公开(公告)号：US20130084459A1

公开(公告)日：2013-04-04

申请号：US13249501

申请日：2011-09-30

申请人： Eric G. Larson ,  Blake R. Dronen ,  Miguel A. Guerra ,  Wayne S. Mahoney ,  Richard J. Webb

发明人： Eric G. Larson ,  Blake R. Dronen ,  Miguel A. Guerra ,  Wayne S. Mahoney ,  Richard J. Webb

IPC分类号： C09J127/12 ,  H01L21/31 ,  B32B38/10 ,  B32B27/00 ,  B32B37/12

CPC分类号： C09J4/00 ,  C09D133/16 ,  Y10T156/1158 ,  Y10T428/31544

摘要： A curable adhesive composition is disclosed comprising: at least one free radically polymerizable oligomer component; optionally at least one diluent monomer; at least one perfluorinated ether monomer; and a photoinitiator. The curable liquid adhesive is easily removable with low force and low adhesive transfer.

摘要翻译： 公开了一种可固化粘合剂组合物，其包含：至少一种可自由基聚合的低聚物组分; 任选地至少一种稀释剂单体; 至少一种全氟化醚单体; 和光引发剂。 可固化液体粘合剂易于以低力和低粘合剂转移移除。

公开(公告)号：US07759050B2

公开(公告)日：2010-07-20

申请号：US12336994

申请日：2008-12-17

申请人： Carl R. Kessel ,  Larry D. Boardman ,  Richard J. Webb

发明人： Carl R. Kessel ,  Larry D. Boardman ,  Richard J. Webb

IPC分类号： G03F7/11

CPC分类号： B32B37/12 ,  B24B7/228 ,  B32B2310/0806 ,  B32B2457/14 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2221/68386 ,  Y10T428/31663

摘要： Provided is a laminated body comprising a substrate to be ground and a support, where the substrate may be ground to a very small (thin) thickness and can then be separated from the support without damaging the substrate. One embodiment is a laminated body comprising a substrate to be ground, a curable silicone adhesive layer in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the adhesive layer, the laminated body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.

摘要翻译： 提供了一种层叠体，其包括待研磨的基底和支撑体，其中基底可被研磨成非常小（薄）的厚度，然后可以与支撑体分离而不损坏基底。 一个实施方案是一种层压体，其包括待研磨的基材，与待研磨基材接触的可固化的硅氧烷粘合剂层，包含光吸收剂和可热分解树脂的光热转换层和透光载体。 在与粘合剂层接触的基板表面研磨后，通过透光层照射层叠体，分解光热转换层，分离基板和透光支撑体。

公开(公告)号：US06786810B2

公开(公告)日：2004-09-07

申请号：US10253559

申请日：2002-09-24

申请人： Michael J. Muilenburg ,  Chong-Yong J. Kim ,  Jerry J. Fizel ,  Richard J. Webb ,  John J. Gagliardi ,  Daniel B. Pendergrass, Jr. ,  Robert J. Streifel ,  Wesley J. Bruxvoort

发明人： Michael J. Muilenburg ,  Chong-Yong J. Kim ,  Jerry J. Fizel ,  Richard J. Webb ,  John J. Gagliardi ,  Daniel B. Pendergrass, Jr. ,  Robert J. Streifel ,  Wesley J. Bruxvoort

IPC分类号： B24B500

CPC分类号： B24D11/005 ,  B24B37/013 ,  B24B37/205

摘要： A process for planarizing, polishing, or providing other modification of a wafer surface or other workpiece. The process includes using an abrasive article having a textured abrasive coating affixed to a backing. The abrasive article includes a monitoring element, such as a window, to allow transmission of radiation therethrough. The radiation level is monitored throughout the planarization process to determine the approach of the desired endpoint. The window in the abrasive coating can be an area devoid of abrasive coating or having minimal or a thinned abrasive coating.

摘要翻译： 用于对晶片表面或其它工件进行平面化，抛光或提供其它修改的工艺。 该方法包括使用具有附着在背衬上的纹理磨料涂层的磨料制品。 研磨制品包括诸如窗口的监测元件，以允许辐射透过其中。 在整个平坦化过程中监测辐射水平以确定所需端点的方法。 研磨涂层中的窗口可以是没有研磨涂层或具有最小或变薄的磨料涂层的区域。

公开(公告)号：US06604985B2

公开(公告)日：2003-08-12

申请号：US10289750

申请日：2002-11-07

申请人： Michael J. Muilenburg ,  Chong-Yong J. Kim ,  Jerry J. Fizel ,  Richard J. Webb ,  John J. Gagliardi ,  Daniel B. Pendergrass, Jr. ,  Robert J. Streifel ,  Wesley J. Bruxvoort

发明人： Michael J. Muilenburg ,  Chong-Yong J. Kim ,  Jerry J. Fizel ,  Richard J. Webb ,  John J. Gagliardi ,  Daniel B. Pendergrass, Jr. ,  Robert J. Streifel ,  Wesley J. Bruxvoort

IPC分类号： B24B4900

CPC分类号： B24D11/005 ,  B24B37/013 ,  B24B37/205

摘要： A process for planarizing, polishing, or providing other modification of a wafer surface or other workpiece. The process includes using an abrasive article having a textured abrasive coating affixed to a backing. The abrasive article includes a monitoring element, such as a window, to allow transmission of radiation therethrough. The radiation level is monitored throughout the planarization process to determine the approach of the desired endpoint. The window in the abrasive coating can be an area devoid of abrasive coating or having minimal or a thinned abrasive coating.

公开(公告)号：US5692950A

公开(公告)日：1997-12-02

申请号：US694357

申请日：1996-08-08

申请人： Denise R. Rutherford ,  Douglas P. Goetz ,  Cristina U. Thomas ,  Richard J. Webb ,  Wesley J. Bruxvoort ,  James D. Buhler ,  William J. Hollywood

发明人： Denise R. Rutherford ,  Douglas P. Goetz ,  Cristina U. Thomas ,  Richard J. Webb ,  Wesley J. Bruxvoort ,  James D. Buhler ,  William J. Hollywood

IPC分类号： B24D11/02 ,  B24B37/22 ,  B24B37/24 ,  B24D3/00 ,  B24D3/28 ,  B24D3/34 ,  B24D11/00 ,  B24D13/14 ,  B23F21/03

CPC分类号： B24B37/245 ,  B24B37/22 ,  B24D3/001 ,  B24D3/28

摘要： An abrasive construction for modifying a surface of a workpiece, such as a semiconductor wafer. The abrasive construction comprises: a three-dimensional, textured, fixed abrasive element; at least one resilient element generally coextensive with the fixed abrasive element; and at least one rigid element generally coextensive with and interposed between the resilient element and the fixed abrasive element, wherein the rigid element has a Young's Modulus greater than that of the resilient element.

摘要翻译： 用于改变诸如半导体晶片的工件的表面的研磨结构。 研磨结构包括：三维，有纹理，固定的研磨元件; 至少一个与所述固定研磨元件共同延伸的弹性元件; 以及至少一个与弹性元件和固定研磨元件共同延伸并插入其中的刚性元件，其中刚性元件的杨氏模量大于弹性元件的杨氏模量。

公开(公告)号：US07950189B1

公开(公告)日：2011-05-31

申请号：US12814986

申请日：2010-06-14

申请人： James A. Walker ,  Taylor C. Culpepper ,  Richard J. Webb ,  John R. Pierson

发明人： James A. Walker ,  Taylor C. Culpepper ,  Richard J. Webb ,  John R. Pierson

IPC分类号： E04F19/00

CPC分类号： A61G12/005 ,  E04F17/08 ,  E04H3/08

摘要： A modular in-wall medical services unit for medical care facilities. A frame supports a cabinet with a cover panel providing electrical and/or gas outlets. Built-in electrical and gas conduits are included. A junction box and ends of the gas conduits near the top of the frame are accessible after wallboard is applied. Thus, wallboard can be installed before or after wiring is completed and gas connections are made. The self-aligning cover panel is “floatingly” supported on the frame so that a bead of sealant can be applied around the edge before the cover panel is “snugged up” to the wall and secured. The trim flanges on the cover panel include vertical equipment mounting tracks. Manufacturing is simplified by making the height of the frame adjustable; the same frame elements can be used to assemble units for different ceiling heights, decreasing the number of required parts in inventory and expediting assembly.

摘要翻译： 用于医疗设施的模块化内墙医疗服务单元。 框架支撑具有盖板的机柜，其提供电气和/或气体出口。 内置电气和气体管道。 接线盒和框架顶部附近的气体导管的端部可在墙板应用后进入。 因此，在布线完成之前或之后可以安装墙板，并且进行气体连接。 自对准盖板被“浮动地”支撑在框架上，使得在盖板被“贴合”到壁并固定之前，可以在边缘周围施加密封剂珠。 盖板上的装饰法兰包括垂直设备安装轨道。 通过使框架的高度可调，简化制造; 相同的框架元件可用于组装不同天花板高度的单元，减少库存中所需零件的数量并加快组装。

公开(公告)号：US20090115075A1

公开(公告)日：2009-05-07

申请号：US12336994

申请日：2008-12-17

申请人： Carl R. KESSEL ,  Larry D. Boardman ,  Richard J. Webb

发明人： Carl R. KESSEL ,  Larry D. Boardman ,  Richard J. Webb

IPC分类号： H01L21/302 ,  B32B9/04 ,  H01L23/28

CPC分类号： B32B37/12 ,  B24B7/228 ,  B32B2310/0806 ,  B32B2457/14 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2221/68386 ,  Y10T428/31663

摘要： Provided is a laminated body comprising a substrate to be ground and a support, where the substrate may be ground to a very small (thin) thickness and can then be separated from the support without damaging the substrate. One embodiment is a laminated body comprising a substrate to be ground, a curable silicone adhesive layer in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the adhesive layer, the laminated body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.

摘要翻译： 提供了一种层叠体，其包括待研磨的基底和支撑体，其中基底可被研磨成非常小（薄）的厚度，然后可以与支撑体分离而不损坏基底。 一个实施方案是一种层压体，其包括待研磨的基材，与待研磨基材接触的可固化的硅氧烷粘合剂层，包含光吸收剂和可热分解树脂的光热转换层和透光载体。 在与粘合剂层接触的基板表面研磨后，通过透光层照射层叠体，分解光热转换层，分离基板和透光支撑体。

公开(公告)号：US20090017323A1

公开(公告)日：2009-01-15

申请号：US11777328

申请日：2007-07-13

申请人： Richard J. WEBB ,  Michael A. Kropp

发明人： Richard J. WEBB ,  Michael A. Kropp

IPC分类号： H01L21/469

CPC分类号： H01L21/304 ,  B32B37/12 ,  B32B43/006 ,  B32B2309/68 ,  B32B2457/14 ,  C09J7/29 ,  C09J2203/326 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  Y10T428/31931

摘要： Provided is a layered body comprising a substrate to be ground and a support, where the substrate may be ground to a very small (thin) thickness and can then be separated from the support without damaging the substrate. One embodiment is a layered body comprising a substrate to be ground, a joining layer including a curable adhesive in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the joining layer, the layered body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.

摘要翻译： 提供了一种分层体，其包括待研磨的基底和支撑体，其中基底可以被研磨成非常小（薄）的厚度，然后可以与载体分离而不损坏基底。 一个实施方案是包括待研磨的基材的层状体，包含与待研磨基材接触的可固化粘合剂的接合层，包含光吸收剂和可热分解树脂的光热转换层和透光性支持体。 在与接合层接触的基板表面研磨后，层叠体通过透光层照射，光热转换层分解，分离基板和透光支撑体。

公开(公告)号：US06997785B1

公开(公告)日：2006-02-14

申请号：US11020287

申请日：2004-12-23

申请人： Christopher J. Rueb ,  Richard J. Webb ,  Bhaskar V. Velamakanni

发明人： Christopher J. Rueb ,  Richard J. Webb ,  Bhaskar V. Velamakanni

IPC分类号： B24B1/00

CPC分类号： C09G1/04 ,  H01L21/31053

摘要： A wafer polishing solution and method for polishing a wafer comprising an amino acid and calcium ions or barium ions. The wafer polishing solution can be adjusted to control cut rate and selectivity for modifying semiconductor wafers using a fixed abrasive CMP process.

公开(公告)号：US20120034426A1

公开(公告)日：2012-02-09

申请号：US12850772

申请日：2010-08-05

申请人： Richard J. Webb ,  Wayne S. Mahoney ,  Eric G. Larson

发明人： Richard J. Webb ,  Wayne S. Mahoney ,  Eric G. Larson

IPC分类号： B32B3/30 ,  B32B38/00 ,  B32B37/02

CPC分类号： H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381 ,  Y10T156/10 ,  Y10T428/24612

摘要： The present invention is an article useful in the field of wafer processing, for example. The article includes a substrate, a leveling layer, a joining layer, a photothermal conversion layer and a temporary carrier. The substrate has a first major surface, a second major surface and at least one three dimensional topographical feature extending from the first major surface and having an initial step height. The leveling layer is positioned adjacent to the first major surface and reduces a topography of the substrate to between about 5% and about 95% of the initial step height. The joining layer is positioned adjacent to the leveling layer and further reduces the topography of the substrate to less than about 20% of the initial step height. The photothermal conversion layer is positioned adjacent to the joining layer and the temporary carrier is positioned adjacent the photothermal conversion layer.

摘要翻译： 本发明是例如在晶片加工领域中有用的物品。 该制品包括基底，平整层，接合层，光热转换层和临时载体。 衬底具有从第一主表面延伸并且具有初始台阶高度的第一主表面，第二主表面和至少一个三维形貌特征。 平整层定位成与第一主表面相邻并且将基底的形貌减小到初始台阶高度的约5％至约95％之间。 接合层定位成与流平层相邻并进一步将衬底的形貌减小到小于初始台阶高度的约20％。 光热转换层位于接合层附近，临时载体位于光热转换层附近。