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1.发明授权Liquid-cooling memory modules with liquid flow pipes between memory module sockets 有权内存模块插槽之间具有液体流管的液冷存储器模块公开(公告)号：US08587943B2
公开(公告)日：2013-11-19
申请号：US13305092
申请日：2011-11-28
申请人： Richard M. Barina , Vinod Kamath , Chunjian Ni , Derek I. Schmidt , Mark E. Steinke , James S. Womble
发明人： Richard M. Barina , Vinod Kamath , Chunjian Ni , Derek I. Schmidt , Mark E. Steinke , James S. Womble
CPC分类号： H01L23/473 , G06F1/20 , G06F2200/201 , H01L23/4093 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A liquid-cooled computer memory system includes first and second blocks in fluid communication with a chilled liquid source. A plurality of spaced-apart heat transfer pipes extend along a system board between memory module sockets from the first manifold block to the second manifold block. The heat transfer pipes may be liquid flow pipes circulating the chilled liquid between the memory module sockets. Alternatively, the heat transfer pipes may be closed heat pipes that conduct heat from the memory modules to the liquid-cooled blocks. A separate heat spreader is provided to thermally bridge each memory module to the adjacent heat transfer pipes.
摘要翻译： 液冷计算机存储器系统包括与冷却液体源流体连通的第一和第二块。 多个间隔开的传热管沿着系统板在从第一歧管块到第二歧管块的存储器模块插槽之间延伸。 传热管可以是将冷却液体循环在存储器模块插槽之间的液体流管。 或者，传热管可以是将热量从存储器模块传导到液冷块的封闭热管。 提供单独的散热器以将每个存储器模块热桥接到相邻的传热管。
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公开(公告)号：US08336199B2
公开(公告)日：2012-12-25
申请号：US12728096
申请日：2010-03-19
申请人： Richard M. Barina , James R. Drake , Daniel P. Kelaher , George M. Moorefield, II , Derek I. Schmidt , James S. Womble
发明人： Richard M. Barina , James R. Drake , Daniel P. Kelaher , George M. Moorefield, II , Derek I. Schmidt , James S. Womble
IPC分类号： B23P19/00
CPC分类号： H05K13/0491 , Y10T29/4913 , Y10T29/53183 , Y10T29/53257 , Y10T29/53274 , Y10T29/53283
摘要： A tool according to one embodiment includes an actuating mechanism including a cam plate; at least one gripper member operatively coupled to the cam plate; and a carriage for supporting the at least one gripper member, wherein the at least one gripper member is actuatable by the cam plate, wherein rotation of the cam plate causes the at least one gripper member to move between a first position and a second position, wherein when the at least one gripper member is in the first position, the tool is able to accept a processor for holding thereof, and wherein when the at least one gripper member is in the second position, the tool securely holds the processor therein. Additional systems and methods are also presented.
摘要翻译： 根据一个实施例的工具包括具有凸轮板的致动机构; 至少一个可操作地联接到所述凸轮板的夹持器构件; 以及用于支撑所述至少一个夹持构件的滑架，其中所述至少一个夹持构件可由所述凸轮板致动，其中所述凸轮板的旋转使所述至少一个夹持构件在第一位置和第二位置之间移动， 其中，当所述至少一个夹持构件处于所述第一位置时，所述工具能够接受用于保持其的处理器，并且其中当所述至少一个夹持构件处于所述第二位置时，所述工具将所述处理器牢固地保持在其中。 还介绍了其他系统和方法。
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公开(公告)号：US20100308189A1
公开(公告)日：2010-12-09
申请号：US12480998
申请日：2009-06-09
IPC分类号： A47B96/00
CPC分类号： H05K7/1489 , G06F1/186
摘要： A method and system to support simultaneous unlatching from a rack of two or more adjacently mounted and vertically aligned hardware components. One interface bracket is secured to one vertical rail of the rack, and a second interface bracket is secured to a second vertical rail of the rack on an opposite side of the rack. A set of latches are provided in communication with each interface bracket, with the number of latches corresponding to the number of hardware components in communication with the interface bracket. Actuation of one of the latches releases fastening of at least one hardware components from the rack, and accommodates removal of the release component from the rack.
摘要翻译： 一种支持从两个或多个相邻安装和垂直对齐的硬件组件的机架同时解锁的方法和系统。 一个接口支架被固定在机架的一个垂直导轨上，第二接口支架固定在机架另一侧的另一个垂直导轨上。 提供与每个接口支架通信的一组锁存器，其中锁存器的数量对应于与接口支架通信的硬件组件的数量。 其中一个闩锁的致动释放了来自机架的至少一个硬件组件的紧固，并且允许将释放部件从机架中移除。
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4.发明授权公开(公告)号：US08659897B2
公开(公告)日：2014-02-25
申请号：US13360328
申请日：2012-01-27
CPC分类号： G06F1/20 , G06F2200/201
摘要： Each pair of memory modules in a memory system are cooled using a shared cooling pipe, such as a heat pipe or liquid flow pipe. An example embodiment includes one pair of memory module sockets on opposite sides of the respective cooling pipe. An inner heat spreader plate is thermally coupled to the cooling pipe and in thermal engagement with a first face of the memory module adjacent to the included cooling pipe. Heat is conducted from the second face of the memory module to the cooling pipe, such as from an outer plate in thermal engagement with an opposing second face of the memory modules and with the inner plate.
摘要翻译： 存储器系统中的每对存储器模块使用诸如热管或液体流管的共用冷却管来冷却。 示例实施例包括在相应冷却管的相对侧上的一对存储器模块插槽。 内部散热板热耦合到冷却管并且与存储器模块的与附带的冷却管相邻的第一面热接合。 热量从存储器模块的第二面传导到冷却管，例如从与存储器模块的相对的第二面和内板热接合的外板。
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公开(公告)号：US20110225819A1
公开(公告)日：2011-09-22
申请号：US12728096
申请日：2010-03-19
申请人： Richard M. Barina , James R. Drake , Daniel P. Kelaher , George M. Moorefield, II , Derek I. Schmidt , James S. Womble
发明人： Richard M. Barina , James R. Drake , Daniel P. Kelaher , George M. Moorefield, II , Derek I. Schmidt , James S. Womble
CPC分类号： H05K13/0491 , Y10T29/4913 , Y10T29/53183 , Y10T29/53257 , Y10T29/53274 , Y10T29/53283
摘要： A tool according to one embodiment includes an actuating mechanism including a cam plate; at least one gripper member operatively coupled to the cam plate; and a carriage for supporting the at least one gripper member, wherein the at least one gripper member is actuatable by the cam plate, wherein rotation of the cam plate causes the at least one gripper member to move between a first position and a second position, wherein when the at least one gripper member is in the first position, the tool is able to accept a processor for holding thereof, and wherein when the at least one gripper member is in the second position, the tool securely holds the processor therein. Additional systems and methods are also presented.
摘要翻译： 根据一个实施例的工具包括具有凸轮板的致动机构; 至少一个可操作地联接到所述凸轮板的夹持器构件; 以及用于支撑所述至少一个夹持构件的滑架，其中所述至少一个夹持构件可由所述凸轮板致动，其中所述凸轮板的旋转使所述至少一个夹持构件在第一位置和第二位置之间移动， 其中，当所述至少一个夹持构件处于所述第一位置时，所述工具能够接受用于保持其的处理器，并且其中当所述至少一个夹持构件处于所述第二位置时，所述工具将所述处理器牢固地保持在其中。 还介绍了其他系统和方法。
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6.发明申请公开(公告)号：US20130194745A1
公开(公告)日：2013-08-01
申请号：US13360328
申请日：2012-01-27
IPC分类号： G06F1/20
CPC分类号： G06F1/20 , G06F2200/201
摘要： Each pair of memory modules in a memory system are cooled using a shared cooling pipe, such as a heat pipe or liquid flow pipe. An example embodiment includes one pair of memory module sockets on opposite sides of the respective cooling pipe. An inner heat spreader plate is thermally coupled to the cooling pipe and in thermal engagement with a first face of the memory module adjacent to the included cooling pipe. Heat is conducted from the second face of the memory module to the cooling pipe, such as from an outer plate in thermal engagement with an opposing second face of the memory modules and with the inner plate.
摘要翻译： 存储器系统中的每对存储器模块使用诸如热管或液体流管的共用冷却管来冷却。 示例实施例包括在相应冷却管的相对侧上的一对存储器模块插槽。 内部散热板热耦合到冷却管并且与存储器模块的与附带的冷却管相邻的第一面热接合。 热量从存储器模块的第二面传导到冷却管，例如从与存储器模块的相对的第二面和内板热接合的外板。
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公开(公告)号：US20120011700A1
公开(公告)日：2012-01-19
申请号：US12835683
申请日：2010-07-13
CPC分类号： H05K13/0447 , G06F1/185 , G06F1/186 , H01R12/7005 , H01R13/62 , H01R43/26 , H05K7/1415 , H05K7/1461 , H05K13/0015 , H05K13/046 , Y10T29/49895 , Y10T29/5313 , Y10T29/53261
摘要： According to one embodiment, a tool includes a carrier for supporting an adapter card, a lower retaining member extending from a lower portion of the carrier for securing the adapter card to the carrier, and an upper retaining member extending from an upper portion of the carrier for securing the adapter card to the carrier. In another embodiment, a system includes a tool and a computer system chassis having a feature for aligning the tool with a system board of the computer system. The tool includes a carrier for supporting an adapter card, at least one lower retaining member extending from a lower portion of the carrier for securing the adapter card to the carrier, at least one upper retaining member extending from an upper portion of the carrier for securing the adapter card to the carrier, and a positioning member extending from the carrier for aligning the tool.
摘要翻译： 根据一个实施例，工具包括用于支撑适配器卡的托架，从托架的下部延伸的下保持构件，用于将适配器卡固定到托架上;以及上保持构件，其从托架的上部延伸 用于将适配器卡固定到托架上。 在另一个实施例中，系统包括工具和具有将工具与计算机系统的系统板对准的特征的计算机系统底盘。 该工具包括用于支撑适配器卡的载体，至少一个下部保持构件，其从托架的下部延伸，用于将适配器卡固定到托架上;至少一个上部保持构件，其从托架的上部延伸以固定 适配器卡到载体，以及定位构件，其从载体延伸以对准工具。
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公开(公告)号：US07344394B1
公开(公告)日：2008-03-18
申请号：US11872987
申请日：2007-10-16
IPC分类号： H01R13/62
CPC分类号： H05K7/1489 , G06F1/183
摘要： A latch mechanism for securing a module in an electronic component chassis includes at least one lever arm attached to the module and rotable between a latched and unlatched position, at least a portion of the lever arm having an interference fit with the chassis when the lever arm is in the latched position. The latch mechanism further includes at least one pawl rotably attached to the module such that when the lever arm is moved to the latched position, the lever arm rotates the pawl into a latched position wherein the pawl has an interference fit with the chassis.
摘要翻译： 用于将模块固定在电子部件底盘中的闩锁机构包括至少一个杠杆臂，该杠杆臂附接到模块并可在锁定和解锁位置之间旋转，当杠杆臂 处于锁定位置。 闩锁机构还包括可旋转地附接到模块的至少一个棘爪，使得当杠杆臂移动到闩锁位置时，杠杆臂将棘爪旋转到闩锁位置，其中棘爪与底盘具有过盈配合。
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公开(公告)号：US20130147503A1
公开(公告)日：2013-06-13
申请号：US13323330
申请日：2011-12-12
CPC分类号： G06F1/20 , G06F2200/201 , H05K7/20772
摘要： A liquid cooled planer including: one or more computing components mounted on the planer, wherein at least one or more of the computing components is liquid cooled; one or more conductive cooling components mounted on the planer; and one or more convective cooling components mounted on the planer, wherein the convective cooling components are removable from the planer without removing the conductive cooling components from the planer.
摘要翻译： 一种液体冷却刨床，包括：一个或多个安装在所述刨床上的计算部件，其中至少一个或多个所述计算部件是液体冷却的; 安装在刨床上的一个或多个导电冷却组件; 以及安装在刨床上的一个或多个对流冷却部件，其中所述对流冷却部件可从所述刨床移除，而不从所述刨床移除所述导电冷却部件。
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10.发明申请LIQUID-COOLING MEMORY MODULES WITH LIQUID FLOW PIPES BETWEEN MEMORY MODULE SOCKETS 有权存储器模块插座之间液体流管的液体冷却存储器模块公开(公告)号：US20130135812A1
公开(公告)日：2013-05-30
申请号：US13305092
申请日：2011-11-28
申请人： Richard M. Barina , Vinod Kamath , Chunjian Ni , Derek I. Schmidt , Mark E. Steinke , James S. Womble
发明人： Richard M. Barina , Vinod Kamath , Chunjian Ni , Derek I. Schmidt , Mark E. Steinke , James S. Womble
CPC分类号： H01L23/473 , G06F1/20 , G06F2200/201 , H01L23/4093 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A liquid-cooled computer memory system includes first and second blocks in fluid communication with a chilled liquid source. A plurality of spaced-apart heat transfer pipes extend along a system board between memory module sockets from the first manifold block to the second manifold block. The heat transfer pipes may be liquid flow pipes circulating the chilled liquid between the memory module sockets. Alternatively, the heat transfer pipes may be closed heat pipes that conduct heat from the memory modules to the liquid-cooled blocks. A separate heat spreader is provided to thermally bridge each memory module to the adjacent heat transfer pipes.
摘要翻译： 液冷计算机存储器系统包括与冷却液体源流体连通的第一和第二块。 多个间隔开的传热管沿着系统板在从第一歧管块到第二歧管块的存储器模块插槽之间延伸。 传热管可以是将冷却液体循环在存储器模块插槽之间的液体流管。 或者，传热管可以是将热量从存储器模块传导到液冷块的封闭热管。 提供单独的散热器以将每个存储器模块热桥接到相邻的传热管。
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