公开(公告)号：US11851597B2

公开(公告)日：2023-12-26

申请号：US17241086

申请日：2021-04-27

Applicant: eChem Solutions Corp.

Inventor： Yu-Ning Chen ,  Ming-Che Chung

IPC: C09K13/02 ,  C08J7/12

CPC classification number: C09K13/02 ,  C08J7/12

Abstract: An etchant composition, a tackifier, an alkaline solution, a method of removing polyimide and an etching process are provided. The etchant composition includes a tackifier (A) and an alkaline solution (B). The tackifier (A) includes a resin containing a hydroxyl group (a), a surfactant (b) and a first solvent (c1). The alkaline solution (B) includes an alkaline compound (d) and a second solvent (c2).

公开(公告)号：US20230323134A1

公开(公告)日：2023-10-12

申请号：US18297001

申请日：2023-04-07

Applicant: eChem Solutions Corp.

Inventor： Hsiao-Chi Chiu ,  Jui-Yu Hsu

IPC: C09D4/06 ,  C09D133/10 ,  C09D7/48 ,  C09D7/63 ,  C09D7/45

CPC classification number: C09D4/06 ,  C09D133/10 ,  C09D7/48 ,  C09D7/63 ,  C09D7/45

Abstract: A photosensitive resin composition and a cured product are provided. The photosensitive resin composition includes an alkali-soluble resin (A), polymerizable monomer (B), an antioxidant (C), a photoinitiator (D) and a solvent (E). The weight average molecular weight of the alkali-soluble resin (A) is 5,000 to 40,000. The polymerizable monomer (B) includes an ethylenically unsaturated monomer (B1), an epoxy monomer (B2) or the combination thereof. The alkali-soluble resin (A) includes at least one of a structural unit represented by following Formula (A-1) to Formula (A-4).




In Formula (A-1) to Formula (A-4), the definition of R1 to R3, m, n and * are the same as defined in the detailed description.

公开(公告)号：US11603426B2

公开(公告)日：2023-03-14

申请号：US17238207

申请日：2021-04-23

Applicant: eChem Solutions Corp.

Inventor： Hsiao-Jen Lai ,  Yu-Chun Chen

IPC: C08F283/00 ,  C08K3/32 ,  C08K3/105 ,  C08K5/134 ,  C08K5/18 ,  C08K5/524 ,  G02F1/1335 ,  C08K5/36 ,  B82Y20/00

Abstract: A resin composition, a light conversion layer and a light emitting device are provided. The resin composition includes a quantum dot (A), an alkali-soluble resin (B), an ethylenically unsaturated monomer (C), a photoinitiator (D), a solvent (E) and a phenyl-based compound (F). The phenyl-based compound (F) includes at least one of a compound represented by following Formula (F-1) and a compound represented by following Formula (F-2). Based on a total usage amount of the resin composition as 100 parts by weight, a usage amount of the phenyl-based compound (F) is 0.05 to 5 parts by weight. In Formula (F-1) and Formula (F-2), the definition of R1, R3, R4, Y, Z, m, n and p are the same as defined in the detailed description.

公开(公告)号：US20220275205A1

公开(公告)日：2022-09-01

申请号：US17352371

申请日：2021-06-21

Applicant: eChem Solutions Corp.

Inventor： Yung-Yu Lin ,  Chi-Yu Lai ,  Che-Wei Chang

IPC: C08L79/08 ,  C09J179/08 ,  C08G73/10 ,  C08G73/12 ,  C09J7/38 ,  C09J7/40

Abstract: A polyimide resin composition, a polyimide resin adhesive layer, a laminate, and a manufacturing method of an electronic component are provided. The polyimide resin composition includes a polyimide resin. The polyimide resin is obtained by the polymerization reaction of a diamine (A) and a tetracarboxylic dianhydride (B). The diamine (A) includes a diamine (A-1) represented by following Formula (I-1) and a diamine (A-2) represented by following Formula (I-2). A molar ratio ((A-1):(A-2)) of the diamine (A-1) to the diamine (A-2) is 0.1:0.2 to 0.6.

公开(公告)号：US11306220B2

公开(公告)日：2022-04-19

申请号：US16691618

申请日：2019-11-22

Applicant: eChem Solutions Corp.

Inventor： Zong-Hao Tang ,  Hsin-Jen Chen

IPC: C09D163/00 ,  C08G59/24 ,  C08G59/42 ,  H01L51/52 ,  H01L51/00 ,  C08G59/68

Abstract: A flexible encapsulating material, a method for preparing the flexible encapsulating material, and an encapsulating method using the flexible encapsulating material are provided. The flexible encapsulating material includes an epoxy resin represented by a Formula (1), a curing agent, and a curing accelerator and optionally includes a coupling agent, wherein based on 100 parts by weight of a total usage amount of the epoxy resin (A), the curing agent (B), and the curing accelerator (C), a usage amount of the epoxy resin (A) is 85 parts by weight or more, and based on 100 parts by weight of the usage amount of the epoxy resin (A), a usage amount of the coupling agent (D) is 0 to 5 parts by weight.

公开(公告)号：US12242188B2

公开(公告)日：2025-03-04

申请号：US17570314

申请日：2022-01-06

Applicant: eChem Solutions Corp.

Inventor： Chin-Chen Huang ,  Yu-Lun Li ,  Chen-Wen Chiu

IPC: G03F7/00 ,  G03F7/029 ,  G03F7/035

Abstract: A photosensitive resin composition for imprinting, a cured article and an optical element are provided. The photosensitive resin composition for imprinting includes a resin (A), an ethylenically unsaturated monomer (B), a photoinitiator (C), a solvent (D), and a hydrophobic oligomer (E). The resin (A) has a weight average molecular weight of 1,000 to 50,000 and has two or more ethylenic polymerizable groups.

公开(公告)号：US12222642B2

公开(公告)日：2025-02-11

申请号：US16431752

申请日：2019-06-05

Applicant: eChem Solutions Corp.

Inventor： Yi-Sheng Wu ,  Hsin-Chieh Yang ,  Ping-Sung Tsai

IPC: G03F7/00 ,  G02B1/04 ,  G03F7/031 ,  G03F7/033 ,  G02F1/1335

Abstract: A photosensitive composition, a color filter prepared by using the photosensitive composition and a method for preparing the color filter. The photosensitive composition includes an alkali-soluble resin (A); an ethylenically unsaturated monomer (B); a photopolymerization initiator (C); a solvent (D); and a colorant (E), wherein the content of the photopolymerization initiator (C) is from 32 parts by weight to 70 parts by weight based on 100 parts by weight of the ethylenically unsaturated monomer(B).

公开(公告)号：US11999868B2

公开(公告)日：2024-06-04

申请号：US17143159

申请日：2021-01-07

Applicant: eChem Solutions Corp.

Inventor： Yu-Wen Chen ,  Yi-Lun Chiu ,  Chia-Hao Lou ,  Chen-Wen Chiu

IPC: C09D4/06 ,  C08F2/50 ,  C08F283/08 ,  C08F290/06 ,  C08G63/197 ,  C08K3/04 ,  C08K3/08 ,  G02B5/20 ,  B82Y20/00 ,  B82Y30/00 ,  B82Y40/00 ,  C08F2/44 ,  C08K3/22

CPC classification number: C09D4/06 ,  C08F2/50 ,  C08F283/08 ,  C08F290/067 ,  C08G63/197 ,  C08K3/04 ,  C08K3/08 ,  G02B5/20 ,  B82Y20/00 ,  B82Y30/00 ,  B82Y40/00 ,  C08F2/44 ,  C08K2003/0881 ,  C08K2003/2237 ,  C08K2201/005 ,  C09K2323/031 ,  C09D4/06 ,  C08F290/067 ,  C08F290/067 ,  C08F222/1006 ,  C08F283/08 ,  C08F222/1006

Abstract: A resin composition and a filter element are provided. The resin composition includes a black coloring agent (A), an ethylenically-unsaturated monomer (B), a solvent (C), a resin (D), and a photoinitiator (E). The black coloring agent (A) includes a titanium black (A-1) and a carbon black (A-2). Based on a total usage amount of 100 parts by weight of the titanium black (A-1) and the carbon black (A-2), a usage amount of the titanium black (A-1) is 50 parts by weight to 75 parts by weight.

公开(公告)号：US20230212414A1

公开(公告)日：2023-07-06

申请号：US18090522

申请日：2022-12-29

Applicant: eChem Solutions Corp.

Inventor： Yu-Ning Chen ,  Shao-Li Ho ,  Jia Jheng Lin ,  Hui-Ju Chen

IPC: C09D125/18 ,  C09D161/06 ,  C09D5/00 ,  C09D7/20 ,  C09D7/45 ,  C09D7/65 ,  C09D7/63

CPC classification number: C09D125/18 ,  C09D161/06 ,  C09D5/00 ,  C09D7/20 ,  C09D7/45 ,  C09D7/65 ,  C09D7/63

Abstract: A resin composition, an anti-etching layer and an etching method are provided. The resin composition includes a resin (A), a crosslinking agent (B), a surfactant (C), and a solvent (D). The resin (A) includes a hydroxyl type polystyrene resin (A-1), a hydroxyl type phenolic resin (A-2), a polyhydroxy phenol resin (A-3), or a combination thereof. The crosslinking agent (B) includes a structure of novolac epoxy resin type (B-1), polymethyl methacrylate type (B-2), maleimide type (B-3) or hyperbranched oligomer (B-4).

公开(公告)号：US20220221789A1

公开(公告)日：2022-07-14

申请号：US17570314

申请日：2022-01-06

Applicant: eChem Solutions Corp.

Inventor： Chin-Chen Huang ,  Yu-Lun Li ,  Chen-Wen Chiu

IPC: G03F7/00 ,  G03F7/035 ,  G03F7/029

Abstract: A photosensitive resin composition for imprinting, a cured article and an optical element are provided. The photosensitive resin composition for imprinting includes a resin (A), an ethylenically unsaturated monomer (B), a photoinitiator (C), a solvent (D), and a hydrophobic oligomer (E). The resin (A) has a weight average molecular weight of 1,000 to 50,000 and has two or more ethylenic polymerizable groups.