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公开(公告)号：US20220333150A1
公开(公告)日：2022-10-20
申请号：US17764665
申请日：2020-09-01
Applicant: ADVANTEST Corporation
Inventor： Kiyoto Nakamura , Hirokazu Sanpei
Abstract: A biosensor includes: a flow channel through which a liquid sample flows, the liquid sample containing a specific component; a holding sheet that is disposed in the flow channel and holds a substance corresponding to the specific component; and a first temperature sensor that is disposed to correspond to the holding sheet and detects a reaction heat generated by a contact reaction between the specific component and the corresponding substance. The biosensor acquires information on the specific component based on the reaction heat.
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公开(公告)号：US09645173B2
公开(公告)日：2017-05-09
申请号：US14405054
申请日：2013-05-27
Applicant: ADVANTEST CORPORATION
Inventor： Kiyoto Nakamura
CPC classification number: G01R1/0441 , G01R1/0483 , G01R31/26
Abstract: A test carrier includes a base member and a cover member. The base member includes a multi-layer board including a wiring line that is electrically connected to a die and a base film that supports the multi-layer board. The cover member includes a frame-shaped cover frame having an opening formed therein. The size of the multi-layer board is larger than the size of the die and is smaller than the size of the opening in a direction along a surface that is opposite to the die.
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公开(公告)号：US20150168448A1
公开(公告)日：2015-06-18
申请号：US14390557
申请日：2013-05-21
Applicant: ADVANTEST CORPORATION
Inventor： Kiyoto Nakamura , Takashi Fujisaki , Hiroki Ichikawa
CPC classification number: G01R1/0408 , G01R31/003 , G01R31/2863 , G01R31/2867
Abstract: A test carrier includes a base film that holds a die and a cover film that overlaps the base film so as to cover the die. The cover film has a self-adhesive property and is more flexible than the base film. The base film has a through hole. The through hole is formed in the vicinity of a region of the base film which contacts the die.
Abstract translation: 测试载体包括保持模具的基膜和与基膜重叠以覆盖模具的覆盖膜。 覆盖膜具有自粘性，比基膜更柔软。 基膜具有通孔。 通孔形成在与模具接触的基膜的区域附近。
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公开(公告)号：US08988095B2
公开(公告)日：2015-03-24
申请号：US13644197
申请日：2012-10-03
Applicant: Advantest Corporation
Inventor： Kiyoto Nakamura , Takashi Fujisaki
CPC classification number: G01R1/0433 , G01R1/0466 , G01R1/0483 , G01R1/0735 , G01R31/2601 , G01R31/2886
Abstract: A socket which enables occurrence of contact defects to be suppressed is provided. A socket 11 to which a test carrier 20, which has: a base film 32 on which bumps 324 are formed for contact with electrode pads 51 of a die 50; and external terminals 312 which are electrically connected to the bumps 324, is electrically connected comprises: contactors 125 which contact external terminals 312; and an elastic member 131 which pushes against bump-forming portions 32a and bump-surrounding portions 32b on the base film 32. The elastic member 131 has: a first elastic layer 132; and a second elastic layer 133 which is more flexible than the first elastic layer 132, and a second elastic layer 133 is laid over the first elastic layer 132 and contacts the base film 32.
Abstract translation: 提供能够抑制接触缺陷发生的插座。 具有测试载体20的插座11，其具有：基底膜32，其上形成有用于与模具50的电极焊盘51接触的凸块324; 电连接到凸块324的外部端子312电连接包括：接触外部端子312的接触器125; 以及弹性构件131，其在基底膜32上推动凸起形成部分32a和凸起部分32b。弹性构件131具有：第一弹性层132; 以及比第一弹性层132更柔性的第二弹性层133，并且第二弹性层133被放置在第一弹性层132上并与基膜32接触。
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Patent Agency Ranking
公开(公告)号：US09702901B2
公开(公告)日：2017-07-11
申请号：US14405064
申请日：2013-05-27
Applicant: ADVANTEST CORPORATION
Inventor： Kiyoto Nakamura , Kazuo Takano , Noriyuki Masuda
CPC classification number: G01R1/04 , G01R1/0483 , G01R31/2886
Abstract: A test carrier includes a base member that holds a die and a cover member. The base member includes a board having a wiring line that is electrically connected to the die. The wiring line includes a wiring line and a resistive portion having a resistance value that is higher than the resistance value of the wiring line.
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公开(公告)号：US09250263B2
公开(公告)日：2016-02-02
申请号：US14618070
申请日：2015-02-10
Applicant: ADVANTEST CORPORATION
Inventor： Kiyoto Nakamura , Takashi Fujisaki
CPC classification number: G01R1/0433 , G01R1/0466 , G01R1/0483 , G01R1/0735 , G01R31/2601 , G01R31/2886
Abstract: A socket is electrically connected to a test carrier. The test carrier includes a film-shaped first member on which at least one internal terminal, which contacts at least one electrode of an electronic device, is provided; and at least one external terminal which is electrically connected to the internal terminal. The socket includes: at least one contactor which contacts the external terminal; and a first pusher which pushes a portion of the first member where the internal terminal is provided and a portion of the first member surrounding the internal terminal. The first pusher includes: a bag member which has a sealed space within the bag member; and a fluid which is housed in the sealed space.
Abstract translation: 插座电连接到测试载体。 测试载体包括薄膜状的第一构件，在其上提供与电子设备的至少一个电极接触的至少一个内部端子; 以及与内部端子电连接的至少一个外部端子。 插座包括：至少一个接触外部端子的接触器; 以及第一推动器，其推动设置有内部端子的第一构件的一部分和围绕内部端子的第一构件的一部分。 第一推动器包括：袋构件，其在袋构件内具有密封空间; 以及容纳在密封空间中的流体。
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公开(公告)号：US20150130494A1
公开(公告)日：2015-05-14
申请号：US14405054
申请日：2013-05-27
Applicant: ADVANTEST CORPORATION
Inventor： Kiyoto Nakamura
CPC classification number: G01R1/0441 , G01R1/0483 , G01R31/26
Abstract: A test carrier includes a base member and a cover member. The base member includes a multi-layer board including a wiring line that is electrically connected to a die and a base film that supports the multi-layer board. The cover member includes a frame-shaped cover frame having an opening formed therein. The size of the multi-layer board is larger than the size of the die and is smaller than the size of the opening in a direction along a surface that is opposite to the die.
Abstract translation: 试验载体包括基底构件和盖构件。 基底构件包括多层板，其包括电连接到管芯的布线和支撑多层板的基膜。 盖构件包括其中形成有开口的框架状框架。 多层板的尺寸大于模具的尺寸，并且小于沿着与模具相对的表面的方向上的开口的尺寸。
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公开(公告)号：US20150130492A1
公开(公告)日：2015-05-14
申请号：US14405064
申请日：2013-05-27
Applicant: ADVANTEST CORPORATION
Inventor： Kiyoto Nakamura , Kazuo Takano , Noriyuki Masuda
CPC classification number: G01R1/04 , G01R1/0483 , G01R31/2886
Abstract: A test carrier includes a base member that holds a die and a cover member. The base member includes a board having a wiring line that is electrically connected to the die. The wiring line includes a wiring line and a resistive portion having a resistance value that is higher than the resistance value of the wiring line.
Abstract translation: 测试载体包括保持模具和盖构件的基座构件。 基座构件包括具有与管芯电连接的布线的板。 布线包括布线和具有比布线的电阻值高的电阻值的电阻部分。
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9.发明申请TEST CARRIER, DEFECT DETERMINATION APPARATUS, AND DEFECT DETERMINATION METHOD 审中-公开测试载体，缺陷确定装置和缺陷确定方法公开(公告)号：US20150061717A1
公开(公告)日：2015-03-05
申请号：US14390607
申请日：2013-05-21
Applicant: ADVANTEST CORPORATION
Inventor： Kiyoto Nakamura
CPC classification number: G01R31/2853 , G01R1/0408 , G01R1/0491 , G01R31/2893
Abstract: A test carrier that temporarily accommodates a die includes: a first wiring pattern that electrically connects an external terminal of the test carrier and a TSV of the die; and a second wiring pattern that electrically connects the TSVs.
Abstract translation: 临时容纳模具的测试载体包括：将测试载体的外部端子和模具的TSV电连接的第一布线图案; 以及电连接TSV的第二布线图案。
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