公开(公告)号：US5449948A

公开(公告)日：1995-09-12

申请号：US678852

申请日：1991-04-01

申请人： Hirokazu Inoue ,  Tomoji Oishi ,  Hiroichi Shinohara ,  Ken Takahashi ,  Tetsuo Nakazawa ,  Mitsuo Usami ,  Masaki Fukuoka

发明人： Hirokazu Inoue ,  Tomoji Oishi ,  Hiroichi Shinohara ,  Ken Takahashi ,  Tetsuo Nakazawa ,  Mitsuo Usami ,  Masaki Fukuoka

IPC分类号： H01L23/52 ,  H01L21/3205 ,  H01L21/822 ,  H01L23/64 ,  H01L27/02 ,  H01L27/04 ,  H01L27/08

CPC分类号： H01L23/642 ,  H01L22/22 ,  H01L27/0214 ,  H01L27/0805 ,  H01L2224/4847 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/12035 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3025

摘要： Integrated circuit devices, chips and methods of making and operating them are disclosed. The devices are specially adapted for high frequency operation e.g. at or above 1 GHz. Inductive noise caused by switching at these frequencies--and which can interfere with switching--is inhibited by using a large bypass capacitor connected between power and ground connections outside the chip, and a small bypass capacitor connected between the same power and ground connections but formed inside the chip. The smaller capacitor cuts noise attributable to the wiring between the larger capacitor and the chip. The chip can have many of the smaller capacitors, even one or more per gate. In the preferred embodiments, the small capacitors from power and ground bonding pads are formed at the front surface of the chip substrate. Tantalum pentoxide, and other suitable dielectrics having relative dielectric constant of 10 or more at 1 GHz, are used to form the capacitors.

摘要翻译： 公开了集成电路器件，芯片及其制造和操作的方法。 这些器件特别适用于高频操作，例如 1 GHz以上。 通过使用连接在芯片外部的电源和接地连接之间的大型旁路电容以及连接在相同电源和接地连接之间但形成在内部的小旁路电容器来抑制在这些频率处切换并且可能干扰开关的电感噪声 芯片。 较小的电容器可以减小归因于较大电容器和芯片之间的布线的噪声。 该芯片可以具有许多较小的电容器，甚至每个栅极一个或多个。 在优选实施例中，来自电源和接地焊盘的小电容器形成在芯片基板的前表面。 使用五氧化二钽和1GHz下相对介电常数为10以上的其他合适的电介质来形成电容器。

公开(公告)号：US5422516A

公开(公告)日：1995-06-06

申请号：US880520

申请日：1992-05-08

申请人： Takashi Hosokawa ,  Hirokazu Inoue ,  Mamoru Sawahata ,  Masaki Fukuoka

发明人： Takashi Hosokawa ,  Hirokazu Inoue ,  Mamoru Sawahata ,  Masaki Fukuoka

IPC分类号： H01L21/48 ,  H01L21/60 ,  H01L23/498 ,  H05K1/02 ,  H05K3/34 ,  H05K3/40 ,  H01L23/48 ,  H01L29/44 ,  H01L29/52 ,  H01L29/60

CPC分类号： H01L24/11 ,  H01L21/4853 ,  H01L23/49816 ,  H01L24/14 ,  H01L24/16 ,  H05K3/4007 ,  H01L2224/0401 ,  H01L2224/0558 ,  H01L2224/05644 ,  H01L2224/0603 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/11472 ,  H01L2224/116 ,  H01L2224/11831 ,  H01L2224/11902 ,  H01L2224/13012 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13023 ,  H01L2224/13078 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/14141 ,  H01L2224/45124 ,  H01L2224/48744 ,  H01L2224/8159 ,  H01L2224/816 ,  H01L24/83 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/351 ,  H05K1/0271 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/10848 ,  H05K2203/0577 ,  H05K3/3436

摘要： An electronic parts loaded module comprises a circuit board having electronic parts connected thereto via a plurality of projecting electrodes, in which two or more of the plurality of projecting electrodes for connecting the electronic parts have a narrowed portion between one end adjacent to the boundary for connection with the electronic parts and the other end adjacent to the boundary for connection with the board, the narrowed portion having a cross-section which has different dimensions in crossing directions, or a minor axis and a major axis different in length from each other. The projecting electrodes are disposed in a manner as the larger dimension or the major axis being aligned along the periphery or the side of the electronic parts, or as surrounding the central area of the surface, on which the electronic parts are loaded. The module can be used in IC cards and liquid crystal display apparatuses and the like.

摘要翻译： 电子部件加载模块包括电路板，其电子部件经由多个突出电极连接，其中，用于连接电子部件的多个突出电极中的两个或更多个在邻近边界的一端之间具有窄的部分 其中电子部件和另一端靠近用于与板连接的边界，所述变窄部分具有在交叉方向上具有不同尺寸的横截面，或者具有彼此不同长度的短轴和长轴。 突出电极以大尺寸或长轴沿着电子部件的周边或侧面对准的方式设置，或者围绕安装有电子部件的表面的中心区域。 该模块可以用于IC卡和液晶显示装置等。