公开(公告)号：US20180114758A1

公开(公告)日：2018-04-26

申请号：US15334230

申请日：2016-10-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih Sheng YAO ,  Huan Wun LI ,  Yu-Chih LEE ,  Wei-Hsuan LEE

IPC: H01L23/552 ,  H01L23/498 ,  H01L23/482 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L23/552 ,  H01L21/485 ,  H01L21/4853 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/4824 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/5389 ,  H01L24/16 ,  H01L2224/16227

Abstract: A semiconductor device package comprises a substrate, a first electronic component, first and second conductive pads, a first frame board, an encapsulation layer, and a conductive layer. The substrate has a first surface and a second surface opposite to the first surface. The first electronic component, the first and second conductive pads, and the first frame board are on the first surface of the substrate. The first frame board surrounds the first electronic component and comprises a first conductive via and a second electronic component. The encapsulation layer encapsulates the first electronic component and the first frame board. The conductive layer is on the first frame board and the encapsulation layer. The first conductive via is electrically connected to the second conductive pad and the conductive layer, and the second electronic component is electrically connected to the first conductive pad.

公开(公告)号：US20220181277A1

公开(公告)日：2022-06-09

申请号：US17112930

申请日：2020-12-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Wei HSIEH ,  Ming-Tau HUANG ,  Yu-Chih LEE

IPC: H01L23/64 ,  H01L23/31 ,  H01L49/02 ,  H01L21/56

Abstract: The present disclosure provides a semiconductor a semiconductor device package includes a substrate, an electronic component disposed on the substrate, a package body disposed on the substrate and encapsulating the electronic component, and a capacitor disposed above the electronic component. The capacitor is exposed from the package body.

公开(公告)号：US20240197176A1

公开(公告)日：2024-06-20

申请号：US18083447

申请日：2022-12-16

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Kuei-Hao TSENG ,  Kai Hung WANG ,  Kai-Di LU ,  Yu-Chih LEE ,  Cheng-Tsao PENG ,  Pang Yuan LEE

IPC: A61B5/00 ,  H05K1/02

CPC classification number: A61B5/0002 ,  H05K1/0277

Abstract: The present disclosure provides a sensing device. The sensing device includes a flexible element having a first sensing area, an electronic component embedded within the flexible element, and an adjustable conductive element disposed in the flexible element and configured to electrically connect the first sensing area of the flexible element with the electronic component.

公开(公告)号：US20230019715A1

公开(公告)日：2023-01-19

申请号：US17377168

申请日：2021-07-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Chih LEE ,  Chih Lung LIN

IPC: A61B5/00 ,  A61B5/318 ,  A61B5/389 ,  A61B5/398

Abstract: The present disclosure provides a detection module including a carrier configured to be adjustable to at least partially conform to a shape of a wearable object. The detection module further includes a sensing element in contact with the carrier and at least partially exposed from the carrier.