公开(公告)号：US12107283B2

公开(公告)日：2024-10-01

申请号：US17484471

申请日：2021-09-24

Applicant: Apple Inc.

Inventor： Angelo V. Marasco ,  Nathan J. Bohney ,  John M. McCambridge ,  Antonio Manenti ,  Laura E. Mayer ,  Scott L. Gooch ,  Jonathan C. Wilson ,  Flynn P. Carson

IPC: H01M50/183 ,  H01M10/42 ,  H01M50/40 ,  H01M50/531 ,  H01M50/543

CPC classification number: H01M50/183 ,  H01M10/425 ,  H01M50/40 ,  H01M50/531 ,  H01M50/543 ,  H01M2010/4271 ,  H01M2220/30

Abstract: Battery systems according to embodiments of the present technology may include a battery cell having an electrode tab extending from an edge of the battery cell. The systems may also include a module electrically coupled with the battery cell. The module may be characterized by a first surface, a height, and a second surface opposite the first surface. A conductive tab coupled along the first surface of the module may extend from a first end parallel to a plane of the first surface. The conductive tab may be characterized by a curvature proximate a midpoint of the conductive tab. A distal region of the conductive tab may return back across the first surface of the module substantially parallel to the first surface. A distal portion of the electrode tab may be fixedly coupled with the distal region of the conductive tab.

公开(公告)号：US20170094796A1

公开(公告)日：2017-03-30

申请号：US15267067

申请日：2016-09-15

Applicant: Apple Inc.

Inventor： Jason Lor ,  Scott L. Gooch ,  Siddharth Nangia

IPC: H05K1/18 ,  H01R12/88 ,  H01R24/76 ,  H05K3/28 ,  H05K3/34

CPC classification number: H05K3/284 ,  H05K2201/10189 ,  H05K2203/1316 ,  H05K2203/1327

Abstract: Embodiments relate to systems and methods for forming a circuit assembly for an electronic device. The circuit assembly may include a substrate and a group of surface-mounted electronic components disposed on a surface of the substrate. An electrical connector may be disposed on the surface and may be configured to receive an electrical connection from a separate electrical component or assembly. A molded layer may be formed over at least a portion of the surface fully encapsulating the group of surface-mounted electronic components and partially encapsulating the electrical connector.

公开(公告)号：US10149396B2

公开(公告)日：2018-12-04

申请号：US15267067

申请日：2016-09-15

Applicant: Apple Inc.

Inventor： Jason Lor ,  Scott L. Gooch ,  Siddharth Nangia

IPC: H05K3/28 ,  H05K1/18

Abstract: Embodiments relate to systems and methods for forming a circuit assembly for an electronic device. The circuit assembly may include a substrate and a group of surface-mounted electronic components disposed on a surface of the substrate. An electrical connector may be disposed on the surface and may be configured to receive an electrical connection from a separate electrical component or assembly. A molded layer may be formed over at least a portion of the surface fully encapsulating the group of surface-mounted electronic components and partially encapsulating the electrical connector.

公开(公告)号：US09839133B2

公开(公告)日：2017-12-05

申请号：US14730250

申请日：2015-06-04

Applicant: APPLE INC.

Inventor： Meng Chi Lee ,  Shankar Pennathur ,  Scott L. Gooch ,  Dennis R. Pyper ,  Amir Salehi

IPC: H01L23/40 ,  H05K1/18 ,  H05K1/14 ,  H01L25/065 ,  H05K3/40 ,  H05K3/36 ,  H05K3/28

CPC classification number: H05K1/189 ,  H01L23/4012 ,  H01L25/0652 ,  H01L25/0655 ,  H05K1/141 ,  H05K1/144 ,  H05K1/181 ,  H05K3/284 ,  H05K3/361 ,  H05K3/4015 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2203/1316 ,  Y10T29/49128

Abstract: Readily modifiable and customizable, low-area overhead interconnect structures for forming connections between a system-in-a-package module and other components in an electronic device. One example may provide an interposer for providing an interconnection between a system-in-a-package module and other components in an electronic device. Another may provide a plurality of conductive pins or contacts to form interconnect paths between a module and other components.

公开(公告)号：US20160021756A1

公开(公告)日：2016-01-21

申请号：US14730250

申请日：2015-06-04

Applicant: APPLE INC.

Inventor： Meng Chi Lee ,  Shankar Pennathur ,  Scott L. Gooch ,  Dennis R. Pyper ,  Amir Salehi

IPC: H05K1/18 ,  H05K1/14 ,  H05K3/36 ,  H05K3/32 ,  H05K3/30 ,  H05K1/11 ,  H05K3/28

CPC classification number: H05K1/189 ,  H01L23/4012 ,  H01L25/0652 ,  H01L25/0655 ,  H05K1/141 ,  H05K1/144 ,  H05K1/181 ,  H05K3/284 ,  H05K3/361 ,  H05K3/4015 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2203/1316 ,  Y10T29/49128

Abstract: Readily modifiable and customizable, low-area overhead interconnect structures for forming connections between a system-in-a-package module and other components in an electronic device. One example may provide an interposer for providing an interconnection between a system-in-a-package module and other components in an electronic device. Another may provide a plurality of conductive pins or contacts to form interconnect paths between a module and other components.

Abstract translation: 易于修改和可定制的低面积架空互连结构，用于在系统级封装模块和电子设备中的其他组件之间形成连接。 一个示例可以提供用于在电子设备中的系统级封装模块和其它部件之间提供互连的插入器。 另一个可以提供多个导电引脚或触点以在模块和其它部件之间形成互连路径。

公开(公告)号：US20220013834A1

公开(公告)日：2022-01-13

申请号：US17484471

申请日：2021-09-24

Applicant: Apple Inc.

Inventor： Angelo V. Marasco ,  Nathan J. Bohney ,  John M. McCambridge ,  Antonio Manenti ,  Laura E. Mayer ,  Scott L. Gooch ,  Jonathan C. Wilson ,  Flynn P. Carson

IPC: H01M50/183 ,  H01M10/42 ,  H01M50/40 ,  H01M50/531 ,  H01M50/543

Abstract: Battery systems according to embodiments of the present technology may include a battery cell having an electrode tab extending from an edge of the battery cell. The systems may also include a module electrically coupled with the battery cell. The module may be characterized by a first surface, a height, and a second surface opposite the first surface. A conductive tab coupled along the first surface of the module may extend from a first end parallel to a plane of the first surface. The conductive tab may be characterized by a curvature proximate a midpoint of the conductive tab. A distal region of the conductive tab may return back across the first surface of the module substantially parallel to the first surface. A distal portion of the electrode tab may be fixedly coupled with the distal region of the conductive tab.

公开(公告)号：US09484228B2

公开(公告)日：2016-11-01

申请号：US14563798

申请日：2014-12-08

Applicant: Apple Inc.

Inventor： Scott L. Gooch ,  Shankar S. Pennathur

IPC: B29C45/14 ,  H01L21/56 ,  B29C45/27 ,  B29C45/76 ,  B29C45/02 ,  H05K3/00 ,  B29L31/34 ,  H05K3/28

CPC classification number: H01L21/565 ,  B29C45/02 ,  B29C45/14655 ,  B29C45/27 ,  B29C45/766 ,  B29C2945/76006 ,  B29C2945/7611 ,  B29C2945/762 ,  B29C2945/76381 ,  B29C2945/76498 ,  B29C2945/76595 ,  B29C2945/76678 ,  B29C2945/76859 ,  B29L2031/3425 ,  H01L21/563 ,  H01L21/568 ,  H01L2924/181 ,  H05K3/0091 ,  H05K3/284 ,  H05K2203/1316 ,  H01L2924/00012

Abstract: Molding assemblies and methods for dual side package molding are described. In an embodiment, a molding compound is injected into a front cavity with a first actuator, and a molding compound is injected into a back cavity with a second actuator, with the first and second actuator assemblies being independently controlled. In an embodiment, the molding compound flows through a through-hole in a molding substrate from a front side of the molding substrate to a back side of the molding substrate, and into the back cavity.

Abstract translation: 描述了用于双面包装成型的成型组件和方法。 在一个实施例中，将模塑料注入到具有第一致动器的前腔中，并且将模塑料注入具有第二致动器的后腔中，其中第一和第二致动器组件被独立地控制。 在一个实施方案中，模塑料从模塑基材的前侧流过成型基材的通孔到模制基材的背面，并流入后腔。

公开(公告)号：US20160099159A1

公开(公告)日：2016-04-07

申请号：US14563798

申请日：2014-12-08

Applicant: Apple Inc.

Inventor： Scott L. Gooch ,  Shankar S. Pennathur

IPC: H01L21/56

CPC classification number: H01L21/565 ,  B29C45/02 ,  B29C45/14655 ,  B29C45/27 ,  B29C45/766 ,  B29C2945/76006 ,  B29C2945/7611 ,  B29C2945/762 ,  B29C2945/76381 ,  B29C2945/76498 ,  B29C2945/76595 ,  B29C2945/76678 ,  B29C2945/76859 ,  B29L2031/3425 ,  H01L21/563 ,  H01L21/568 ,  H01L2924/181 ,  H05K3/0091 ,  H05K3/284 ,  H05K2203/1316 ,  H01L2924/00012

Abstract: Molding assemblies and methods for dual side package molding are described. In an embodiment, a molding compound is injected into a front cavity with a first actuator, and a molding compound is injected into a back cavity with a second actuator, with the first and second actuator assemblies being independently controlled. In an embodiment, the molding compound flows through a through-hole in a molding substrate from a front side of the molding substrate to a back side of the molding substrate, and into the back cavity.

Abstract translation: 描述了用于双面包装成型的成型组件和方法。 在一个实施例中，将模塑料注入到具有第一致动器的前腔中，并且将模塑料注入具有第二致动器的后腔中，其中第一和第二致动器组件被独立地控制。 在一个实施方案中，模塑料从模塑基材的前侧流过成型基材的通孔到模制基材的背面，并流入后腔。