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    Method for manufacturing thin substrate using a laminate body
    2.
    发明授权
    Method for manufacturing thin substrate using a laminate body 有权
    使用层压体制造薄基板的方法

    公开(公告)号：US07759050B2

    公开(公告)日：2010-07-20

    申请号：US12336994

    申请日：2008-12-17

    申请人： Carl R. Kessel ,  Larry D. Boardman ,  Richard J. Webb

    发明人： Carl R. Kessel ,  Larry D. Boardman ,  Richard J. Webb

    IPC分类号： G03F7/11

    CPC分类号： B32B37/12 ,  B24B7/228 ,  B32B2310/0806 ,  B32B2457/14 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2221/68386 ,  Y10T428/31663

    摘要： Provided is a laminated body comprising a substrate to be ground and a support, where the substrate may be ground to a very small (thin) thickness and can then be separated from the support without damaging the substrate. One embodiment is a laminated body comprising a substrate to be ground, a curable silicone adhesive layer in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the adhesive layer, the laminated body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.

    摘要翻译： 提供了一种层叠体，其包括待研磨的基底和支撑体，其中基底可被研磨成非常小（薄）的厚度，然后可以与支撑体分离而不损坏基底。 一个实施方案是一种层压体，其包括待研磨的基材，与待研磨基材接触的可固化的硅氧烷粘合剂层，包含光吸收剂和可热分解树脂的光热转换层和透光载体。 在与粘合剂层接触的基板表面研磨后，通过透光层照射层叠体，分解光热转换层，分离基板和透光支撑体。

    ARTICLE AND METHOD FOR BONDING SUBSTRATES WITH LARGE TOPOGRAPHIES
    6.
    发明申请
    ARTICLE AND METHOD FOR BONDING SUBSTRATES WITH LARGE TOPOGRAPHIES 审中-公开
    用于将基板与大型地形结合的文章和方法

    公开(公告)号：US20120034426A1

    公开(公告)日：2012-02-09

    申请号：US12850772

    申请日：2010-08-05

    申请人： Richard J. Webb ,  Wayne S. Mahoney ,  Eric G. Larson

    发明人： Richard J. Webb ,  Wayne S. Mahoney ,  Eric G. Larson

    IPC分类号： B32B3/30 ,  B32B38/00 ,  B32B37/02

    CPC分类号： H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381 ,  Y10T156/10 ,  Y10T428/24612

    摘要： The present invention is an article useful in the field of wafer processing, for example. The article includes a substrate, a leveling layer, a joining layer, a photothermal conversion layer and a temporary carrier. The substrate has a first major surface, a second major surface and at least one three dimensional topographical feature extending from the first major surface and having an initial step height. The leveling layer is positioned adjacent to the first major surface and reduces a topography of the substrate to between about 5% and about 95% of the initial step height. The joining layer is positioned adjacent to the leveling layer and further reduces the topography of the substrate to less than about 20% of the initial step height. The photothermal conversion layer is positioned adjacent to the joining layer and the temporary carrier is positioned adjacent the photothermal conversion layer.

    摘要翻译： 本发明是例如在晶片加工领域中有用的物品。 该制品包括基底，平整层，接合层，光热转换层和临时载体。 衬底具有从第一主表面延伸并且具有初始台阶高度的第一主表面，第二主表面和至少一个三维形貌特征。 平整层定位成与第一主表面相邻并且将基底的形貌减小到初始台阶高度的约5％至约95％之间。 接合层定位成与流平层相邻并进一步将衬底的形貌减小到小于初始台阶高度的约20％。 光热转换层位于接合层附近，临时载体位于光热转换层附近。

    Modular in-wall medical services unit
    7.
    发明授权
    Modular in-wall medical services unit 有权
    模块化内墙医疗服务单位

    公开(公告)号：US07950189B1

    公开(公告)日：2011-05-31

    申请号：US12814986

    申请日：2010-06-14

    申请人： James A. Walker ,  Taylor C. Culpepper ,  Richard J. Webb ,  John R. Pierson

    发明人： James A. Walker ,  Taylor C. Culpepper ,  Richard J. Webb ,  John R. Pierson

    IPC分类号： E04F19/00

    CPC分类号： A61G12/005 ,  E04F17/08 ,  E04H3/08

    摘要： A modular in-wall medical services unit for medical care facilities. A frame supports a cabinet with a cover panel providing electrical and/or gas outlets. Built-in electrical and gas conduits are included. A junction box and ends of the gas conduits near the top of the frame are accessible after wallboard is applied. Thus, wallboard can be installed before or after wiring is completed and gas connections are made. The self-aligning cover panel is “floatingly” supported on the frame so that a bead of sealant can be applied around the edge before the cover panel is “snugged up” to the wall and secured. The trim flanges on the cover panel include vertical equipment mounting tracks. Manufacturing is simplified by making the height of the frame adjustable; the same frame elements can be used to assemble units for different ceiling heights, decreasing the number of required parts in inventory and expediting assembly.

    摘要翻译： 用于医疗设施的模块化内墙医疗服务单元。 框架支撑具有盖板的机柜，其提供电气和/或气体出口。 内置电气和气体管道。 接线盒和框架顶部附近的气体导管的端部可在墙板应用后进入。 因此，在布线完成之前或之后可以安装墙板，并且进行气体连接。 自对准盖板被“浮动地”支撑在框架上，使得在盖板被“贴合”到壁并固定之前，可以在边缘周围施加密封剂珠。 盖板上的装饰法兰包括垂直设备安装轨道。 通过使框架的高度可调，简化制造; 相同的框架元件可用于组装不同天花板高度的单元，减少库存中所需零件的数量并加快组装。

    METHOD FOR MANUFACTURING THIN SUBSTRATE USING A LAMINATE BODY
    8.
    发明申请
    METHOD FOR MANUFACTURING THIN SUBSTRATE USING A LAMINATE BODY 有权
    使用层压体制造薄基板的方法

    公开(公告)号：US20090115075A1

    公开(公告)日：2009-05-07

    申请号：US12336994

    申请日：2008-12-17

    申请人： Carl R. KESSEL ,  Larry D. Boardman ,  Richard J. Webb

    发明人： Carl R. KESSEL ,  Larry D. Boardman ,  Richard J. Webb

    IPC分类号： H01L21/302 ,  B32B9/04 ,  H01L23/28

    CPC分类号： B32B37/12 ,  B24B7/228 ,  B32B2310/0806 ,  B32B2457/14 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2221/68386 ,  Y10T428/31663

    摘要： Provided is a laminated body comprising a substrate to be ground and a support, where the substrate may be ground to a very small (thin) thickness and can then be separated from the support without damaging the substrate. One embodiment is a laminated body comprising a substrate to be ground, a curable silicone adhesive layer in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the adhesive layer, the laminated body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.

    摘要翻译： 提供了一种层叠体，其包括待研磨的基底和支撑体，其中基底可被研磨成非常小（薄）的厚度，然后可以与支撑体分离而不损坏基底。 一个实施方案是一种层压体，其包括待研磨的基材，与待研磨基材接触的可固化的硅氧烷粘合剂层，包含光吸收剂和可热分解树脂的光热转换层和透光载体。 在与粘合剂层接触的基板表面研磨后，通过透光层照射层叠体，分解光热转换层，分离基板和透光支撑体。

    LAYERED BODY AND METHOD FOR MANUFACTURING THIN SUBSTRATE USING THE LAYERED BODY
    9.
    发明申请
    LAYERED BODY AND METHOD FOR MANUFACTURING THIN SUBSTRATE USING THE LAYERED BODY 审中-公开
    层状体和使用层状体制造薄衬底的方法

    公开(公告)号：US20090017323A1

    公开(公告)日：2009-01-15

    申请号：US11777328

    申请日：2007-07-13

    申请人： Richard J. WEBB ,  Michael A. Kropp

    发明人： Richard J. WEBB ,  Michael A. Kropp

    IPC分类号： H01L21/469

    CPC分类号： H01L21/304 ,  B32B37/12 ,  B32B43/006 ,  B32B2309/68 ,  B32B2457/14 ,  C09J7/29 ,  C09J2203/326 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  Y10T428/31931

    摘要： Provided is a layered body comprising a substrate to be ground and a support, where the substrate may be ground to a very small (thin) thickness and can then be separated from the support without damaging the substrate. One embodiment is a layered body comprising a substrate to be ground, a joining layer including a curable adhesive in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the joining layer, the layered body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.

    摘要翻译： 提供了一种分层体，其包括待研磨的基底和支撑体，其中基底可以被研磨成非常小（薄）的厚度，然后可以与载体分离而不损坏基底。 一个实施方案是包括待研磨的基材的层状体，包含与待研磨基材接触的可固化粘合剂的接合层，包含光吸收剂和可热分解树脂的光热转换层和透光性支持体。 在与接合层接触的基板表面研磨后，层叠体通过透光层照射，光热转换层分解，分离基板和透光支撑体。