PRESSURE-SENSITIVE ADHESIVE COMPOSITIONS FOR ELECTRONIC BONDING APPLICATIONS

    公开(公告)号:US20210102094A1

    公开(公告)日:2021-04-08

    申请号:US15733468

    申请日:2019-02-08

    Abstract: The present disclosure relates to a curable pressure sensitive adhesive composition comprising: a) a butyl rubber component in an amount greater than 40 wt %; b) a tackifier in an amount greater than 1 wt %; c) a multifunctional crosslinking agent comprising at least two nitroso functional groups; and d) optionally, a hydrocarbon plasticizer; wherein the weight percentages are based on the total weight of the curable pressure sensitive adhesive composition. In another aspect, the present disclosure is directed to a method for protecting an electronic device or an electronic component from moisture and air permeation, wherein the method comprises the step of using a pressure sensitive adhesive composition as described above. According to still another aspect, the present disclosure is directed to the use of a pressure sensitive adhesive composition as described above for manufacturing an electronic device.

    POLYISOBUTYLENE BASED PASSIVATION ADHESIVE
    4.
    发明申请

    公开(公告)号:US20200048511A1

    公开(公告)日:2020-02-13

    申请号:US16486037

    申请日:2018-02-12

    Abstract: The present invention is an adhesive composition for use in passivating metallic conductors in an electronic device including at least one low molecular weight polyisobutylene polymer having a weight average molecular weight of about 75,000 or lower, at least one high molecular weight polyisobutylene polymer having a weight average molecular weight of about 120,000 or higher, and optionally, at least one tackifier. Each of the polyisobutylenes and the optional tackifier has a halogen ion content of no more than 1 ppm.

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