公开(公告)号：US20240072413A1

公开(公告)日：2024-02-29

申请号：US17894946

申请日：2022-08-24

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Yu HO ,  Meng-Wei HSIEH ,  Chih-Pin HUNG

IPC: H01Q1/22 ,  H01Q1/52 ,  H01Q21/06 ,  H01Q25/00

CPC classification number: H01Q1/2283 ,  H01Q1/523 ,  H01Q21/065 ,  H01Q25/00

Abstract: An electronic device is provided. The electronic device includes an antenna array including a plurality of antenna patterns collectively configured to provide a scan-angle coverage. Each of the antenna patterns includes a curved surface.

公开(公告)号：US20230268638A1

公开(公告)日：2023-08-24

申请号：US17676088

申请日：2022-02-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Yu HO ,  Meng-Wei HSIEH

IPC: H01Q1/22 ,  H01L23/66

CPC classification number: H01Q1/2283 ,  H01L23/66 ,  H01L2223/6677

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a first antenna pattern disposed at a first elevation and a second antenna pattern disposed at a second elevation different from the first elevation. The first antenna pattern and the second antenna pattern define an air cavity. The semiconductor device package also includes a circuit layer. The air cavity is between the first antenna pattern, the second antenna pattern, and the circuit layer.

公开(公告)号：US20220200129A1

公开(公告)日：2022-06-23

申请号：US17133358

申请日：2020-12-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Yu HO ,  Meng-Wei HSIEH

IPC: H01Q1/22 ,  H01L23/31 ,  H01L23/538 ,  H01L23/66 ,  H01L23/00 ,  H01L21/48 ,  H01Q1/48

Abstract: The present disclosure provides an antenna module. The antenna module includes an antenna layer, a ground layer, and an electronic component. The ground layer is disposed over the antenna layer. The electronic component is disposed between the antenna layer and the ground layer.

公开(公告)号：US20230420395A1

公开(公告)日：2023-12-28

申请号：US17846649

申请日：2022-06-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei-Cheng LIN ,  Hung-Yi LIN ,  Cheng-Yuan KUNG ,  Hsu-Chiang SHIH ,  Cheng-Yu HO

IPC: H01L23/66 ,  H01L23/367 ,  H01L23/48 ,  H01L23/538 ,  H01L21/48

CPC classification number: H01L23/66 ,  H01L23/367 ,  H01L23/481 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5389 ,  H01L21/4853 ,  H01L21/4857 ,  H01L2223/6677

Abstract: The present disclosure provides an electronic device. The electronic device includes a first electronic component and a second electronic component. The first electronic component is configured to receive a radio frequency (RF) signal and amplify a power of the RF signal. The second electronic component is disposed under the first electronic component. The second electronic component includes an interconnection structure passing through the second electronic component. The interconnection structure is configured to provide a path for a transmission of the RF signal.

公开(公告)号：US20220157746A1

公开(公告)日：2022-05-19

申请号：US16953261

申请日：2020-11-19

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Yu HO ,  Meng-Wei HSIEH

IPC: H01L23/66 ,  H01L23/31 ,  H01L23/538 ,  H01L21/683 ,  H01L21/48 ,  H01L21/56 ,  H01Q5/307 ,  H01Q1/48

Abstract: The present disclosure provides an antenna module. The antenna module includes a first layer, a second layer, a first antenna, and a second antenna. The first layer has a first dielectric constant. The second layer is adjacent to the first layer. The second layer has a second Dk lower than the first Dk. The first antenna is disposed on the first layer and is configured for operating at a first frequency. The second antenna is disposed on the second layer and is configured for operating at a second frequency higher than the first frequency.

公开(公告)号：US20180131094A1

公开(公告)日：2018-05-10

申请号：US15348854

申请日：2016-11-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Yu HO ,  Chen-Chao WANG ,  Chun-Yen TING ,  Ming-Fong JHONG ,  Po-Chih PAN

IPC: H01Q9/04 ,  H01L23/66 ,  H01L23/538 ,  H01L25/065 ,  H01L23/552

CPC classification number: H01Q9/045 ,  H01L23/49816 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L23/552 ,  H01L23/66 ,  H01L24/17 ,  H01L25/0657 ,  H01L2223/6677 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06572 ,  H01L2924/01028 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1421 ,  H01L2924/3025 ,  H01Q9/0457 ,  H01Q13/10 ,  H01Q19/30 ,  H01Q21/28

Abstract: Various embodiments of the present disclosure relate to a semiconductor device package including a carrier, an electrical component, an antenna, a conductive pad and a conductive line. The carrier includes a top surface. The electrical component is disposed over the top surface of the carrier. The antenna is disposed over the top surface of the carrier and spaced away from the electrical component. The conductive pad is disposed over the top surface of the carrier and beneath the antenna, wherein the conductive pad includes a resonant structure. The conductive line is electrically connected to the electrical component and extends within the carrier. A part of the conductive line is beneath the antenna and the resonant structure of the conductive pad.