摘要:
The present invention is an article useful in the field of wafer processing, for example. The article includes a substrate, a leveling layer, a joining layer, a photothermal conversion layer and a temporary carrier. The substrate has a first major surface, a second major surface and at least one three dimensional topographical feature extending from the first major surface and having an initial step height. The leveling layer is positioned adjacent to the first major surface and reduces a topography of the substrate to between about 5% and about 95% of the initial step height. The joining layer is positioned adjacent to the leveling layer and further reduces the topography of the substrate to less than about 20% of the initial step height. The photothermal conversion layer is positioned adjacent to the joining layer and the temporary carrier is positioned adjacent the photothermal conversion layer.
摘要:
A curable adhesive composition is disclosed comprising: at least one free radically polymerizable oligomer component; optionally at least one diluent monomer; at least one perfluorinated ether monomer; and a photoinitiator. The curable liquid adhesive is easily removable with low force and low adhesive transfer.
摘要:
Provided is a layered body including a substrate to be ground and a support, where the substrate may be ground to a very small (thin) thickness and can then be separated from the support without damaging the substrate. One embodiment is a layered body including a substrate to be ground, a joining layer having a curable acrylate polymer and a curable acrylate adhesion modifying agent in contact with the substrate to be ground, a photothermal conversion layer having a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the joining layer, the layered body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.
摘要:
A curable composition includes polyepoxide, high-melting metal particles having a melting point above 300° C., low-melting metallic particles having a melting point of less than or equal to 300° C., and a fluxing curing agent comprising a fluxing curing agent comprising: a hydroxyalkyl-substituted tertiary amine, and at least one diacid compound represented by the formula: HO2C—Z1—CH2CH2CH2—Z2—CO2H wherein Z1 and Z2 independently represent a covalent bond or an aliphatic hydrocarbylene group. The at least one diacid compound comprises at least 50 percent of the total weight of carboxylic acids and anhydrides present in the curable composition. Articles comprising the curable composition, and methods of making the same are also disclosed.
摘要:
Provided is a single layer adhesive that provides the appropriate balance of adhesion and clean release required for a wafer dicing function and also provides the necessary bond required in a subsequent die attach step. The adhesive composition comprises an acrylate ester polymer having a functional group, a multi-functional thermosetting resin, wherein the acrylate ester polymer and the thermosetting resin are capable of reacting with each other, a multi-functional acrylate ester, an acrylate ester polymerization catalyst or curing agent, a thermally-latent catalyst suitable for curing the multi-functional thermosetting resin, and an acrylic acid salt.
摘要:
The present invention involves the use of powder coating methods to form coated abrasives. In one embodiment, the powder is in the form of a multiplicity of binder precursor particles comprising a radiation curable component. In other embodiments, the powder comprises at least one metal salt of a fatty acid and optionally an organic component that may be a thermoplastic macromolecule, a radiation curable component, and/or a thermally curable macromolecule. In either embodiment, the powder exists as a solid under the desired dry coating conditions, but is easily melted at relatively low temperatures and then solidified also at reasonably low processing temperatures. The principles of the present invention can be applied to form make coats, size coats, and/or supersize coats, as desired.
摘要:
Abrasive articles made using a coatable, addition polymerizable binder precursor composition are described, as well as methods of making same. The compositions comprise a reactive diluent compound and preferably an addition polymerizable resin, the reactive diluent being an organic compound selected to be especially effective in solubilizing aminoplast resins.
摘要:
The invention relates to an abrasive article comprising:(a) a plurality of abrasive grains; and(b) at least one binder for the abrasive grains,wherein the binder comprises a cured epoxy resin containing a polycyclic aryl, polycyclic alkyl, or cycloalkyl structure. The abrasive articles can comprise bonded, non-woven or coated abrasive articles.
摘要:
Abrasive products comprising abrasive grains bonded together or bonded to a backing by means of a binder compressing an oligomeric aminoplast resin having on average at least one pendant .alpha.,.beta.-unsaturated carbonyl group per oligomeric unit. The oligomeric aminoplast resins polymerize via free radical polymerization at the site of the .alpha.,.beta.-unsaturation. Polymerization is initiated by a source of free radicals. The source of free radicals can be generated by electron beam radiation or by an appropriate curing agent or initiator upon exposure to heat or radiation energy. The coated abrasive of this invention demonstrates improved grinding performance under severe conditions as compared with coated abrasives comprising radiation curable resins heretofore known.
摘要:
An abrasive product comprising abrasive grains bonded together or bonded to at least one major surface of a backing sheet, by a binder formed from a precursor comprising an aminoplast resin having on average at least 1.1 pendant .alpha.,.beta.-unsaturated carbonyl groups per molecule. The binder is formed by curing the precursor at the .alpha.,.beta.-unsaturated site of the carbonyl group, by radiation energy or by heat, in the presence of an appropriate initiator system. The aminoplast resin can also contain pendant amino or hydroxy functional groups, which allow polymerization with condensation curable resins, such as phenolic, melamine, urea, urethane, and furfural resins. Polymerization at the unsaturated site of .alpha.,.beta.-unsaturated carbonyl group can be effected either by radiation energy or by heat, and curing at the sites of the amino or hydroxy functional group can be subsequently effected by heat. The binder of this invention can be used to form the make coat, size coat, both coats, or as a backing treatment of a coated abrasive. The binder material can also be used in fibrous non-woven abrasive products. The binder can be used in embodiments where only a single binder coat is employed.