公开(公告)号：US20220141971A1

公开(公告)日：2022-05-05

申请号：US17573595

申请日：2022-01-11

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Hung CHEN ,  Yung I. YEH ,  Chang-Lin YEH ,  Sheng-Yu CHEN

IPC: H05K5/00 ,  H05K5/06 ,  H05K1/18 ,  H05K9/00 ,  H05K3/28 ,  H05K1/14

Abstract: A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.

公开(公告)号：US20210076510A1

公开(公告)日：2021-03-11

申请号：US16563713

申请日：2019-09-06

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Hung CHEN ,  Yung I. YEH ,  Chang-Lin YEH ,  Sheng-Yu CHEN

IPC: H05K5/00 ,  H05K5/06 ,  H05K1/18 ,  H05K9/00 ,  H05K3/28 ,  H05K1/14

Abstract: A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.

公开(公告)号：US20180122761A1

公开(公告)日：2018-05-03

申请号：US15340803

申请日：2016-11-01

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chun-Chin HUANG ,  Yung I. YEH ,  Che-Ming HSU

IPC: H01L23/00

CPC classification number: H01L24/13 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/14 ,  H01L24/16 ,  H01L2224/0362 ,  H01L2224/0401 ,  H01L2224/11 ,  H01L2224/11462 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13026 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/14051 ,  H01L2224/16221 ,  H01L2224/16238 ,  H01L2924/014 ,  H01L2924/3511

Abstract: A semiconductor device package ready for assembly includes: a semiconductor substrate; a first under-bump-metallurgy (UBM) layer disposed on the semiconductor substrate; a first conductive pillar disposed on the first UBM layer; and a second conductive pillar disposed on the first conductive pillar. A material of the first conductive pillar is different from a material of the second conductive pillar, and the material of the second conductive pillar includes an antioxidant.

公开(公告)号：US20210066354A1

公开(公告)日：2021-03-04

申请号：US16557990

申请日：2019-08-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Hung CHEN ,  Yung I. YEH ,  Chang-Lin YEH ,  Sheng-Yu CHEN

IPC: H01L27/12 ,  H01L33/62 ,  H01L33/54 ,  H01L25/075

Abstract: A semiconductor device package includes a main substrate, at least one thin film transistor (TFT) module, at least one first electronic component, at least one encapsulant and a plurality of light emitting devices. The main substrate has a first surface and a second surface opposite to the first surface. The thin film transistor (TFT) module is disposed adjacent to and electrically connected to the first surface of the main substrate. The first electronic component is disposed adjacent to and electrically connected to the first surface of the main substrate. The encapsulant covers the at least one thin film transistor (TFT) module and the at least one first electronic component. The light emitting devices are electrically connected to the at least one thin film transistor (TFT) module.

公开(公告)号：US20200083132A1

公开(公告)日：2020-03-12

申请号：US16409665

申请日：2019-05-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yen-Chi HUANG ,  Hao-Chih HSIEH ,  Jin Han SHIH ,  Yung I. YEH ,  Tun-Ching PI

IPC: H01L23/31 ,  H01L21/56 ,  H05K1/18

Abstract: A semiconductor device package includes a carrier and an encapsulant disposed on the carrier. At least one portion of the encapsulant is spaced from the carrier by a space.