公开(公告)号：US06414509B1

公开(公告)日：2002-07-02

申请号：US09564652

申请日：2000-05-03

申请人： Anilkumar Chinuprasad Bhatt ,  Leo Raymond Buda ,  Robert Douglas Edwards ,  Paul Joseph Hart ,  Anthony Paul Ingraham ,  Voya Rista Markovich ,  Jaynal Abedin Molla ,  Richard Gerald Murphy ,  George John Saxenmeyer, Jr. ,  George Frederick Walker ,  Bette Jaye Whalen ,  Richard Stuart Zarr

发明人： Anilkumar Chinuprasad Bhatt ,  Leo Raymond Buda ,  Robert Douglas Edwards ,  Paul Joseph Hart ,  Anthony Paul Ingraham ,  Voya Rista Markovich ,  Jaynal Abedin Molla ,  Richard Gerald Murphy ,  George John Saxenmeyer, Jr. ,  George Frederick Walker ,  Bette Jaye Whalen ,  Richard Stuart Zarr

IPC分类号： G01R3102

CPC分类号： H01L24/81 ,  G01R31/2886 ,  H01L22/20 ,  H01L24/75 ,  H01L2224/0401 ,  H01L2224/05557 ,  H01L2224/13111 ,  H01L2224/75 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3011 ,  H01L2924/00

摘要： A method of testing semiconductor chips is disclosed. The individual semiconductor chips have I/O, power, and ground contacts. In the method of the invention a chip carrier is provided. The chip carrier has contacts corresponding to the contacts on the semiconductor chip. The carrier contacts have dendritic surfaces. The chip contacts are brought into conductive contact with the conductor pads on the chip carrier. Test signal input vectors are applied to the inputs of the semiconductor chip, and output signal vectors are recovered from the semiconductor chip. After testing, the chip may be removed from the substrate. Alternatively, the chip may be bonded through the dendritic conductor pads to the substrate after successful testing.

摘要翻译： 公开了半导体芯片的测试方法。 单个半导体芯片具有I / O，电源和接地触点。 在本发明的方法中，提供了一个芯片载体。 芯片载体具有对应于半导体芯片上的触点的触点。 载体触点具有树枝状表面。 芯片触点与芯片载体上的导体焊盘导电接触。 测试信号输入矢量被施加到半导体芯片的输入，从半导体芯片恢复输出信号矢量。 在测试之后，芯片可以从衬底去除。 或者，芯片可以在成功测试之后通过树枝状导体焊盘粘合到衬底上。

公开(公告)号：US6165278A

公开(公告)日：2000-12-26

申请号：US536238

申请日：2000-03-27

申请人： Paul Joseph Hart ,  Vittorio Sirtori ,  Sergio Varinelli ,  Marino Verderio ,  Franco Zambon

发明人： Paul Joseph Hart ,  Vittorio Sirtori ,  Sergio Varinelli ,  Marino Verderio ,  Franco Zambon

IPC分类号： B08B3/08 ,  C11D7/10 ,  C11D7/50 ,  C11D11/00 ,  H05K1/02 ,  H05K3/26 ,  B08B3/04

CPC分类号： C11D7/10 ,  B08B3/08 ,  C11D7/5022 ,  C11D11/0047 ,  H05K1/0203 ,  H05K3/26 ,  H05K2203/0783

摘要： A method for removing thermal grease from an electronic card having plated via holes and including electronic components thereon, the method including the steps of providing a substantially water free solution having an alcohol and at least one compound of a neutral ammonium salt of an organic acid and immersing the electronic card in the solution for a predetermined period of time remove the thermal grease from the electronic card.

摘要翻译： 一种用于从具有电镀通孔并且包括电子部件的电子卡移除导热油脂的方法，所述方法包括以下步骤：提供具有醇和至少一种有机酸的中性铵盐的化合物的基本上无水的溶液，以及 将电子卡浸入溶液中一段预定的时间，从电子卡片中取出导热油脂。

公开(公告)号：US5789121A

公开(公告)日：1998-08-04

申请号：US879470

申请日：1997-06-20

申请人： Douglas Adam Cywar ,  Charles Robert Davis ,  Thomas Patrick Duffy ,  Frank Daniel Egitto ,  Paul Joseph Hart ,  Gerald Walter Jones ,  Edward McLeskey

发明人： Douglas Adam Cywar ,  Charles Robert Davis ,  Thomas Patrick Duffy ,  Frank Daniel Egitto ,  Paul Joseph Hart ,  Gerald Walter Jones ,  Edward McLeskey

IPC分类号： G03F7/00 ,  H05K1/09 ,  H05K3/00 ,  H05K3/10 ,  H05K3/12 ,  H05K3/40 ,  H05K3/46 ,  G03C3/00

CPC分类号： G03F7/00 ,  H05K3/0032 ,  H05K3/1258 ,  H05K3/4069 ,  H05K1/095 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2203/0191 ,  H05K2203/0568 ,  H05K2203/0769 ,  H05K2203/0783 ,  H05K2203/1383 ,  H05K3/0035 ,  H05K3/107 ,  H05K3/4664 ,  Y10S428/901 ,  Y10S430/146 ,  Y10T428/24917

摘要： The present invention provides a method of ablative photodecomposition and forming metal pattern which attains high resolution, is convenient, and employs non-halogenated solvents. The present invention is directed to a process for forming a metal pattern, preferably circuitization on an organic substrate, preferably on a circuit board or component thereof, which comprises coating the substrate with an ablatively-removable coating comprising a polymer resin preferably an acrylate polymer resin and preferably an ultraviolet absorber. A pattern is formed in the polymer coating corresponding to the desired metal pattern by irradiating at least a portion of the polymer coating with a sufficient amount of ultraviolet radiation to thereby ablatively remove the irradiated portion of the polymer coating. Next the patterned substrate is coated with a conductive metal paste to define the metal pattern, and the conductive metal paste is cured. The remaining polymer coating is removed by solvent stripping with nonhalogenated solvents. The present invention further includes patterning electronic structures comprising multilayer circuitry using the above method. An excimer laser is used to form vias or through holes in the electronic structure while simultaneously patterning the polymer coating. This results in perfect alignment between the pattern formed in the polymer coating and the vias or through holes. High resolution circuitry is thus attainable when the electronic structure is subsequently metallized with a conductive metal paste.

摘要翻译： 本发明提供了一种烧蚀光分解和形成金属图案的方法，其获得高分辨率，方便并采用非卤化溶剂。 本发明涉及一种用于形成金属图案的方法，优选在有机基板上，优选在电路板或其组件上进行电路化，该方法包括用可剥离涂层涂覆基材，该涂层包含聚合物树脂，优选丙烯酸酯聚合物树脂 优选紫外线吸收剂。 通过用足够量的紫外线照射至少一部分聚合物涂层，形成对应于所需金属图案的聚合物涂层中的图案，从而消除聚合物涂层的照射部分。 接下来，用导电金属膏涂覆图案化衬底以限定金属图案，并且导电金属膏被固化。 用非卤化溶剂通过溶剂汽提除去剩余的聚合物涂层。 本发明还包括使用上述方法图案化包括多层电路的电子结构。 准分子激光器用于在电子结构中形成通孔或通孔，同时构图聚合物涂层。 这导致在聚合物涂层中形成的图案与通孔或通孔之间完美对准。 因此，当电子结构随后用导电金属膏进行金属化时，可实现高分辨率电路。