12 is provided on the substrate conductor layer 11, and a resist mask pattern is formed in which the substrate conductor layer 11 of the part for forming the conductor line is exposed. Thereafter, a conductor plating layer 14 is formed by electrolytic plating on the exposed part of the substrate conductor layer 11, the conductor plating layer 14 is formed higher than the resist pattern mask, and the conductor line 2 is formed as a sectional shape having a rounded upper part and no corner. Thereafter, the resist layer 12 is removed, and the unnecessary substrate conductor layer between the conductor lines is removed.
    COPYRIGHT: (C)2005,JPO&NCIPI

    Electronic part and multilayer substrate
    6.
    发明专利

    公开(公告)号:JP2004221572A

    公开(公告)日:2004-08-05

    申请号:JP2003432554

    申请日:2003-12-26

    Abstract: PROBLEM TO BE SOLVED: To provide an electronic part and a multilayer substrate which can sufficiently improve the characteristics of the electronic part. SOLUTION: In the electronic part 10 which comprises compound dielectric layers 10a-10e including an organic insulating material and a dielectric ceramic powder having a specific dielectric constant greater than that of the organic insulating material, and a conductive element portion 13a constituting an inductor element, the organic insulating material includes a resin curing object which is formed by reacting an epoxide resin with an active ester compound formed by reacting a compound having 2 or more carboxyl groups with a compound having phenolic hydroxyl groups. In the electronic part 10, the dielectric ceramic powder has the specific dielectric constant greater than that of the organic insulating material, and the organic insulating material has a low dielectric loss tangent. Further, even when using at a high temperature of 100°C or more, a deterioration with age of dielectric constant in a radio signal region of 100 MHz or more can be made sufficiently small, and a deformation at the treatment of the electronic part 10 can be prevented enough. COPYRIGHT: (C)2004,JPO&NCIPI

    Laminated electronic part, laminated electronic part module and manufacturing method therefor

    公开(公告)号:JP2004128153A

    公开(公告)日:2004-04-22

    申请号:JP2002288955

    申请日:2002-10-01

    Abstract: PROBLEM TO BE SOLVED: To provide a laminated electronic part whose mass production is easy, in which deviation of a conductor pattern is small and an inductance value and a capacitance value of narrow tolerance can be obtained, and to provide a laminated electronic part module and a manufacturing method of them.
    SOLUTION: A laminated body where an insulator and a conductor are alternately laminated is formed as a material, and it incorporates at least inductance elements 2 and a capacitive element 3. In one turn of a helical coil in the inductance element 2, three sides in four sides are formed in a U shape by recessing the laminated body. One other side in one turn of the coil is formed of a bridge conductor 7 formed on an insulating material 15 with which a groove 14 is filled. The capacitive element 3 is formed of an electrode 8 which makes a layer similar to U-shaped conductors 6 constituting the coil, and is worked and formed by a material of the layer and of conductors 9 and 10 which are formed on a face of opening sides of the U-shaped conductors and connect the electrodes.
    COPYRIGHT: (C)2004,JPO

    High frequency module with antenna
    8.
    发明专利

    公开(公告)号:JP2004088508A

    公开(公告)日:2004-03-18

    申请号:JP2002247697

    申请日:2002-08-27

    Abstract: PROBLEM TO BE SOLVED: To provide a high frequency antenna module for suppressing the increase of the whole area of the module itself, mounting circuit components on a GND face and allowed to be manufactured by simple manufacturing processes.
    SOLUTION: The high frequency antenna module comprises an RF substrate on which RF components constituting an RF circuit is mounted, a radiation element of an antenna which is faced to the RF substrate, GND which is one face of the RF substrate, arranged on the radiation element side and constitutes the GND face of the antenna, and space formed between the radiation element and the GND.
    COPYRIGHT: (C)2004,JPO

    Patch antenna
    9.
    发明专利
    Patch antenna 审中-公开
    PATCH天线

    公开(公告)号:JP2003309425A

    公开(公告)日:2003-10-31

    申请号:JP2003038677

    申请日:2003-02-17

    Abstract: PROBLEM TO BE SOLVED: To provide an electronic component with a material having a dielectric constant higher than a conventional material, without reduction in the strength, with a small size, high performance and excellent overall electric characteristics, particularly a patch antenna, and to provided an electronic component capable of suppressing fluctuations in the electric characteristics, in particular, the dielectric constant among lots and suppressing wear of metallic dies in forming the material, and an electronic component with a high withstanding voltage, particularly a patch antenna. SOLUTION: The electronic component to be provided is configured to include a composite dielectric material wherein dielectric bodies whose projected shape is circular, squam-circular, or elliptic are dispersed in a resin. COPYRIGHT: (C)2004,JPO

    Abstract translation: 要解决的问题:为了提供具有比常规材料更高的介电常数的材料的电子部件,而不降低强度,具有小尺寸,高性能和优异的整体电特性,特别是贴片天线, 并且提供一种能够抑制电特性的波动的电子部件,特别是批次间的介电常数,以及抑制金属模具的形成时的磨损,以及具有高耐压性的电子部件,特别是贴片天线。 提供的电子部件被配置为包括复合电介质材料,其中投影形状为圆形,正圆形或椭圆形的电介质体分散在树脂中。 版权所有(C)2004,JPO

    Electronic component
    10.
    发明专利
    Electronic component 审中-公开
    电子元件

    公开(公告)号:JP2003289007A

    公开(公告)日:2003-10-10

    申请号:JP2003011468

    申请日:2003-01-20

    Abstract: PROBLEM TO BE SOLVED: To provide an electronic component for high frequency of superior high frequency characteristics and furthermore superior comprehensive electrical characteristics by using at least one from among a resin substrate of superior high frequency characteristics, a magnetic substrate of superior high frequency characteristics and a dielectric substrate of superior high frequency characteristics.
    SOLUTION: This electronic component has a structure comprising at least one of an organic dielectric layer containing a polyvinyl benzyl ether compound, a complex magnetic layer formed by dispersing magnetic powder in the polyvinyl benzyl ether compound, and a complex dielectric layer formed by dispersing dielectric powder in the polyvinyl benzyl ether compound.
    COPYRIGHT: (C)2004,JPO

    Abstract translation: 要解决的问题:通过使用具有优异的高频特性的树脂基板中的至少一个来提供具有优异的高频特性的高频电子元件以及更优异的综合电气特性的电子部件,具有优异的高频率的磁性基板 特性和介电基板具有出色的高频特性。 解决方案:该电子部件具有包括含有聚乙烯基苄基醚化合物的有机介电层,通过将磁性粉末分散在聚乙烯基苄基醚化合物中而形成的复合磁性层中的至少一种的复合介电层和由 将电介质粉末分散在聚乙烯基苄基醚化合物中。 版权所有(C)2004,JPO

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