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    Area array adapter
    2.
    发明专利
    Area array adapter 审中-公开
    区域阵列适配器

    公开(公告)号：JP2010157701A

    公开(公告)日：2010-07-15

    申请号：JP2009270931

    申请日：2009-11-30

    Applicant: Hamilton Sundstrand Corp ,  ハミルトン・サンドストランド・コーポレイションHamilton Sundstrand Corporation

    Inventor： DESANTIS CHARLES V ,  BURCHELL DAVID E

    IPC: H05K1/18 ,  H01R33/76

    CPC classification number: H05K7/1053 ,  H01R12/57 ,  H01R12/7082 ,  H01R12/716 ,  H01R13/2435 ,  H01R13/2478 ,  H01R13/2485 ,  H01R13/41 ,  H05K3/3426 ,  H05K2201/10734 ,  H05K2201/10946 ,  Y02P70/613

    Abstract: PROBLEM TO BE SOLVED: To solve the problem that thermal expansion or thermal contraction causes distortion at a solder joint of a lead. SOLUTION: A top end 114 in which a recess 202 for receiving a solder ball of a BGA component is formed at a lead 106 of an adapter which electrically connects the BGA component to a circuit board, a pin-like bottom end 116 which is soldered to a pad pattern on the circuit board, a support that is fitted to a non-conductive carrier, and a hinge 204 are formed integrally. The hinge 204 has a solid structure having four bends for accommodating thermal expansion and contraction of a solder joint. In order to accommodate deformation of the hinge 204, a gap 350 is provided at a member 304 on the side opposite to the hinge 204. COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题：为了解决热膨胀或热收缩在引线的焊点处产生变形的问题。 解决方案：顶端114，其中用于接收BGA部件的焊球的凹部202形成在将BGA部件电连接到电路板的适配器的引线106处，销状的底端116 其被焊接到电路板上的焊盘图案，安装到非导电载体上的支撑件和铰链204一体地形成。 铰链204具有用于容纳焊接接头的热膨胀和收缩的四个弯曲部的实心结构。 为了适应铰链204的变形，在与铰链204相对的一侧的构件304处设置间隙350.（C）2010，JPO和INPIT

    Electrical connector
    3.
    发明专利
    Electrical connector 审中-公开
    电气连接器

    公开(公告)号：JP2009164108A

    公开(公告)日：2009-07-23

    申请号：JP2008267835

    申请日：2008-10-16

    Applicant: Hon Hai Precision Industry Co Ltd ,  鴻海精密工業股▲ふん▼有限公司

    Inventor： XU ZHAN-JUN ,  LIAW BEEN-YANG ,  HO FUKIN

    IPC: H01R13/46 ,  H01R13/62

    CPC classification number: H05K7/1053

    Abstract: PROBLEM TO BE SOLVED: To provide an electrical connector having a retention unit excellent on corrosion resistance. SOLUTION: In the electrical connector for connecting a CPU with a wiring board, the retention unit comprises an insulated body, a conductive terminal mounted on the insulated body and connecting the CPU and the wiring board, a fixed cover for pushing the CPU, and a retention frame for retaining the fixed cover. At least one of the fixed cover and the retention frame is made of a ferritic stainless steel material, and the surface of the ferritic stainless steel material is covered with a heat-resistant organic film. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题：提供具有耐腐蚀性优异的保持单元的电连接器。

    解决方案：在用于连接CPU与布线板的电连接器中，保持单元包括绝缘体，安装在绝缘体上并连接CPU和布线板的导电端子，用于推动CPU ，以及用于保持固定盖的保持框架。 固定盖和保持框架中的至少一个由铁素体不锈钢材料制成，并且铁素体不锈钢材料的表面被耐热有机膜覆盖。 版权所有（C）2009，JPO＆INPIT

    Ic socket
    5.
    发明专利
    Ic socket 审中-公开
    IC插座

    公开(公告)号：JP2006012491A

    公开(公告)日：2006-01-12

    申请号：JP2004184955

    申请日：2004-06-23

    Applicant: Tyco Electronics Amp Kk ,  タイコエレクトロニクスアンプ株式会社

    Inventor： TODA SHINSAKU ,  KAJINUMA SHUJI ,  INOUE MASASHI

    IPC: H01R33/76 ,  H01R13/62 ,  H05K7/10

    CPC classification number: H05K7/1053

    Abstract: PROBLEM TO BE SOLVED: To provide an IC socket capable of guiding an IC package to a normal position on a mounting surface with good workability for mounting, preventing an electric contact from being buckled or deformed, and stably energizing a guide member upward without increasing a number of components.
    SOLUTION: In this IC socket 1 equipped with an insulating socket housing 2 to hold a large number of electric contacts 90, a cover plate 8, and a drive member 10 to drive the cover plate 8, a pair of guide rails 58 to guide the IC package 100, and a guide member 6 having a connecting part 60 to mutually connect these guide rails 58 are mounted to the socket housing 2, and a pair of the guide rails 58 and the connecting part 60 each have spring arms 62a to energize the guide member 6 upward from the socket housing 2. The socket housing 2 and the guide member 6 have regulating members 20, 76 to regulate the upward movement of the guide member 6 at the position where the guided IC package 100 is not brought into contact with the electric contacts.
    COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题：为了提供能够将IC封装引导到安装面上的正常位置的IC插座，具有良好的安装加工性，防止电接触受到弯曲或变形，并且使引导构件向上稳定地通电 而不增加多个组件。 解决方案：在该IC插座1中，配备有用于容纳大量电触点90的绝缘插座壳体2，盖板8和用于驱动盖板8的驱动构件10，一对导轨58 引导IC封装100，并且具有连接部60以将这些导轨58相互连接的引导构件6安装到插座壳体2，并且一对导轨58和连接部60各自具有弹簧臂62a 引导构件6从插座壳体2向上方引导。插座壳体2和引导构件6具有调节构件20,76，以调节引导构件6在未被引导的IC封装100的位置处的向上运动 与电触点接触。 版权所有（C）2006，JPO＆NCIPI

    Circuit board assembly
    6.
    发明专利
    Circuit board assembly 审中-公开
    电路板总成

    公开(公告)号：JP2005093432A

    公开(公告)日：2005-04-07

    申请号：JP2004263515

    申请日：2004-09-10

    Applicant: Hewlett-Packard Development Co Lp ,  ヒューレット−パッカード デベロップメント カンパニー エル.ピー.

    Inventor： MEYER GREGORY S ,  SANDOVAL ALISA C

    IPC: H01R13/631 ,  H01R12/16 ,  H01R33/74 ,  H01R33/76 ,  H05K7/10

    CPC classification number: H01R12/716 ,  H01R12/7082 ,  H01R13/6315 ,  H05K7/1053

    Abstract: PROBLEM TO BE SOLVED: To provide a connector which enables easy connection, without damaging pins.
    SOLUTION: When a processor component 224 is mounted on a circuit board, an alignment member 230 is engaged with a bore 282 of an alignment member 232. The alignment member 230 is biased toward the projecting direction by a spring. Through a guide operation, resulting from chamfering of an opening 284, the alignment member 230 is led closer to the center of the bore 282, so that a connector portion 226 and a connector portion 228 are aligned with each other, prior to the engagement of the connector portion 226 and the connector portion 228. The tip 242 of the alignment member 230 extends relative to an end portion 244 of the connector portion 226 by a first extent, prior to the engagement of the connector portion 226 and the connector portion 228. The tip 242 of the alignment member 230 retracts, to extend relative to the end portion 244 of the connector portion 226 by a second extent which is shorter upon the engagement of the connector portion 226 and the connector portion 228.
    COPYRIGHT: (C)2005,JPO&NCIPI

    Abstract translation: 要解决的问题：提供能够容易地连接而不损坏销的连接器。 解决方案：当处理器组件224安装在电路板上时，对准构件230与对准构件232的孔282接合。对准构件230通过弹簧朝向突出方向偏置。 通过由开口284的倒角引起的引导操作，对准构件230被引导到更靠近孔282的中心，使得连接器部分226和连接器部分228在接合之前彼此对准 连接器部分226和连接器部分228.在连接器部分226和连接器部分228的接合之前，对准部件230的尖端242相对于连接器部分226的端部部分244延伸第一范围。 对准构件230的尖端242缩回，以相对于连接器部分226的端部部分244延伸第二范围，该第二范围在连接器部分226和连接器部分228的接合时较短。版权所有 C）2005，JPO＆NCIPI

    Socket for semiconductor element
    9.
    发明专利
    Socket for semiconductor element 审中-公开
    半导体元件插座

    公开(公告)号：JP2013113753A

    公开(公告)日：2013-06-10

    申请号：JP2011261213

    申请日：2011-11-30

    Applicant: Yamaichi Electronics Co Ltd ,  山一電機株式会社

    Inventor： HENMI AKIHIKO

    IPC: G01R31/26 ,  G01R1/067 ,  G01R1/073 ,  H01R33/76

    CPC classification number: G01R1/0483 ,  G01R1/0466 ,  G01R1/06722 ,  H01R13/2421 ,  H01R13/2471 ,  H01R13/2485 ,  H01R13/2492 ,  H05K7/1053 ,  H05K7/1069

    Abstract: PROBLEM TO BE SOLVED: To provide a socket for a semiconductor element capable of securing a proper stroke amount of a contact probe and minimizing the contact probe.SOLUTION: A socket 10 for a semiconductor element includes a movable base member 30 disposed movably on a base member 20 in a vertical direction by a spring 12 for a movable base attached to the base member 20, and a movable pedestal 40 disposed on the movable base member 30 to support an IC package 50, and can move the movable base member 30 vertically by moving the movable pedestal 40 downward.

    Abstract translation: 要解决的问题：提供一种能够确保接触探头的适当行程量并使接触探针最小化的半导体元件的插座。 解决方案：一种用于半导体元件的插座10包括：可移动基座部件30，其通过用于安装在基部部件20上的可动基座的弹簧12沿垂直方向可移动地设置在基部部件20上;以及可移动基座40， 在可移动基座构件30上支撑IC封装50，并且通过向下移动可动基座40而使可动基座构件30垂直地移动。 版权所有（C）2013，JPO＆INPIT

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