公开(公告)号：US20180226320A1

公开(公告)日：2018-08-09

申请号：US15429024

申请日：2017-02-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ian HU ,  Jia-Rung HO ,  Jin-Feng YANG ,  Chih-Pin HUNG ,  Ping-Feng YANG

IPC: H01L23/373 ,  H01L23/367 ,  H01L23/31 ,  H01L23/04 ,  H01L23/00

CPC classification number: H01L24/48 ,  H01L23/04 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/3142 ,  H01L23/367 ,  H01L23/373 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/131 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49175 ,  H01L2224/49431 ,  H01L2224/49433 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83493 ,  H01L2224/8592 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/15321 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/014 ,  H01L2224/29099

Abstract: A semiconductor package includes a substrate, a semiconductor chip and a heat dissipation structure. The semiconductor chip includes a first surface, a second surface opposite to the first surface, and at least one chip pad disposed adjacent to the first surface. The chip pad is electrically connected to the substrate. The heat dissipation structure is disposed adjacent to the second surface of the semiconductor chip and a portion of the substrate. An area of the heat dissipation structure is greater than an area of the semiconductor chip.