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24 条记录 (耗时 0.018 秒)

    Anti-rotation for wire probes in a probe head of a die tester
    1.
    发明授权
    Anti-rotation for wire probes in a probe head of a die tester 有权
    在模具测试仪的探头中的线探头的防旋转

    公开(公告)号：US09535095B2

    公开(公告)日：2017-01-03

    申请号：US14013422

    申请日：2013-08-29

    申请人： David Shia ,  Todd P. Albertson ,  Keith J. Martin

    发明人： David Shia ,  Todd P. Albertson ,  Keith J. Martin

    IPC分类号： G01R1/073 ,  G01R1/067 ,  G01R3/00

    CPC分类号： G01R1/07371 ,  G01R1/06733 ,  G01R1/07357 ,  G01R3/00 ,  Y10T29/49124

    摘要： Wire probes are described that resist rotation during assembly into a probe head of a die tester. One example includes probe wires with a protrusion at a pre-determined position along the length of the wire. A probe substrate with pads on one side each to attach to and electrically connect with a probe wire and a pads on the opposite side to connect to test equipment and a probe holder above the substrate with holes. Each hole holds a respective one of the probe wires against the probe substrate. Each hole also has a key to mate with a protrusion of a respective probe wire so that the protrusions engage the keys to prevent rotation of the respective wire.

    摘要翻译： 描述了在组装到模具测试器的探针头期间抵抗旋转的线探针。 一个例子包括沿导线长度的预定位置具有突起的探针线。 探针基板，其一侧具有焊盘，每个探针基板附接到探针线和相对侧上的电极，以连接到测试设备，并且在基板上方具有孔。 每个孔将相应的探针线保持在探针基板上。 每个孔还具有与相应探针线的突起配合的键，使得突起接合键以防止相应线的旋转。

    Sort probe gripper
    2.
    发明授权
    Sort probe gripper 有权
    分选探针夹具

    公开(公告)号：US09134343B2

    公开(公告)日：2015-09-15

    申请号：US13630141

    申请日：2012-09-28

    申请人： David Shia ,  Todd P. Albertson

    发明人： David Shia ,  Todd P. Albertson

    IPC分类号： G01R31/00 ,  G01R1/067 ,  G01R3/00 ,  G01R1/073

    CPC分类号： G01R1/06705 ,  G01R1/07307 ,  G01R3/00

    摘要： An apparatus includes a robot and a sort probe gripper. The sort probe gripper includes a body, a jaw mount inserted into the body, a plurality of grippers mounted in the jaw mount and an actuator sleeve slidable along the body to engage the plurality of grippers.

    摘要翻译： 一种装置包括机器人和分选探针夹持器。 分类探针夹持器包括主体，插入到主体中的卡爪安装件，安装在卡爪安装件中的多个夹具和可沿主体滑动以与多个夹持器接合的致动器套筒。

    Micro positioning test socket and methods for active precision alignment and co-planarity feedback
    5.
    发明授权
    Micro positioning test socket and methods for active precision alignment and co-planarity feedback 有权
    微定位测试插座和主动精密对准和共平面反馈的方法

    公开(公告)号：US08710858B2

    公开(公告)日：2014-04-29

    申请号：US12888579

    申请日：2010-09-23

    申请人： Abram M Detofsky ,  Todd P Albertson ,  David Shia

    发明人： Abram M Detofsky ,  Todd P Albertson ,  David Shia

    IPC分类号： G01R31/00

    CPC分类号： G01R1/0408 ,  G01B7/31 ,  G01R1/0483 ,  G01R1/06794 ,  G01R31/2891 ,  H05K1/0268 ,  H05K2203/162 ,  H05K2203/166

    摘要： Methods and structures for testing a microelectronic packaging structure/device are described. Those methods may include placing a device in a floating carrier, wherein the floating carrier is coupled to a socket housing by pin dowels disposed in four corners of the socket housing, and wherein at least two actuating motors are disposed within the socket housing, and micro adjusting the device by utilizing a capacitive coupled or a fiber optic alignment system wherein a maximum measured capacitance or maximum measured intensity between alignment structures disposed in the socket housing and alignment package balls disposed within the device indicate optimal alignment of the device. Methods further include methods for active co-planarity detection through the use of a capacitive-coupled techniques.

    摘要翻译： 描述了用于测试微电子封装结构/器件的方法和结构。 这些方法可以包括将设备放置在浮动载体中，其中浮动载体通过设置在插座壳体的四个角落中的销钉联接到插座壳体，并且其中至少两个致动马达设置在插座壳体内，并且微型 通过利用电容耦合或光纤对准系统来调节装置，其中设置在插座壳体中的对准结构和设置在装置内的对准封装球之间的最大测量电容或最大测量强度表示装置的最佳对准。 方法还包括通过使用电容耦合技术进行有源共平面检测的方法。

    Temperature and voltage controlled integrated circuit processes
    6.
    发明授权
    Temperature and voltage controlled integrated circuit processes 有权
    温控电压集成电路

    公开(公告)号：US07345495B2

    公开(公告)日：2008-03-18

    申请号：US10882905

    申请日：2004-06-30

    申请人： Daniel J. Dangelo ,  Todd P. Albertson ,  Hon Lee Kon ,  Jin Pan

    发明人： Daniel J. Dangelo ,  Todd P. Albertson ,  Hon Lee Kon ,  Jin Pan

    IPC分类号： G01R31/02 ,  G01R31/28

    CPC分类号： G01R31/2879 ,  G01R31/2863 ,  G01R31/2874 ,  G01R31/2886

    摘要： The present application relates to apparatus and methods for burn-in and other diagnostics performed on integrated circuits. In one embodiment, the invention includes a plurality of sockets, each to hold an integrated circuit (IC), and coupling power to the respective IC from a remote power supply, a plurality of voltage detectors, each coupled to a socket to sense the voltage of the power coupled to the respective IC, and a plurality of remote voltage regulators, each coupled between the power supply and a respective socket, to receive the sensed voltage from the respective voltage detector and to adjust the voltage of the respective coupled power in accordance therewith.

    摘要翻译： 本申请涉及在集成电路上执行的用于老化和其他诊断的装置和方法。 在一个实施例中，本发明包括多个插座，每个插座用于保持集成电路（IC），并且从远程电源（多个电压检测器）将功率耦合到相应的IC，每个电压检测器耦合到插座以感测电压 耦合到相应IC的功率，以及多个远程电压调节器，每个远程电压调节器分别耦合在电源和相应的插座之间，以从相应的电压检测器接收感测的电压，并根据相应的电压调节相应的耦合功率的电压 随之而来。

    Anticyclone powered active thermal control unit
    7.
    发明授权
    Anticyclone powered active thermal control unit 失效
    反气动动力主动热控单元

    公开(公告)号：US06360544B1

    公开(公告)日：2002-03-26

    申请号：US09741454

    申请日：2000-12-19

    申请人： Todd P. Albertson

    发明人： Todd P. Albertson

    IPC分类号： F25B2102

    CPC分类号： F25B21/04

    摘要： A thermal control unit for regulating the temperature of a component or device under test is disclosed. The thermal control unit includes a three-dimensional control structure having a base member and an extension member extending from one surface of the base member to divide the base member into first and second portions. The base member has another surface to thermally couple to the device. The thermal control unit further includes at least one heat transfer assembly in thermal contact with the first portion of the base member and one face of the extension member and at least one other heat transfer assembly in thermal contact with the second portion of the base member and another face of the extension member.

    摘要翻译： 公开了一种用于调节被测部件或装置的温度的热控制单元。 热控制单元包括三维控制结构，其具有基部构件和从基座构件的一个表面延伸的延伸构件，以将基座构件分成第一和第二部分。 基座部件具有热连接到该装置的另一表面。 热控制单元还包括至少一个热传导组件，其与基部构件的第一部分和延伸构件的一个表面热接触，并且至少一个其它传热组件与基部构件的第二部分热接触， 扩展成员的另一面。

    PROBE PINS WITH ETCHED TIPS FOR ELECTRICAL DIE TEST
    8.
    发明申请
    PROBE PINS WITH ETCHED TIPS FOR ELECTRICAL DIE TEST 审中-公开

    公开(公告)号：US20170276700A1

    公开(公告)日：2017-09-28

    申请号：US15083082

    申请日：2016-03-28

    申请人： Joseph D. Stanford ,  David Craig ,  Todd P. Albertson ,  Mohit Mamodia ,  Dingying Xu

    发明人： Joseph D. Stanford ,  David Craig ,  Todd P. Albertson ,  Mohit Mamodia ,  Dingying Xu

    IPC分类号： G01R1/073 ,  G01R31/28 ,  G01R3/00

    摘要： A prober head to interface an E-testing apparatus to a device under test, which may be an unpackaged die, for example. In some embodiments, the prober head includes an array of conductive pins, each of the pins extending outwardly from a first pin end anchored to a substrate. At least a partial length of each of the pins is coated with a hydrophobic monolayer. The conductive pins may be composite metal wires including a core metal encased by one or more peripheral metal. At a tip of the pins, opposite the first pin end anchored to the substrate, the peripheral metals are recessed from the core metal. In further embodiments, the hydrophobic monolayer is disposed on an outer surface of the peripheral metals, but is substantially absent from a surface of the core metal exposed at the tip.

    ORGANIC SPACE TRANSFORMER ATTACHMENT AND ASSEMBLY
    10.
    发明申请
    ORGANIC SPACE TRANSFORMER ATTACHMENT AND ASSEMBLY 有权
    有机空间变压器附件和装配

    公开(公告)号：US20150185252A1

    公开(公告)日：2015-07-02

    申请号：US14142752

    申请日：2013-12-28

    申请人： Jin YANG ,  Erkan ACAR ,  Todd P. ALBERTSON ,  Joe F. WALCZYK

    发明人： Jin YANG ,  Erkan ACAR ,  Todd P. ALBERTSON ,  Joe F. WALCZYK

    IPC分类号： G01R1/073 ,  G01R31/28 ,  H05K3/32 ,  G01R1/04

    CPC分类号： G01R31/2889 ,  H05K3/325 ,  Y10T29/4902

    摘要： Electronic device assemblies and methods including an organic substrate based space transformer are described. One assembly includes a space transformer comprising an organic substrate. The assembly also includes a carrier on which the space transformer is positioned, and a clamp positioned to couple the space transformer to the carrier. The assembly also includes a probe array positioned on the space transformer, wherein the space transformer is positioned between the probe array and the carrier. The assembly also includes a printed circuit board, wherein the carrier is positioned between the printed circuit board and the space transformer. The assembly also includes electrical connections to electrically couple the space transformer to the printed circuit board. Other embodiments are described and claimed.

    摘要翻译： 描述了包括基于有机衬底的空间变换器的电子器件组件和方法。 一个组件包括空间变压器，其包括有机衬底。 组件还包括其上定位有空间变压器的载体和用于将空间变压器耦合到载体的夹具。 组件还包括位于空间变压器上的探针阵列，其中空间变换器位于探针阵列和载体之间。 组件还包括印刷电路板，其中载体位于印刷电路板和空间变压器之间。 组件还包括将空间变压器电耦合到印刷电路板的电连接。 描述和要求保护其他实施例。