摘要:
Methods and structures for testing a microelectronic packaging structure/device are described. Those methods may include placing a device in a floating carrier, wherein the floating carrier is coupled to a socket housing by pin dowels disposed in four corners of the socket housing, and wherein at least two actuating motors are disposed within the socket housing, and micro adjusting the device by utilizing a capacitive coupled or a fiber optic alignment system wherein a maximum measured capacitance or maximum measured intensity between alignment structures disposed in the socket housing and alignment package balls disposed within the device indicate optimal alignment of the device. Methods further include methods for active co-planarity detection through the use of a capacitive-coupled techniques.
摘要:
An electrical probe of an aspect includes a high yield strength wire core. The high yield strength wire core includes predominantly one or more materials selected from tungsten, tungsten-copper alloy, tungsten-nickel alloy, beryllium-copper alloy, molybdenum, stainless steel, and combinations thereof. The high mechanical strength wire core has a yield strength of at least 1 gigapascal (GPa) at temperature of 250° C. The electrical probe also includes a low electrical resistivity layer concentrically around the high yield strength wire core. The concentric layer includes predominantly one or more materials selected from silver, gold, copper, and combinations thereof. The low electrical resistivity layer has an electrical resistivity of no more than 2×10−8 Ohm-meters. The electrical probe has an outer cross-sectional dimension of the electrical probe that is no more than 50 micrometers. Between 60 to 85% of the outer cross-sectional dimension is provided by the high mechanical strength wire core. Between 10 to 30% of the outer cross-sectional dimension is provided by the low electrical resistivity layer.
摘要:
Wire probes are described that resist rotation during assembly into a probe head of a die tester. One example includes probe wires with a protrusion at a pre-determined position along the length of the wire. A probe substrate with pads on one side each to attach to and electrically connect with a probe wire and a pads on the opposite side to connect to test equipment and a probe holder above the substrate with holes. Each hole holds a respective one of the probe wires against the probe substrate. Each hole also has a key to mate with a protrusion of a respective probe wire so that the protrusions engage the keys to prevent rotation of the respective wire.
摘要:
An apparatus includes a robot and a sort probe gripper. The sort probe gripper includes a body, a jaw mount inserted into the body, a plurality of grippers mounted in the jaw mount and an actuator sleeve slidable along the body to engage the plurality of grippers.
摘要:
An electrical probe of an aspect includes a high yield strength wire core. The high yield strength wire core includes predominantly one or more materials selected from tungsten, tungsten-copper alloy, tungsten-nickel alloy, beryllium-copper alloy, molybdenum, stainless steel, and combinations thereof. The high mechanical strength wire core has a yield strength of at least 1 gigapascal (GPa) at temperature of 250° C. The electrical probe also includes a low electrical resistivity layer concentrically around the high yield strength wire core. The concentric layer includes predominantly one or more materials selected from silver, gold, copper, and combinations thereof. The low electrical resistivity layer has an electrical resistivity of no more than 2×10−8 Ohm-meters. The electrical probe has an outer cross-sectional dimension of the electrical probe that is no more than 50 micrometers. Between 60 to 85% of the outer cross-sectional dimension is provided by the high mechanical strength wire core. Between 10 to 30% of the outer cross-sectional dimension is provided by the low electrical resistivity layer.
摘要:
An examples includes a substrate, including a conductive trace and a layer disposed on top of the conductive trace, the layer defining at least one cavity extending to the conductive trace and an electrical probe disposed in the cavity, with solder coupling the electrical probe to the conductive trace. The electrical probe can include a high yield strength wire core including a refractory metal and a thin oxidation protection layer concentrically disposed around high yield strength wire core and providing an outside surface of the electrical probe, the thin oxidation protection layer including predominantly one or more materials selected from gold, platinum, ruthenium, rhodium, palladium, osmium, iridium, chromium, and combinations thereof, wherein the solder fills the cavity and is coupled to the electrical probe inside the cavity, disposed between the electrical probe and the layer.
摘要:
A sort probe gripper includes a body, a jaw mount inserted into the body, a plurality of grippers mounted in the jaw mount and an actuator sleeve slidable along the body to engage the plurality of grippers.
摘要:
An apparatus comprising a robot; an end effector coupled to the robot and configured to grasp or transfer a probe of a size for use in a probe card; and instructions stored on a machine readable medium coupled to the robot, the instructions comprising to configure the robot to transfer a probe to a probe card substrate or, where the probe is attached to a probe card substrate, to move the probe. A method comprising automatically transferring a probe to a probe card substrate in an assembly process or, where the probe is attached to a probe card substrate, moving the probe in a repair process; and after transferring or moving the probe, heating the probe with a heat source.
摘要:
A wire probe assembly and forming process is described. In one example, a method includes inserting a plurality of wires through a probe former and a tip retainer to contact a probe head substrate, attaching the wires to a surface of the substrate, pulling the probe former laterally with respect to the substrate surface and the tip retainer to bend the wires into test probes with a resiliency to transverse movement, and removing the tip retainer to form a test probe head.
摘要:
Wire probes are described that resist rotation during assembly into a probe head of a die tester. One example includes probe wires with a protrusion at a pre-determined position along the length of the wire. A probe substrate with pads on one side each to attach to and electrically connect with a probe wire and a pads on the opposite side to connect to test equipment and a probe holder above the substrate with holes. Each hole holds a respective one of the probe wires against the probe substrate. Each hole also has a key to mate with a protrusion of a respective probe wire so that the protrusions engage the keys to prevent rotation of the respective wire.