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公开(公告)号：US20230092986A1
公开(公告)日：2023-03-23
申请号：US17802102
申请日：2021-02-02
Applicant: Apple Inc.
Inventor： Warren S. Rieutort-Louis , Meng-Huan Ho , Abbas Jamshidi Roudbari , Chih Jen Yang , Chin Wei Hsu , Jae Won Choi , Jean-Pierre S. Guillou , Ming Xu , Rui Liu , Yi Qiao , Yu-Wen Liu , Yuchi Che , Yue Cui
Abstract: An electronic device may include a display and an optical sensor formed underneath the display. A pixel removal region on the display may at least partially overlap with the sensor. The pixel removal region may include a plurality of non-pixel regions each of which is devoid of thin-film transistors. The plurality of non-pixel regions is configured to increase the transmittance of light through the display to the sensor. In addition to removing thin-film transistors in the pixel removal region, additional layers in the display stack-up may be removed. In particular, a cathode layer, polyimide layer, and/or substrate in the display stack-up may be patterned to have an opening in the pixel removal region. A polarizer may be bleached in the pixel removal region for additional transmittance gains. The cathode layer may be removed using laser ablation with a spot laser or blanket illumination.
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公开(公告)号：US10546796B2
公开(公告)日：2020-01-28
申请号：US16077185
申请日：2017-02-10
Applicant: Apple Inc.
Inventor： Hsin-Hua Hu , Jaein Choi , James E. Pedder , Ion Bita , Hairong Tang , Chin Wei Hsu , Sandeep Chalasani , Chih-Lei Chen , Sunggu Kang , Shinya Ono , Jung Yen Huang , Lun Tsai
IPC: H01L23/48 , H01L23/31 , H01L23/00 , H01L25/075 , H01L25/16
Abstract: Micro LED and microdriver chip integration schemes are described. In an embodiment a microdriver chip includes a plurality of trenches formed in a bottom surface of the microdriver chip, with each trench surrounding a conductive stud extending below a bottom surface of the microdriver chip body. Integration schemes are additionally described for providing electrical connection to conductive terminal contacts and micro LEDs bonded to a display substrate and adjacent to a microdriver chip.
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公开(公告)号：US20190115274A1
公开(公告)日：2019-04-18
申请号：US16077185
申请日：2017-02-10
Applicant: Apple Inc.
Inventor： Hsin-Hua Hu , Jaein Choi , James E. Pedder , Ion Bita , Hairong Tang , Chin Wei Hsu , Sandeep Chalasani , Chih-Lei Chen , Sunggu Kang , Shinya Ono , Jung Yen Huang , Lun Tsai
IPC: H01L23/31 , H01L23/00 , H01L25/075 , H01L25/16
Abstract: Micro LED and microdriver chip integration schemes are described. In an embodiment a microdriver chip includes a plurality of trenches formed in a bottom surface of the microdriver chip, with each trench surrounding a conductive stud extending below a bottom surface of the microdriver chip body. Integration schemes are additionally described for providing electrical connection to conductive terminal contacts and micro LEDs bonded to a display substrate and adjacent to a microdriver chip.
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公开(公告)号：US20250081730A1
公开(公告)日：2025-03-06
申请号：US18755498
申请日：2024-06-26
Applicant: Apple Inc.
Inventor： Andrew Lin , Alper Ozgurluk , Chao Liang Chien , Cheuk Chi Lo , Chia-Yu Chen , Chien-Chung Wang , Chih Pang Chang , Chih-Hung Yu , Chih-Wei Chang , Chin Wei Hsu , ChinWei Hu , Chun-Kai Tzeng , Chun-Ming Tang , Chun-Yao Huang , Hung-Che Ting , Jung Yen Huang , Lungpao Hsin , Shih Chang Chang , Tien-Pei Chou , Wen Sheng Lo , Yu-Wen Liu , Yung Da Lai
IPC: H10K59/121 , H10K59/131
Abstract: A display may include an array of pixels such as light-emitting diode pixels. The pixels may include multiple circuitry decks that each include one or more circuit components such as transistors, capacitors, and/or resistors. The circuitry decks may be vertically stacked. Each circuitry deck may include a planarization layer formed from a siloxane material that conforms to underlying components and provides a planar upper surface. In this way, circuitry components may be vertically stacked to mitigate the size of each pixel footprint. The circuitry components may include capacitors that include both a high-k dielectric layer and a low-k dielectric layer. The display pixel may include a via with a width of less than 1 micron.
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公开(公告)号：US20170294499A1
公开(公告)日：2017-10-12
申请号：US15268106
申请日：2016-09-16
Applicant: Apple Inc.
Inventor： Chang Ming Lu , Chia-Yu Chen , Chih Pang Chang , Ching-Sang Chuang , Hung-Che Ting , Jung Yen Huang , Sheng Hui Shen , Shih Chang Chang , Tsung-Hsiang Shih , Yu-Wen Liu , Yu Hung Chen , Kai-Chieh Wu , Lun Tsai , Takahide Ishii , Chung-Wang Lee , Hsing-Chuan Wang , Chin Wei Hsu , Fu-Yu Teng
IPC: H01L27/32 , H01L51/56 , H01L23/532 , H01L21/027 , H01L21/768 , H01L21/02
CPC classification number: H01L21/76834 , H01L21/02244 , H01L21/02252 , H01L21/02255 , H01L21/0273 , H01L21/7685 , H01L21/76877 , H01L21/77
Abstract: A component such as a display may have a substrate and thin-film circuitry on the substrate. The thin-film circuitry may be used to form an array of pixels for a display or other circuit structures. Metal traces may be formed among dielectric layers in the thin-film circuitry. Metal traces may be provided with insulating protective sidewall structures. The protective sidewall structures may be formed by treating exposed edge surfaces of the metal traces. A metal trace may have multiple layers such as a core metal layer sandwiched between barrier metal layers. The core metal layer may be formed from a metal that is subject to corrosion. The protective sidewall structures may help prevent corrosion in the core metal layer. Surface treatments such as oxidation, nitridation, and other processes may be used in forming the protective sidewall structures.
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Patent Agency Ranking
公开(公告)号：US20230307488A1
公开(公告)日：2023-09-28
申请号：US18161763
申请日：2023-01-30
Applicant: Apple Inc.
Inventor： Young Cheol Yang , Young Seok Kim , Aaron L Holsteen , Cheng Cheng , Chin Wei Hsu , Hsin I Lu , Ileana G. Rau , Jaein Choi , James M Perkins , James P Ibbetson , Joy M Johnson , Jui-Chih Liao , Steven E Molesa , Sunggu Kang , Yang Deng , Zhibing Ge
CPC classification number: H01L27/156 , H01L33/58 , H01L2933/0091
Abstract: An electronic device may have a display with an array of inorganic light-emitting diodes. The array of inorganic light-emitting diodes may be overlapped by a polarizer layer such as a circular polarizer. Alternatively, the display may be a polarizer-free display without any polarizer layer over the array of inorganic light-emitting diodes. Each inorganic light-emitting diode may be surrounded by a diffuser that redirects edge-emissions towards a viewer. A top diffuser, a color filter layer, a microlens, and/or a microlens with color filtering and/or diffusive properties may also optionally overlap each inorganic light-emitting diode. The inorganic light-emitting diodes may have reflective sidewalls to mitigate edge-emissions. In this type of arrangement, the array of inorganic light-emitting diodes may be coplanar with one or more opaque masking layers. To mitigate reflections, the display may include two opaque masking layers having differing properties or a single phase separated opaque masking layer.
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公开(公告)号：US10658441B2
公开(公告)日：2020-05-19
申请号：US16114039
申请日：2018-08-27
Applicant: Apple Inc.
Inventor： Kwang Ohk Cheon , Cheng Chen , Chien Lu , Chih-Lei Chen , Chin Wei Hsu , Hui Lu , KiBeom Kim , Lun Tsai , Meng-Huan Ho , Nai-Chih Kao , Pei-Ling Lin , Rui Liu , Shan-Jen Yu , Wendi Chang , Yusuke Fujino
IPC: H01L27/32 , H01L51/50 , G09G3/3225 , H01L51/56 , H01L51/52
Abstract: A display may have an array of pixels formed from organic light-emitting diodes and thin-film transistor circuitry. Each pixel may include organic layers interposed between an anode and a cathode. The organic layers may emit out-coupled light that escapes the display and waveguided light that is waveguided within the organic layers. A reflector may be placed at the edge of the organic layers to reflect the waveguided light out of the display. The reflector may be located within a pixel definition layer and may be formed from metal or may be formed from one or more interfaces between high-refractive-index material and low-refractive-index material. The reflector may be formed from an extended portion of the pixel anode. The reflector may be formed from light-reflecting particles that are suspended in the pixel definition layer.
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公开(公告)号：US20190067394A1
公开(公告)日：2019-02-28
申请号：US16114039
申请日：2018-08-27
Applicant: Apple Inc.
Inventor： Kwang Ohk Cheon , Cheng Chen , Chien Lu , Chih-Lei Chen , Chin Wei Hsu , Hui Lu , KiBeom Kim , Lun Tsai , Meng-Huan Ho , Nai-Chih Kao , Pei-Ling Lin , Rui Liu , Shan-Jen Yu , Wendi Chang , Yusuke Fujino
IPC: H01L27/32 , H01L51/50 , H01L51/52 , H01L51/56 , G09G3/3225
Abstract: A display may have an array of pixels formed from organic light-emitting diodes and thin-film transistor circuitry. Each pixel may include organic layers interposed between an anode and a cathode. The organic layers may emit out-coupled light that escapes the display and waveguided light that is waveguided within the organic layers. A reflector may be placed at the edge of the organic layers to reflect the waveguided light out of the display. The reflector may be located within a pixel definition layer and may be formed from metal or may be formed from one or more interfaces between high-refractive-index material and low-refractive-index material, The reflector may be formed from an extended portion of the pixel anode. The reflector may be formed from light-reflecting particles that are suspended in the pixel definition layer.
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公开(公告)号：US20230307590A1
公开(公告)日：2023-09-28
申请号：US18161764
申请日：2023-01-30
Applicant: Apple Inc.
Inventor： Young Cheol Yang , Young Seok Kim , Aaron L Holsteen , Cheng Cheng , Chin Wei Hsu , Hsin I Lu , Ileana G. Rau , Jaein Choi , James M. Perkins , James P. Ibbetson , Joy M. Johnson , Jui-Chih Liao , Steven E. Molesa , Sunggu Kang , Yang Deng , Zhibing Ge
IPC: H01L33/58 , H01L25/075 , H01L33/50 , H01L33/10
CPC classification number: H01L33/58 , H01L25/0753 , H01L33/505 , H01L33/10
Abstract: An electronic device may have a display with an array of inorganic light-emitting diodes. The array of inorganic light-emitting diodes may be overlapped by a polarizer layer such as a circular polarizer. Alternatively, the display may be a polarizer-free display without any polarizer layer over the array of inorganic light-emitting diodes. Each inorganic light-emitting diode may be surrounded by a diffuser that redirects edge-emissions towards a viewer. A top diffuser, a color filter layer, a microlens, and/or a microlens with color filtering and/or diffusive properties may also optionally overlap each inorganic light-emitting diode. The inorganic light-emitting diodes may have reflective sidewalls to mitigate edge-emissions. In this type of arrangement, the array of inorganic light-emitting diodes may be coplanar with one or more opaque masking layers. To mitigate reflections, the display may include two opaque masking layers having differing properties or a single phase separated opaque masking layer.
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公开(公告)号：US10224238B2
公开(公告)日：2019-03-05
申请号：US15268106
申请日：2016-09-16
Applicant: Apple Inc.
Inventor： Chang Ming Lu , Chia-Yu Chen , Chih Pang Chang , Ching-Sang Chuang , Hung-Che Ting , Jung Yen Huang , Sheng Hui Shen , Shih Chang Chang , Tsung-Hsiang Shih , Yu-Wen Liu , Yu Hung Chen , Kai-Chieh Wu , Lun Tsai , Takahide Ishii , Chung-Wang Lee , Hsing-Chuan Wang , Chin Wei Hsu , Fu-Yu Teng
IPC: H01L21/768 , H01L21/02 , H01L21/027 , H01L21/77
Abstract: A component such as a display may have a substrate and thin-film circuitry on the substrate. The thin-film circuitry may be used to form an array of pixels for a display or other circuit structures. Metal traces may be formed among dielectric layers in the thin-film circuitry. Metal traces may be provided with insulating protective sidewall structures. The protective sidewall structures may be formed by treating exposed edge surfaces of the metal traces. A metal trace may have multiple layers such as a core metal layer sandwiched between barrier metal layers. The core metal layer may be formed from a metal that is subject to corrosion. The protective sidewall structures may help prevent corrosion in the core metal layer. Surface treatments such as oxidation, nitridation, and other processes may be used in forming the protective sidewall structures.
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