公开(公告)号：US20150354786A1

公开(公告)日：2015-12-10

申请号：US14602554

申请日：2015-01-22

Applicant: Won Soo JI ,  Hun Yong PARK ,  Sang Woo HA

Inventor： Won Soo JI ,  Hun Yong PARK ,  Sang Woo HA

IPC: F21V13/04 ,  F21V5/04 ,  H05B33/08 ,  F21V7/00

CPC classification number: F21V13/04 ,  F21V5/002 ,  F21V5/04 ,  F21V7/0066 ,  F21Y2101/00 ,  F21Y2115/10 ,  G02B3/0025 ,  G02B19/0028 ,  G02B19/0066 ,  H01L2924/181 ,  H05B33/086 ,  H05B33/0872 ,  H01L2924/00012

Abstract: A are provided a light source module. The light source module including a light emitting device configured to emit light in a light emitting direction; and an optical device including a first surface disposed over the light emitting device and having a groove recessed in the light emitting direction in a central portion through which an optical axis of the optical device passes, and a second surface disposed opposite to the first surface and configured to refract light incident through the groove to be emitted to the outside. The optical device includes a plurality of ridges disposed on the second surface and periodically arranged in a direction from the optical axis to an edge of the optical device connected to the first surface.

Abstract translation: A设置有光源模块。 所述光源模块包括配置为在发光方向发光的发光器件; 以及光学装置，其包括设置在所述发光装置上的第一表面，并且在所述光学装置的光轴穿过的中心部分具有沿所述发光方向凹陷的凹槽，以及与所述第一表面相对设置的第二表面， 被配置为折射通过所述凹槽入射的光以发射到外部。 光学装置包括设置在第二表面上并且沿着从光轴到连接到第一表面的光学装置的边缘的方向周期性地布置的多个脊。

公开(公告)号：US08632218B2

公开(公告)日：2014-01-21

申请号：US13227948

申请日：2011-09-08

Applicant: Hun Yong Park ,  Byung Man Kim

Inventor： Hun Yong Park ,  Byung Man Kim

IPC: F21S8/00

CPC classification number: F21V17/02 ,  F21K9/20 ,  F21K9/69 ,  F21V5/04 ,  F21V5/045 ,  F21V14/06 ,  F21V17/12 ,  F21V29/504 ,  F21V29/507 ,  F21Y2115/10

Abstract: A lighting device is provided. The lighting device includes: a light source module mounted on a substrate; a lens unit provided on the light source module and including an accommodating groove accommodating the light source module; a housing unit accommodating the lens unit therein to protect the lens unit from an outside; a supporting unit fixed to the substrate and including a coupling hole having the housing unit coupled thereto to thereby support the housing unit; and a height adjustment unit allowing the housing unit to be vertically-movably coupled to the supporting unit and adjusting a height of the lens unit such that the height of the lens unit is varied.

Abstract translation: 提供照明装置。 照明装置包括：安装在基板上的光源模块; 透镜单元，设置在所述光源模块上并且包括容纳所述光源模块的容纳槽; 将透镜单元容纳在其中以将透镜单元从外部保护的壳体单元; 支撑单元，其固定到所述基板并且包括联接孔，所述联接孔具有联接到其上的所述壳体单元，从而支撑所述壳体单元; 以及高度调节单元，其允许所述壳体单元可垂直移动地联接到所述支撑单元并且调节所述透镜单元的高度，使得所述透镜单元的高度变化。

公开(公告)号：US20120153334A1

公开(公告)日：2012-06-21

申请号：US13327189

申请日：2011-12-15

Applicant: Hun Yong PARK ,  Seong Deok Hwang ,  Won Ho Jung

Inventor： Hun Yong PARK ,  Seong Deok Hwang ,  Won Ho Jung

IPC: H01L33/58

CPC classification number: H01L33/58 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/48091 ,  Y10S362/80 ,  H01L2924/00014

Abstract: A light emitting diode (LED) package is provided. The LED package includes an LED, a plurality of lead frames electrically connected with the LED, a package body having a receiving groove exposed to receive the LED therein and including a plurality of supporting units provided to project from an inner side surface of the receiving groove, and a filling member having an engaging groove engaged with the supporting unit at a circumference of a side surface thereof, and included inside the receiving groove.

Abstract translation: 提供了一种发光二极管（LED）封装。 LED封装包括LED，与LED电连接的多个引线框架，封装体，其具有暴露以容纳LED的接收槽，并且包括多个支撑单元，所述支撑单元设置成从接收槽的内侧表面突出 以及填充构件，其具有在其侧表面的圆周处与所述支撑单元接合并且包括在所述接收槽内部的接合槽。

公开(公告)号：US06688343B1

公开(公告)日：2004-02-10

申请号：US10252062

申请日：2002-09-20

Applicant: Hun-Yong Park ,  Hyun-Chul Sim ,  Do-Yeon Kim

Inventor： Hun-Yong Park ,  Hyun-Chul Sim ,  Do-Yeon Kim

IPC: B65B104

CPC classification number: B60P3/2295

Abstract: An apparatus for filling insulation material consists of a vibrating means; a lift driving means for lifting the vibrating means; a horizontal transporting means for horizontally transporting the vibrating means and the lift driving means along the guide rail of the storage tank; an automatic winding means; a level sensing means for checking the amount of filling of the insulation material; a flux preventing means for securely maintaining the flux in the horizontal direction and verticality of the vibrating means; a descending position sensing means for restricting the descending position of the vibrating means by touching the insulation material; a control means for checking the amount of the insulation material filled along with automatically remote controlling the vibrating means, the level sensing means and the lift driving means; and a display means for directly observing the inside through a camera.

Abstract translation: 用于填充绝缘材料的装置包括振动装置; 用于提升振动装置的提升驱动装置; 水平传送装置，用于沿着储罐的导轨水平地传送振动装置和升降驱动装置; 自动上链装置; 用于检查绝缘材料的填充量的电平检测装置; 磁通防止装置，用于可靠地保持磁通在振动装置的水平方向和垂直度上; 下降位置检测装置，用于通过触摸绝缘材料来限制振动装置的下降位置; 用于检查填充的绝缘材料的量以及自动远程控制振动装置，液位感测装置和升降驱动装置的控制装置; 以及用于通过照相机直接观察内部的显示装置。

公开(公告)号：US20120267663A1

公开(公告)日：2012-10-25

申请号：US13426342

申请日：2012-03-21

Applicant: Hun Yong PARK ,  Ji Hyun Kim ,  Jae Sung You ,  Seong Deok Hwang ,  Young Hee Song

Inventor： Hun Yong PARK ,  Ji Hyun Kim ,  Jae Sung You ,  Seong Deok Hwang ,  Young Hee Song

IPC: H01L33/58

CPC classification number: H01L33/54 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2933/005 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A light emitting diode (LED) package refracting or reflecting light emitted from an LED chip is disclosed. The LED package may include a substrate, an LED chip mounted on the substrate, a lens unit formed by injecting an encapsulant adapted to enclose and protect the LED chip, and at least one refraction member disposed in the lens unit. The at least one refraction member may refract or reflect the light emitted from the LED chip.

Abstract translation: 公开了一种折射或反射从LED芯片发出的光的发光二极管（LED）封装。 LED封装可以包括基板，安装在基板上的LED芯片，通过注入适于封装和保护LED芯片的密封剂形成的透镜单元，以及设置在透镜单元中的至少一个折射构件。 所述至少一个折射构件可折射或反射从LED芯片发出的光。

公开(公告)号：US20120063143A1

公开(公告)日：2012-03-15

申请号：US13227948

申请日：2011-09-08

Applicant: Hun Yong PARK ,  Byung Man KIM

Inventor： Hun Yong PARK ,  Byung Man KIM

IPC: F21V99/00

CPC classification number: F21V17/02 ,  F21K9/20 ,  F21K9/69 ,  F21V5/04 ,  F21V5/045 ,  F21V14/06 ,  F21V17/12 ,  F21V29/504 ,  F21V29/507 ,  F21Y2115/10

Abstract: A lighting device is provided. The lighting device includes: a light source module mounted on a substrate; a lens unit provided on the light source module and including an accommodating groove accommodating the light source module; a housing unit accommodating the lens unit therein to protect the lens unit from an outside; a supporting unit fixed to the substrate and including a coupling hole having the housing unit coupled thereto to thereby support the housing unit; and a height adjustment unit allowing the housing unit to be vertically-movably coupled to the supporting unit and adjusting a height of the lens unit such that the height of the lens unit is varied.

Abstract translation: 提供照明装置。 照明装置包括：安装在基板上的光源模块; 透镜单元，设置在所述光源模块上并且包括容纳所述光源模块的容纳槽; 将透镜单元容纳在其中以将透镜单元从外部保护的壳体单元; 支撑单元，其固定到所述基板并且包括联接孔，所述联接孔具有联接到其上的所述壳体单元，从而支撑所述壳体单元; 以及高度调节单元，其允许所述壳体单元可垂直移动地联接到所述支撑单元并且调节所述透镜单元的高度，使得所述透镜单元的高度变化。

公开(公告)号：US08847270B2

公开(公告)日：2014-09-30

申请号：US13327189

申请日：2011-12-15

Applicant: Hun Yong Park ,  Seong Deok Hwang ,  Won Ho Jung

Inventor： Hun Yong Park ,  Seong Deok Hwang ,  Won Ho Jung

IPC: H01L33/58 ,  H01L33/60 ,  H01L33/48

CPC classification number: H01L33/58 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/48091 ,  Y10S362/80 ,  H01L2924/00014

Abstract: A light emitting diode (LED) package is provided. The LED package includes an LED, a plurality of lead frames electrically connected with the LED, a package body having a receiving groove exposed to receive the LED therein and including a plurality of supporting units provided to project from an inner side surface of the receiving groove, and a filling member having an engaging groove engaged with the supporting unit at a circumference of a side surface thereof, and included inside the receiving groove.

Abstract translation: 提供了一种发光二极管（LED）封装。 LED封装包括LED，与LED电连接的多个引线框架，封装体，其具有暴露以容纳LED的接收槽，并且包括多个支撑单元，所述支撑单元设置成从接收槽的内侧表面突出 以及填充构件，其具有在其侧表面的圆周处与所述支撑单元接合并且包括在所述接收槽内部的接合槽。

公开(公告)号：US08435808B2

公开(公告)日：2013-05-07

申请号：US13281079

申请日：2011-10-25

Applicant: Won Ho Jung ,  Hun Yong Park ,  Jung Chul Kang ,  Kyung Taeg Han

Inventor： Won Ho Jung ,  Hun Yong Park ,  Jung Chul Kang ,  Kyung Taeg Han

IPC: H01L21/00

CPC classification number: H01L33/58 ,  H01L33/486 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2933/0058 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method for manufacturing a light emitting diode (LED) package is provided. The method includes preparing a package body including a first lead frame formed with a cavity and inserted on one side of a bottom surface of the cavity and a second lead frame inserted on the other side, mounting an LED chip on the bottom surface and electrically connecting the LED chip with the first lead frame and the second lead frame, forming a molding portion by a molding resin in the cavity, connecting, to the package body, a first mold corresponding to the molding portion and including a through hole having an inner surface linearly or non-linearly inclined, connecting a second mold to an upper surface of the first mold, forming a lens portion on the molding portion by a transparent resin, and separating the first mold and the second mold from the package body.

Abstract translation: 提供一种制造发光二极管（LED）封装的方法。 该方法包括制备包装体，其包括形成有空腔的第一引线框架并且插入在该空腔的底表面的一侧上，以及插入另一侧的第二引线框架，将LED芯片安装在底表面上并电连接 所述LED芯片具有所述第一引线框架和所述第二引线框架，通过所述腔体中的模制树脂形成模制部分，将与所述模制部分相对应的第一模具连接到所述封装主体，并且包括具有内表面的通孔 将第二模具连接到第一模具的上表面，通过透明树脂在模制部分上形成透镜部分，并将第一模具和第二模具与包装体分离。

公开(公告)号：US20120126267A1

公开(公告)日：2012-05-24

申请号：US13281079

申请日：2011-10-25

Applicant: Won Ho JUNG ,  Hun Yong Park ,  Jung Chul Kang ,  Kyung Taeg Han

Inventor： Won Ho JUNG ,  Hun Yong Park ,  Jung Chul Kang ,  Kyung Taeg Han

IPC: H01L33/58 ,  H01L33/52

CPC classification number: H01L33/58 ,  H01L33/486 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2933/0058 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method for manufacturing a light emitting diode (LED) package is provided. The method includes preparing a package body including a first lead frame formed with a cavity and inserted on one side of a bottom surface of the cavity and a second lead frame inserted on the other side, mounting an LED chip on the bottom surface and electrically connecting the LED chip with the first lead frame and the second lead frame, forming a molding portion by a molding resin in the cavity, connecting, to the package body, a first mold corresponding to the molding portion and including a through hole having an inner surface linearly or non-linearly inclined, connecting a second mold to an upper surface of the first mold, forming a lens portion on the molding portion by a transparent resin, and separating the first mold and the second mold from the package body.

Abstract translation: 提供一种制造发光二极管（LED）封装的方法。 该方法包括制备包装体，其包括形成有空腔的第一引线框架并且插入在该空腔的底表面的一侧上，以及插入另一侧的第二引线框架，将LED芯片安装在底表面上并电连接 所述LED芯片具有所述第一引线框架和所述第二引线框架，通过所述腔体中的模制树脂形成模制部分，将与所述模制部分相对应的第一模具连接到所述封装主体，并且包括具有内表面的通孔 将第二模具连接到第一模具的上表面，通过透明树脂在模制部分上形成透镜部分，并将第一模具和第二模具与包装体分离。