公开(公告)号：US11162007B2

公开(公告)日：2021-11-02

申请号：US16289789

申请日：2019-03-01

Applicant: Alpha Assembly Solutions Inc.

Inventor： Shamik Ghosal ,  Ranjit Pandher ,  Oscar Khaselev ,  Ravi Bhatkal ,  Rahul Raut ,  Bawa Singh ,  Morgana de Avila Ribas ,  Siuli Sarkar ,  Sutapa Mukherjee ,  Sathish Kumar ,  Remya Chandran ,  Pavan Vishwanath ,  Ashok Pachamuthu ,  Monnir Boureghda ,  Nitin Desai ,  Anna Lifton ,  Nirmalya Kumar Chaki

IPC: C09K5/14 ,  B22F1/00 ,  B22F1/02 ,  C01G5/00 ,  C09C1/62 ,  C09C3/08 ,  B82Y30/00

Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.

公开(公告)号：US10259980B2

公开(公告)日：2019-04-16

申请号：US14438888

申请日：2013-10-29

Applicant: Alpha Assembly Solutions Inc.

Inventor： Shamik Ghosal ,  Ranjit Pandher ,  Oscar Khaselev ,  Ravi Bhatkal ,  Rahul Raut ,  Bawa Singh ,  Morgana Ribas ,  Siuli Sarkar ,  Sutapa Mukherjee ,  Sathish Kumar ,  Remya Chandran ,  Pavan Vishwanath ,  Ashok Pachamuthu ,  Monnir Boureghda ,  Nitin Desai ,  Anna Lifton ,  Nirmalya Kumar Chaki

IPC: B22F1/00 ,  B22F1/02 ,  C01G5/00 ,  C09C1/62 ,  C09C3/08 ,  C09K5/14 ,  B82Y30/00

Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.

公开(公告)号：US20220169905A1

公开(公告)日：2022-06-02

申请号：US17493247

申请日：2021-10-04

Applicant: Alpha Assembly Solutions Inc.

Inventor： Shamik Ghosal ,  Ranjit Pandher ,  Oscar Khaselev ,  Ravi Bhatkal ,  Rahul Raut ,  Bawa Singh ,  Morgana de Avila Ribas ,  Siuli Sarkar ,  Sutapa Mukherjee ,  Sathish Kumar ,  Remya Chandran ,  Pavan Vishwanath ,  Ashok Pachamuthu ,  Monnir Boureghda ,  Nitin Desai ,  Anna Lifton ,  Nirmalya Kumar Chaki

IPC: C09K5/14 ,  C01G5/00 ,  C09C1/62 ,  C09C3/08 ,  B82Y30/00 ,  B22F1/05 ,  B22F1/16 ,  B22F1/052 ,  B22F1/102

Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.

公开(公告)号：US20190194517A1

公开(公告)日：2019-06-27

申请号：US16289789

申请日：2019-03-01

Applicant: Alpha Assembly Solutions Inc.

Inventor： Shamik Ghosal ,  Ranjit Pandher ,  Oscar Khaselev ,  Ravi Bhatkal ,  Rahul Raut ,  Bawa Singh ,  Morgana de Avila Ribas ,  Siuli Sarkar ,  Sutapa Mukherjee ,  Sathish Kumar ,  Remya Chandran ,  Pavan Vishwanath ,  Ashok Pachamuthu ,  Monnir Boureghda ,  Nitin Desai ,  Anna Lifton ,  Nirmalya Kumar Chaki

IPC: C09K5/14 ,  B22F1/02 ,  B22F1/00 ,  C09C3/08 ,  B82Y30/00 ,  C01G5/00 ,  C09C1/62

CPC classification number: C09K5/14 ,  B22F1/0011 ,  B22F1/0014 ,  B22F1/0018 ,  B22F1/0062 ,  B22F1/0074 ,  B22F1/02 ,  B22F2001/0066 ,  B82Y30/00 ,  C01G5/00 ,  C01P2002/72 ,  C01P2002/88 ,  C01P2004/04 ,  C01P2004/53 ,  C01P2004/61 ,  C01P2004/64 ,  C01P2006/22 ,  C01P2006/32 ,  C01P2006/40 ,  C09C1/62 ,  C09C3/08 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.

公开(公告)号：US11699632B2

公开(公告)日：2023-07-11

申请号：US17153706

申请日：2021-01-20

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Monnir Boureghda ,  Nitin Desai ,  Anna Lifton ,  Oscar Khaselev ,  Michael T. Marczi ,  Bawa Singh

IPC: H05K13/04 ,  H01L23/373 ,  H01L23/00

CPC classification number: H01L23/373 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H05K13/0465 ,  H01L2224/2936 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/32225 ,  H01L2224/8384 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2924/0102 ,  H01L2924/0103 ,  H01L2924/014 ,  H01L2924/0104 ,  H01L2924/0105 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0132 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/203 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49155 ,  Y10T428/24893 ,  H01L2224/29101 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/0132 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29111 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/00 ,  H01L2224/83192 ,  H01L2224/32225 ,  H01L2924/00 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2924/203 ,  H01L2924/0002

Abstract: Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described.

公开(公告)号：US10710336B2

公开(公告)日：2020-07-14

申请号：US14915067

申请日：2014-08-29

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Oscar Khaselev ,  Bin Mo ,  Monnir Boureghda ,  Michael T. Marczi ,  Bawa Singh

IPC: B22F7/04 ,  B32B15/01 ,  B22F5/00 ,  C22C32/00 ,  C22C49/00 ,  H01L23/00

Abstract: Materials for die attachment such as silver sintering films may include reinforcing, modifying particles for enhanced performance. Methods for die attachment may involve the of such materials.

公开(公告)号：US12246376B2

公开(公告)日：2025-03-11

申请号：US17594978

申请日：2020-05-05

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Oscar Khaselev ,  Matthew James Siebenhuhner ,  Monnir Boureghda ,  Mike Marczi ,  Carl Bilgrien

IPC: B23K1/00 ,  B22C9/22 ,  B22D21/00 ,  B22D21/06 ,  B22D25/04 ,  B23K101/40

Abstract: A method of making a combined sinter-ready silver film and carrier comprises the steps of: a) creating a carrier comprising designed openings; b) casting a silver film layer into the designed openings, for example casting a silver paste; and c) drying the carrier and silver film layer to form the combined sinter-ready silver film and carrier. The carrier may comprise a plastic carrier, which may be created by permanently bonding two plastic films, using a plasma bonding process or using a temperature stable glue. The carrier may comprise a stencil layer and a backing layer. The stencil layer may define the designed openings. The backing layer may be configured for sealing a bottom of the designed openings, wherein at the start of step b), a top of the designed openings may be open for receiving the cast silver film layer.

公开(公告)号：US20210289680A1

公开(公告)日：2021-09-16

申请号：US17153706

申请日：2021-01-20

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Monnir Boureghda ,  Nitin Desai ,  Anna Lifton ,  Oscar Khaselev ,  Michael T. Marczi ,  Bawa Singh

IPC: H05K13/04 ,  H01L23/00

Abstract: Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described.

公开(公告)号：US10905041B2

公开(公告)日：2021-01-26

申请号：US14027530

申请日：2013-09-16

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Monnir Boureghda ,  Nitin Desai ,  Anna Lifton ,  Oscar Khaselev ,  Michael T. Marczi ,  Bawa Singh

IPC: H01L23/29 ,  H05K13/04 ,  H01L23/00

Abstract: Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described.

公开(公告)号：US20200338859A1

公开(公告)日：2020-10-29

申请号：US16927444

申请日：2020-07-13

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Oscar Khaselev ,  Bin Mo ,  Monnir Boureghda ,  Michael T. Marczi ,  Bawa Singh

IPC: B32B15/01 ,  B22F5/00 ,  B22F7/04 ,  C22C32/00 ,  C22C49/00 ,  H01L23/00

Abstract: A silver film for die attachment in the field of microelectronics, wherein the silver film is a multilayer structure comprising a reinforcing silver foil layer between two layers of sinterable particles. Each layer of sinterable particles comprises a mixture of sinterable silver particles and reinforcing particles. The reinforcing particles comprise glass and/or carbon and/or graphite particles. A method for die attachment using a silver film.