公开(公告)号：US07686204B2

公开(公告)日：2010-03-30

申请号：US11645943

申请日：2006-12-27

申请人： Kuniyuki Takahashi ,  Shinsuke Tei ,  Noriko Suzuki ,  Noriko Mori ,  Shinji Maki

发明人： Kuniyuki Takahashi ,  Shinsuke Tei ,  Noriko Suzuki ,  Noriko Mori ,  Shinji Maki

IPC分类号： B23K31/02 ,  B23K37/00

CPC分类号： H01L24/85 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/85045 ,  H01L2224/851 ,  H01L2224/85181 ,  H01L2224/859 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/3011 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A wire bonding apparatus including a bonding control section provided with an electrical non-bonding detector, an optical non-bonding detector, and an optical shape detector, which are for detecting non-bonding between a first bonding point and a bonding wire; and when non-bonding is detected by the electrical non-bonding detector and non-bonding is also detected by the optical non-bonding detector, then the tip end of the bonding wire is reformed by, based on the shape of the tip end of the bonding wire detected by the optical shape detector, a ball formation device into a ball of a prescribed shape, and rebonding is performed at the first bonding point.

公开(公告)号：US20070187138A1

公开(公告)日：2007-08-16

申请号：US11645943

申请日：2006-12-27

申请人： Kuniyuki Takahashi ,  Shinsuke Tei ,  Noriko Suzuki ,  Noriko Mori ,  Shinji Maki

发明人： Kuniyuki Takahashi ,  Shinsuke Tei ,  Noriko Suzuki ,  Noriko Mori ,  Shinji Maki

IPC分类号： H05K1/09 ,  H05K3/30

CPC分类号： H01L24/85 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/85045 ,  H01L2224/851 ,  H01L2224/85181 ,  H01L2224/859 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/3011 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A wire bonding apparatus including a bonding control section provided with an electrical non-bonding detector, an optical non-bonding detector, and an optical shape detector, which are for detecting non-bonding between a first bonding point and a bonding wire; and when non-bonding is detected by the electrical non-bonding detector and non-bonding is also detected by the optical non-bonding detector, then the tip end of the bonding wire is reformed by, based on the shape of the tip end of the bonding wire detected by the optical shape detector, a ball formation device into a ball of a prescribed shape, and rebonding is performed at the first bonding point.

摘要翻译： 一种引线接合装置，包括具有用于检测第一接合点和接合线之间的非接合的非电接触检测器，光学非接合检测器和光学形状检测器的接合控制部分; 并且当通过电非接合检测器检测到非接合时，也通过光学非粘合检测器检测非粘合，然后基于顶端的形状将接合线的末端重新形成 由光学形状检测器检测到的接合线，将球形成装置成为规定形状的球，并且在第一接合点进行重新接合。

公开(公告)号：US6145651A

公开(公告)日：2000-11-14

申请号：US282886

申请日：1999-03-31

申请人： Minoru Torihata ,  Shinji Maki

发明人： Minoru Torihata ,  Shinji Maki

IPC分类号： H01L21/60 ,  B23K20/00 ,  H01L21/50 ,  H01L21/52 ,  H01L21/68 ,  H05K13/00 ,  B65G19/18

CPC分类号： H01L24/78 ,  B23K20/004 ,  H01L21/68 ,  H05K13/0061 ,  H01L2224/78 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082

摘要： A guide rail mechanism for a bonding apparatus for transferring a workpiece such as a lead frame, etc. including a pair of guide rails each comprising an edge surface guide rail element for guiding the edge surface of the workpiece and an undersurface guide rail element disposed beneath the edge surface guide rail element so as to support the undersurface of the edge portion of the workpiece. A driver for the undersurface guide rail element comprised of a rotational shaft with an eccentric cam portion and other parts is installed so as to move the undersurface guide rail element, thus changing the positional relationship between the edge surface guide rail element and the undersurface guide rail element for workpieces of different thicknesses.

摘要翻译： 一种用于传送诸如引线框架等的工件的接合装置的导轨机构，包括一对导轨，每个导轨包括用于引导工件的边缘表面的边缘表面导轨元件和设置在工件下方的下表面导轨元件 边缘表面导轨元件，以支撑工件的边缘部分的下表面。 安装有由具有偏心凸轮部分的旋转轴和其它部件构成的下表面导轨元件的驱动器，以便移动下表面导轨元件，从而改变边缘导轨元件与下导轨之间的位置关系 元件用于不同厚度的工件。

公开(公告)号：US5988481A

公开(公告)日：1999-11-23

申请号：US13782

申请日：1998-01-26

申请人： Minoru Torihata ,  Shinji Maki

发明人： Minoru Torihata ,  Shinji Maki

IPC分类号： H01L21/60 ,  B23K20/00 ,  B23K37/02 ,  H01L21/00 ,  H01L21/50 ,  H01L21/52 ,  B23K1/00 ,  B23K37/04 ,  B30B5/02

CPC分类号： H01L21/67144 ,  B23K37/0235 ,  H01L21/67103 ,  B23K20/004 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2924/01039 ,  Y10T29/41

摘要： A bonding apparatus including a pair of guide rails, a main heating block and a pair of pre-stage and after-stage heating blocks so as to heat a lead frame conveyed on the pair of guide rails, and the pre-stage and after-stage heating blocks can be moved in the direction of width of the lead frame together with one of the pair of guide rails and are installed so that they are positioned beneath the other frame guide rail.

摘要翻译： 一种接合装置，包括一对导轨，主加热块和一对前级和后级加热块，以便加热在一对导轨上传送的引线架，以及前级和后级加热块， 阶段加热块可以与引导框架的宽度方向一起沿着一对导轨中的一个移动，并且被安装成使得它们位于另一个框架导轨的下方。

公开(公告)号：US5501569A

公开(公告)日：1996-03-26

申请号：US372880

申请日：1995-01-13

申请人： Nobuto Yamazaki ,  Minoru Torihata ,  Shinji Maki

发明人： Nobuto Yamazaki ,  Minoru Torihata ,  Shinji Maki

IPC分类号： B23Q1/00 ,  B23Q1/38 ,  B23Q1/62 ,  B65G7/06 ,  F16C29/02 ,  F16C32/06 ,  H01L21/683 ,  H05K13/00

CPC分类号： H05K13/0069 ,  B23Q1/38 ,  B23Q1/621 ,  F16C29/025 ,  F16C32/0614 ,  H01L21/6838

摘要： A non-contact type moving table including a guide table having a flat guide surface at the top and a moving table which is placed on the guide table and has a moving surface which faces the guide surface of the guide table. The moving table has air blowing openings that blow out compressed air towards the guide surface of the guide table and air suction openings sucking air from the guide surface of the guide table, thus obtaining a single plane, non-contact type bearing or supporting system via the guide surface and the moving surface. As a result, the structure is simple and overall size can be small with low manufacturing costs. In addition, a wide range of materials can be used to build the moving table system.

公开(公告)号：US07857190B2

公开(公告)日：2010-12-28

申请号：US12657928

申请日：2010-01-29

申请人： Kuniyuki Takahashi ,  Shinsuke Tei ,  Noriko Suzuki ,  Noriko Mori ,  Shinji Maki

发明人： Kuniyuki Takahashi ,  Shinsuke Tei ,  Noriko Suzuki ,  Noriko Mori ,  Shinji Maki

IPC分类号： B23K31/02 ,  B23K37/00

CPC分类号： H01L24/85 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/85045 ,  H01L2224/851 ,  H01L2224/85181 ,  H01L2224/859 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/3011 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A wire bonding apparatus including a bonding control section provided with an electrical non-bonding detector, an optical non-bonding detector, and an optical shape detector, which are for detecting non-bonding between a first bonding point and a bonding wire; and when non-bonding is detected by the electrical non-bonding detector and non-bonding is also detected by the optical non-bonding detector, then the tip end of the bonding wire is reformed by, based on the shape of the tip end of the bonding wire detected by the optical shape detector, a ball formation device into a ball of a prescribed shape, and rebonding is performed at the first bonding point.

摘要翻译： 一种引线接合装置，包括具有用于检测第一接合点和接合线之间的非接合的非电接触检测器，光学非接合检测器和光学形状检测器的接合控制部分; 并且当通过电非接合检测器检测到非接合时，也通过光学非粘合检测器检测非粘合，然后基于顶端的形状将接合线的末端重新形成 由光学形状检测器检测到的接合线，将球形成装置成为规定形状的球，并且在第一接合点进行重新接合。

公开(公告)号：US5564616A

公开(公告)日：1996-10-15

申请号：US416995

申请日：1995-04-05

申请人： Minoru Torihata ,  Shinji Maki

发明人： Minoru Torihata ,  Shinji Maki

IPC分类号： H01L21/60 ,  B23K20/00

CPC分类号： H01L24/78 ,  B23K20/005 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/851 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01023 ,  H01L2924/01033

摘要： A device for applying tension to a bonding wire installed between a wire spool and a capillary of a wire bonding apparatus including a nozzle for blowing out a gas for applying tension to the wire and a single gas guide plate installed along the direction of the flow of the gas blown out of the nozzle so as to guide the gas to the bonding wire.

摘要翻译： 一种用于对安装在电线卷轴和引线接合装置的毛细管之间的接合线施加张力的装置，包括用于吹出用于向线材施加张力的气体的喷嘴和沿着流动方向安装的单个气体导向板 从喷嘴吹出的气体以将气体引导到接合线。

公开(公告)号：US20100206849A1

公开(公告)日：2010-08-19

申请号：US12657928

申请日：2010-01-29

申请人： Kuniyuki Takahashi ,  Shinsuke Tei ,  Noriko Suzuki ,  Noriko Mori ,  Shinji Maki

发明人： Kuniyuki Takahashi ,  Shinsuke Tei ,  Noriko Suzuki ,  Noriko Mori ,  Shinji Maki

IPC分类号： B21F99/00

CPC分类号： H01L24/85 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/85045 ,  H01L2224/851 ,  H01L2224/85181 ,  H01L2224/859 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/3011 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A wire bonding apparatus including a bonding control section provided with an electrical non-bonding detector, an optical non-bonding detector, and an optical shape detector, which are for detecting non-bonding between a first bonding point and a bonding wire; and when non-bonding is detected by the electrical non-bonding detector and non-bonding is also detected by the optical non-bonding detector, then the tip end of the bonding wire is reformed by, based on the shape of the tip end of the bonding wire detected by the optical shape detector, a ball formation device into a ball of a prescribed shape, and rebonding is performed at the first bonding point.

公开(公告)号：US5439341A

公开(公告)日：1995-08-08

申请号：US101847

申请日：1993-08-04

申请人： Nobuto Yamazaki ,  Minoru Torihata ,  Shinji Maki

发明人： Nobuto Yamazaki ,  Minoru Torihata ,  Shinji Maki

IPC分类号： B23Q1/00 ,  B23Q1/38 ,  B23Q1/62 ,  B65G7/06 ,  F16C29/02 ,  F16C32/06 ,  H01L21/683 ,  H05K13/00

CPC分类号： H05K13/0069 ,  B23Q1/38 ,  B23Q1/621 ,  F16C29/025 ,  F16C32/0614 ,  H01L21/6838

摘要： A non-contact type moving table including a guide table having a flat guide surface at the top and a moving table which is placed on the guide table and has a moving surface which faces the guide surface of the guide table. The moving table has air blowing openings that blow out compressed air towards the guide surface of the guide table and air suction openings sucking air from the guide surface of the guide table, thus obtaining a single plane, non-contact type bearing or supporting system via the guide surface and the moving surface. As a result, the structure is simple and overall size can be small with low manufacturing costs. In addition, a wide range of materials can be used to build the moving table system.

摘要翻译： 一种非接触式移动台，包括：顶部具有平坦的引导表面的引导台和放置在引导台上并且具有面向引导台的引导表面的移动表面的移动台。 移动台具有吹送压缩空气朝向引导台的引导表面的空气吹出口，空气吸入口从引导台的引导表面吸入空气，从而获得单一平面，非接触型轴承或支撑系统，通过 引导面和移动面。 结果，结构简单，整体尺寸可以小，制造成本低。 此外，可以使用各种材料来构建移动台系统。

公开(公告)号：US20100133322A1

公开(公告)日：2010-06-03

申请号：US12657913

申请日：2010-01-29

申请人： Kuniyuki Takahashi ,  Shinsuke Tei ,  Noriko Suzuki ,  Noriko Mori ,  Shinji Maki

发明人： Kuniyuki Takahashi ,  Shinsuke Tei ,  Noriko Suzuki ,  Noriko Mori ,  Shinji Maki

IPC分类号： B23K20/00 ,  B23K37/00

CPC分类号： H01L24/85 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/85045 ,  H01L2224/851 ,  H01L2224/85181 ,  H01L2224/859 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/3011 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A wire bonding apparatus including a bonding control section provided with an electrical non-bonding detector, an optical non-bonding detector, and an optical shape detector, which are for detecting non-bonding between a first bonding point and a bonding wire; and when non-bonding is detected by the electrical non-bonding detector and non-bonding bonding is also detected by the optical non-bonding detector, then the tip end of the bonding wire is reformed by, based on the shape of the tip end of the bonding wire detected by the optical shape detector, a ball formation device into a ball of a prescribed shape, and rebonding is performed at the first bonding point.

摘要翻译： 一种引线接合装置，包括具有用于检测第一接合点和接合线之间的非接合的非电接触检测器，光学非接合检测器和光学形状检测器的接合控制部分; 并且当通过电非接合检测器检测非接合时，也可以通过光学非粘合检测器检测非接合，然后基于尖端的形状来改变接合线的末端 由光学形状检测器检测到的接合线，将球形成装置设置成规定形状的球，并且在第一接合点进行重新接合。