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1.发明授权公开(公告)号：US10476445B2
公开(公告)日：2019-11-12
申请号：US15907218
申请日：2018-02-27
Applicant: Aviat U.S., Inc.
Inventor： Frank Matsumoto , Youming Qin , David C. M. Pham , Jayesh Nath , Ying Shen
Abstract: An exemplary system comprises a linearizer module, a first upconverter module, a power amplifier module, a signal sampler module, and a downconverter module. The linearizer module may be configured to receive a first intermediate frequency signal and to adjust the first intermediate frequency signal based on a reference signal and a signal based on a second intermediate frequency signal. The first upconverter module may be configured to receive and up-convert a signal based on the adjusted first intermediate frequency signal to a radio frequency signal. The power amplifier module may be configured to receive and amplify a power of a signal based on the radio frequency signal. The signal sampler module may be configured to sample a signal based on the amplified radio frequency signal. The downconverter module may be configured to receive and down-convert a signal based on the sampled radio frequency signal to the second intermediate frequency signal.
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2.发明授权公开(公告)号：US09906194B2
公开(公告)日：2018-02-27
申请号：US15156832
申请日：2016-05-17
Applicant: Aviat U.S., Inc.
Inventor： Frank Matsumoto , Youming Qin , David C. M. Pham , Jayesh Nath , Ying Shen
CPC classification number: H03F1/32 , H03F1/0205 , H03F1/0211 , H03F1/3247 , H03F3/19 , H03F3/21 , H03F3/245 , H03F2200/129 , H03F2200/207 , H03F2200/451 , H04B1/04 , H04B2001/0425
Abstract: An exemplary system comprises a linearizer module, a first upconverter module, a power amplifier module, a signal sampler module, and a downconverter module. The linearizer module may be configured to receive a first intermediate frequency signal and to adjust the first intermediate frequency signal based on a reference signal and a signal based on a second intermediate frequency signal. The first upconverter module may be configured to receive and up-convert a signal based on the adjusted first intermediate frequency signal to a radio frequency signal. The power amplifier module may be configured to receive and amplify a power of a signal based on the radio frequency signal. The signal sampler module may be configured to sample a signal based on the amplified radio frequency signal. The downconverter module may be configured to receive and down-convert a signal based on the sampled radio frequency signal to the second intermediate frequency signal.
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公开(公告)号：US10461387B2
公开(公告)日：2019-10-29
申请号：US15802270
申请日：2017-11-02
Applicant: Aviat U.S., Inc.
Inventor： Jayesh Nath , Ying Shen
Abstract: Systems and methods for improved chip device performance are discussed herein. An exemplary chip device for use in an integrated circuit comprises a bottom and a top opposite the bottom. The chip device comprises a through-chip device interconnect and a clearance region. The through-chip device interconnect is configured to provide an electrical connection between a ground plane trace on the bottom and a chip device path on the top of the chip device. The clearance region on the bottom of the chip device comprises an electrically conductive substance. The size and shape of the clearance region assist in impedance matching. The chip device path on the top of the chip device may further comprise at least one tuning stub. The size and shape of the at least one tuning stub also assist in impedance matching.
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公开(公告)号：US09583813B2
公开(公告)日：2017-02-28
申请号：US14453563
申请日：2014-08-06
Applicant: Aviat U.S., Inc.
Inventor： Jayesh Nath , Ying Shen , Edwin Nealis
CPC classification number: H01P11/003 , B33Y70/00 , B33Y80/00 , G02B6/125 , G02B6/138 , H01P1/207 , H01P11/001 , H01P11/002 , H03H3/00 , H03H3/007 , H03H7/468 , Y10T29/49002 , Y10T29/49016 , Y10T29/49117
Abstract: Various embodiments are directed toward systems and method for manufacturing low cost passive waveguide components. For example, various embodiments relate to low cost manufacturing of passive waveguide components, including without limitation, waveguide filters, waveguide diplexers, waveguide multiplexers, waveguide bends, waveguide transitions, waveguide spacers, and antenna adapters. Some embodiments comprise manufacturing a passive waveguide component by creating a non-conductive structure using a low cost fabrication technology, such as injection molding or three-dimensional (3D) printing, and then forming a conductive layer over the non-conductive structure such that the conductive layer creates an electrical feature of the passive waveguide component.
Abstract translation: 各种实施例涉及用于制造低成本无源波导部件的系统和方法。 例如，各种实施例涉及无源波导部件的低成本制造，包括但不限于波导滤波器，波导双工器，波导复用器，波导弯曲，波导转换，波导间隔器和天线适配器。 一些实施例包括通过使用诸如注射成型或三维（3D）印刷的低成本制造技术产生非导电结构制造无源波导部件，然后在非导电结构上形成导电层，使得 导电层产生无源波导部件的电气特征。
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公开(公告)号：US20140347144A1
公开(公告)日：2014-11-27
申请号：US14453563
申请日：2014-08-06
Applicant: AVIAT U.S., INC.
Inventor： Jayesh Nath , Ying Shen , Edwin Nealis
CPC classification number: H01P11/003 , B33Y70/00 , B33Y80/00 , G02B6/125 , G02B6/138 , H01P1/207 , H01P11/001 , H01P11/002 , H03H3/00 , H03H3/007 , H03H7/468 , Y10T29/49002 , Y10T29/49016 , Y10T29/49117
Abstract: Various embodiments are directed toward systems and method for manufacturing low cost passive waveguide components. For example, various embodiments relate to low cost manufacturing of passive waveguide components, including without limitation, waveguide filters, waveguide diplexers, waveguide multiplexers, waveguide bends, waveguide transitions, waveguide spacers, and antenna adapters. Some embodiments comprise manufacturing a passive waveguide component by creating a non-conductive structure using a low cost fabrication technology, such as injection molding or three-dimensional (3D) printing, and then forming a conductive layer over the non-conductive structure such that the conductive layer creates an electrical feature of the passive waveguide component.
Abstract translation: 各种实施例涉及用于制造低成本无源波导部件的系统和方法。 例如，各种实施例涉及无源波导部件的低成本制造，包括但不限于波导滤波器，波导双工器，波导复用器，波导弯曲，波导转换，波导间隔器和天线适配器。 一些实施例包括通过使用诸如注射成型或三维（3D）印刷的低成本制造技术产生非导电结构制造无源波导部件，然后在非导电结构上形成导电层，使得 导电层产生无源波导部件的电气特征。
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Patent Agency Ranking
公开(公告)号：US10090570B2
公开(公告)日：2018-10-02
申请号：US15357967
申请日：2016-11-21
Applicant: Aviat U.S., Inc.
Inventor： Edwin Nealis , Jayesh Nath
Abstract: Various embodiments provide for waveguide assemblies which may be utilized in wireless communication systems. Various embodiments may allow for waveguide assemblies to be assembled using tools and methodologies that are simpler than the conventional alternatives. Some embodiments provide for a waveguide assembly that comprises a straight tubular portion configured to be shortened, using simple techniques and tools, in order to fit into a waveguide assembly. For instance, for some embodiments, the waveguide assembly may be configured such that the straight portion can be shortened, at a cross section of the portion, using a basic cutting tool, such a hacksaw. In some embodiments, the straight portion may be further configured such that regardless of whether the straight tubular portion is shortened, the waveguide assembly remains capable of coupling to flanges, which facilitate coupling the straight tubular portion to connectable assemblies, such as other waveguide assemblies, radio equipment, or antennas.
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公开(公告)号：US20180053982A1
公开(公告)日：2018-02-22
申请号：US15802270
申请日：2017-11-02
Applicant: Aviat U.S., Inc.
Inventor： Jayesh Nath , Ying Shen
CPC classification number: H01P3/081 , H01L23/481 , H01L23/66 , H01L2223/6616 , H01L2223/6627 , H01L2223/6683 , H01L2924/0002 , Y10T29/49155 , H01L2924/00
Abstract: Systems and methods for improved chip device performance are discussed herein. An exemplary chip device for use in an integrated circuit comprises a bottom and a top opposite the bottom. The chip device comprises a through-chip device interconnect and a clearance region. The through-chip device interconnect is configured to provide an electrical connection between a ground plane trace on the bottom and a chip device path on the top of the chip device. The clearance region on the bottom of the chip device comprises an electrically conductive substance. The size and shape of the clearance region assist in impedance matching. The chip device path on the top of the chip device may further comprise at least one tuning stub. The size and shape of the at least one tuning stub also assist in impedance matching.
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公开(公告)号：US09531412B2
公开(公告)日：2016-12-27
申请号：US14704468
申请日：2015-05-05
Applicant: Aviat U.S., Inc.
Inventor： Jayesh Nath , Ying Shen , Frank Matsumoto , Youming Qin , David C. M. Pham
IPC: H04B1/04
CPC classification number: H04B1/0475 , H03F1/3241 , H03F1/3247 , H03F1/345 , H03F3/19 , H03F3/245 , H03F3/60 , H03F2200/204 , H03F2200/207 , H03F2200/423 , H04B2001/0425
Abstract: Various embodiments provide for systems and methods for increased linear output power of a transmitter. An exemplary wireless communications system for transmitting an input signal comprises a predistorter module, a GaN power amplifier, a coupler, and an antenna. The predistorter module is configured to detect existing distortion by comparing the input signal to a feedback signal and generate a correction signal. The predistorter may adaptively adjust its operation to minimize the existing distortion due to GaN power amplifier nonlinear characteristics. The result is that the GaN power amplifier may send a power signal of improved linearity to the antenna. The coupler is configured to sample the amplified signal from the GaN power amplifier to generate the feedback signal. The antenna is configured to transmit the amplified signal.
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9.发明申请SYSTEMS AND METHODS FOR IMPROVED POWER YIELD AND LINEARIZATION IN RADIO FREQUENCY TRANSMITTERS 有权用于改善无线电频率发射机功率和线性化的系统和方法公开(公告)号：US20160261240A1
公开(公告)日：2016-09-08
申请号：US15156832
申请日：2016-05-17
Applicant: Aviat U.S., Inc.
Inventor： Frank Matsumoto , Youming Qin , David C.M. Pham , Jayesh Nath , Ying Shen
CPC classification number: H03F1/32 , H03F1/0205 , H03F1/0211 , H03F1/3247 , H03F3/19 , H03F3/21 , H03F3/245 , H03F2200/129 , H03F2200/207 , H03F2200/451 , H04B1/04 , H04B2001/0425
Abstract: An exemplary system comprises a linearizer module, a first upconverter module, a power amplifier module, a signal sampler module, and a downconverter module. The linearizer module may be configured to receive a first intermediate frequency signal and to adjust the first intermediate frequency signal based on a reference signal and a signal based on a second intermediate frequency signal. The first upconverter module may be configured to receive and up-convert a signal based on the adjusted first intermediate frequency signal to a radio frequency signal. The power amplifier module may be configured to receive and amplify a power of a signal based on the radio frequency signal. The signal sampler module may be configured to sample a signal based on the amplified radio frequency signal. The downconverter module may be configured to receive and down-convert a signal based on the sampled radio frequency signal to the second intermediate frequency signal.
Abstract translation: 示例性系统包括线性化模块，第一上变频器模块，功率放大器模块，信号采样器模块和下变频器模块。 线性化模块可以被配置为接收第一中频信号并且基于参考信号和基于第二中频信号的信号来调整第一中频信号。 第一上变频器模块可以被配置为基于经调整的第一中频信号将信号接收和上变频到射频信号。 功率放大器模块可以被配置为基于射频信号来接收和放大信号的功率。 信号采样器模块可以被配置为基于放大的射频信号对信号进行采样。 下变频器模块可以被配置为基于所采样的射频信号将信号接收和下变频到第二中频信号。
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10.发明申请公开(公告)号：US20170069946A1
公开(公告)日：2017-03-09
申请号：US15357967
申请日：2016-11-21
Applicant: Aviat U.S., Inc.
Inventor： Edwin Nealis , Jayesh Nath
CPC classification number: H01P1/022 , H01P1/042 , H01P3/12 , H01P11/002 , Y10T29/49016 , Y10T29/49826
Abstract: Various embodiments provide for waveguide assemblies which may be utilized in wireless communication systems. Various embodiments may allow for waveguide assemblies to be assembled using tools and methodologies that are simpler than the conventional alternatives. Some embodiments provide for a waveguide assembly that comprises a straight tubular portion configured to be shortened, using simple techniques and tools, in order to fit into a waveguide assembly. For instance, for some embodiments, the waveguide assembly may be configured such that the straight portion can be shortened, at a cross section of the portion, using a basic cutting tool, such a hacksaw. In some embodiments, the straight portion may be further configured such that regardless of whether the straight tubular portion is shortened, the waveguide assembly remains capable of coupling to flanges, which facilitate coupling the straight tubular portion to connectable assemblies, such as other waveguide assemblies, radio equipment, or antennas.
Abstract translation: 各种实施例提供可用于无线通信系统中的波导组件。 各种实施例可以允许使用比常规替代方案更简单的工具和方法来组装波导组件。 一些实施例提供了一种波导组件，其包括使用简单的技术和工具来缩短的直管状部分，以便装配到波导组件中。 例如，对于一些实施例，波导组件可以被配置为使得可以使用基本切削工具（例如钢锯）在该部分的横截面处缩短直线部分。 在一些实施例中，直线部分可以被进一步配置成使得无论直管状部分是否缩短，波导组件仍然能够联接到法兰，这有助于将直管状部分联接到诸如其它波导组件的可连接组件， 无线电设备或天线。
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