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    Method for manufacturing thin substrate using a laminate body
    1.
    发明授权
    Method for manufacturing thin substrate using a laminate body 有权
    使用层压体制造薄基板的方法

    公开(公告)号：US07759050B2

    公开(公告)日：2010-07-20

    申请号：US12336994

    申请日：2008-12-17

    申请人： Carl R. Kessel ,  Larry D. Boardman ,  Richard J. Webb

    发明人： Carl R. Kessel ,  Larry D. Boardman ,  Richard J. Webb

    IPC分类号： G03F7/11

    CPC分类号： B32B37/12 ,  B24B7/228 ,  B32B2310/0806 ,  B32B2457/14 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2221/68386 ,  Y10T428/31663

    摘要： Provided is a laminated body comprising a substrate to be ground and a support, where the substrate may be ground to a very small (thin) thickness and can then be separated from the support without damaging the substrate. One embodiment is a laminated body comprising a substrate to be ground, a curable silicone adhesive layer in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the adhesive layer, the laminated body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.

    摘要翻译： 提供了一种层叠体，其包括待研磨的基底和支撑体，其中基底可被研磨成非常小（薄）的厚度，然后可以与支撑体分离而不损坏基底。 一个实施方案是一种层压体，其包括待研磨的基材，与待研磨基材接触的可固化的硅氧烷粘合剂层，包含光吸收剂和可热分解树脂的光热转换层和透光载体。 在与粘合剂层接触的基板表面研磨后，通过透光层照射层叠体，分解光热转换层，分离基板和透光支撑体。

    Polishing pad with release layer
    2.
    发明授权
    Polishing pad with release layer 失效
    抛光垫与释放层

    公开(公告)号：US06746311B1

    公开(公告)日：2004-06-08

    申请号：US09490646

    申请日：2000-01-24

    申请人： Carl R. Kessel

    发明人： Carl R. Kessel

    IPC分类号： B23F2103

    CPC分类号： B24B37/245 ,  B24B37/22 ,  B24D3/28 ,  B24D11/00

    摘要： A multi-layered polishing pad for modifying a surface of a workpiece, such as a semiconductor wafer, that reduces the effort, time and cost involved with pad replacement. The polishing pad includes a polishing layer, at least one sub-pad layer adjacent the polishing layer, and an attachment layer interposed between and releasably joining the polishing layer and at least a portion of the at least one sub-pad layer. The at least one sub-pad layer may include a plurality of layers, such as at least one resilient layer, at least one rigid layer, and/or at least one layer that has both rigid and resilient characteristics. The release layer may be interposed between the polishing layer and the sub-pad or between adjacent layers of the sub-pad. Multiple release layers may be included that are interposed between the polishing layer and layers of the sub-pad, as desired. When the polishing layer and/or other sub-pad layers wear out and need to be replaced, the worn layers may be removed from the polishing pad at one or more release layers, leaving the non-worn layers of the sub-pad still attached to a polishing device. A new polishing layer with or without attached sub-pad layers may then be attached to the remaining sub-pad layers on the polishing device for continued polishing processes.

    摘要翻译： 一种用于改变诸如半导体晶片的工件的表面的多层抛光垫，其减少了垫更换所涉及的力度，时间和成本。 所述抛光垫包括抛光层，与所述抛光层相邻的至少一个子焊盘层，以及插入在所述抛光层和所述至少一个子焊盘层的至少一部分之间并可释放地接合所述抛光层的附接层。 至少一个子垫层可以包括多个层，例如至少一个弹性层，至少一个刚性层，和/或至少一个具有刚性和弹性特征的层。 剥离层可以插入在抛光层和子焊盘之间或者在子焊盘的相邻层之间。 根据需要，可以包括介于抛光层和子焊盘的层之间的多个释放层。 当抛光层和/或其它子垫层磨损并需要更换时，磨损层可以在一个或多个剥离层处从抛光垫移除，使得辅助垫的未磨损层仍然附着 到抛光装置。 然后可以将具有或不具有附接的子垫层的新抛光层附着到抛光装置上的其余子垫层以用于持续的抛光工艺。

    Silicon-containing alcohols and polymers having silicon-containing tertiary ester groups made therefrom
    3.
    发明授权
    Silicon-containing alcohols and polymers having silicon-containing tertiary ester groups made therefrom 有权
    含硅醇和由其制成的含硅叔酯基的聚合物

    公开(公告)号：US06358675B1

    公开(公告)日：2002-03-19

    申请号：US09411709

    申请日：1999-09-30

    申请人： Larry D. Boardman ,  Carl R. Kessel

    发明人： Larry D. Boardman ,  Carl R. Kessel

    IPC分类号： G03C516

    CPC分类号： C08F30/08 ,  G03F7/0045 ,  G03F7/0392 ,  G03F7/0395 ,  G03F7/0758 ,  Y10S430/106 ,  Y10S430/111 ,  Y10S430/115

    摘要： The polymers of the invention are characterized by having at least one pendent ester group having a tertiary carbon atom attached to the ester oxygen atom in which at least one substituent of the tertiary carbon atom comprises at least one silicon atom. The polymer compositions of the present invention are useful as resist materials for lithography, in particular as the imaging layer or as the top imaging layer in a bilayer resist scheme for use in the manufacture of integrated circuits. The silicon-containing tertiary alcohols and esters of the present invention enable the preparation of polymers with relatively high silicon content.

    摘要翻译： 本发明的聚合物的特征在于具有至少一个与酯氧原子连接的叔碳原子的侧链酯基，其中至少一个叔碳原子的取代基包含至少一个硅原子。 本发明的聚合物组合物可用作光刻用抗蚀剂材料，特别是作为用于制造集成电路的双层抗蚀剂方案中的成像层或顶部成像层。 本发明的含硅叔醇和酯可以制备具有较高硅含量的聚合物。

    METHOD FOR MANUFACTURING THIN SUBSTRATE USING A LAMINATE BODY
    6.
    发明申请
    METHOD FOR MANUFACTURING THIN SUBSTRATE USING A LAMINATE BODY 有权
    使用层压体制造薄基板的方法

    公开(公告)号：US20090115075A1

    公开(公告)日：2009-05-07

    申请号：US12336994

    申请日：2008-12-17

    申请人： Carl R. KESSEL ,  Larry D. Boardman ,  Richard J. Webb

    发明人： Carl R. KESSEL ,  Larry D. Boardman ,  Richard J. Webb

    IPC分类号： H01L21/302 ,  B32B9/04 ,  H01L23/28

    CPC分类号： B32B37/12 ,  B24B7/228 ,  B32B2310/0806 ,  B32B2457/14 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2221/68386 ,  Y10T428/31663

    摘要： Provided is a laminated body comprising a substrate to be ground and a support, where the substrate may be ground to a very small (thin) thickness and can then be separated from the support without damaging the substrate. One embodiment is a laminated body comprising a substrate to be ground, a curable silicone adhesive layer in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the adhesive layer, the laminated body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.

    摘要翻译： 提供了一种层叠体，其包括待研磨的基底和支撑体，其中基底可被研磨成非常小（薄）的厚度，然后可以与支撑体分离而不损坏基底。 一个实施方案是一种层压体，其包括待研磨的基材，与待研磨基材接触的可固化的硅氧烷粘合剂层，包含光吸收剂和可热分解树脂的光热转换层和透光载体。 在与粘合剂层接触的基板表面研磨后，通过透光层照射层叠体，分解光热转换层，分离基板和透光支撑体。