公开(公告)号：US11965103B2

公开(公告)日：2024-04-23

申请号：US16996744

申请日：2020-08-18

Applicant: Applied Materials, Inc.

Inventor： Yingdong Luo ,  Sivapackia Ganapathiappan ,  Ashwin Murugappan Chockalingam ,  Daihua Zhang ,  Uma Sridhar ,  Daniel Redfield ,  Rajeev Bajaj ,  Nag B. Patibandla ,  Hou T. Ng ,  Sudhakar Madhusoodhanan

IPC: C09D11/107 ,  B24B37/24 ,  B29C64/112 ,  B29K33/00 ,  B29K509/02 ,  B29L31/00 ,  B33Y10/00 ,  B33Y40/10 ,  B33Y70/10 ,  B33Y80/00 ,  C09K3/14

CPC classification number: C09D11/107 ,  B24B37/245 ,  B29C64/112 ,  B33Y10/00 ,  B33Y40/10 ,  B33Y70/10 ,  B33Y80/00 ,  C09K3/1409 ,  B29K2033/08 ,  B29K2509/02 ,  B29L2031/736

Abstract: A formulation, system, and method for additive manufacturing of a polishing pad. The formulation includes monomer, dispersant, and nanoparticles. A method of preparing the formulation includes adding a dispersant that is a polyester derivative to monomer, adding metal-oxide nanoparticles to the monomer, and subjecting the monomer having the nanoparticles and dispersant to sonication to disperse the nanoparticles in the monomer.

公开(公告)号：US20250115697A1

公开(公告)日：2025-04-10

申请号：US18483352

申请日：2023-10-09

Applicant: Applied Materials, Inc.

Inventor： Xinyi Lu ,  SeyedMahmoud Hosseini ,  Sudhakar Madhusoodhanan ,  Srikant Pathak

IPC: C08F222/10 ,  B24D18/00 ,  B33Y10/00 ,  B33Y70/00 ,  C08F2/50

Abstract: Printable resin precursor compositions and polishing articles including printable resin precursors are provided. Printable resin precursors include a curable precursor formulation having a viscosity of less than or about 15 cP at 70° which include at least one urethane acrylate oligomer, at least one reactive monomer, and a photoinitiator. The curable precursor formulation exhibits an ultimate tensile strength measured in mPa and an elongation at break (%), where a product of the ultimate tensile strength and the elongation at break is greater than or about 2,000.

公开(公告)号：US20250115698A1

公开(公告)日：2025-04-10

申请号：US18483363

申请日：2023-10-09

Applicant: Applied Materials, Inc.

Inventor： Xinyi Lu ,  SeyedMahmoud Hosseini ,  Sudhakar Madhusoodhanan ,  Srikant Pathak

IPC: C08F222/10 ,  B24D18/00 ,  B33Y10/00 ,  B33Y70/00 ,  C08F2/50

Abstract: Printable resin precursor compositions and polishing articles including printable resin precursors are provided. Printable resin precursors include a curable precursor formulation having a viscosity of less than or about 15 cP at 70° which include at least one urethane acrylate oligomer, at least one reactive monomer, and a photoinitiator. The curable precursor formulation exhibits an ultimate tensile strength measured in mPa and an elongation at break (%), where a product of the ultimate tensile strength and the elongation at break is greater than or about 2,000.

公开(公告)号：US11851570B2

公开(公告)日：2023-12-26

申请号：US16668961

申请日：2019-10-30

Applicant: Applied Materials, Inc.

Inventor： Uma Sridhar ,  Sivapackia Ganapathiappan ,  Ashwin Chockalingam ,  Yingdong Luo ,  Daniel Redfield ,  Rajeev Bajaj ,  Nag B. Patibandla ,  Hou T. Ng ,  Sudhakar Madhusoodhanan

IPC: B29C64/112 ,  C09D11/38 ,  B24B37/24 ,  C09D11/107 ,  C09D11/101 ,  B33Y80/00 ,  B33Y70/00 ,  B29L31/00 ,  B29K33/00 ,  B33Y10/00

CPC classification number: C09D11/38 ,  B24B37/245 ,  B33Y70/00 ,  B33Y80/00 ,  C09D11/101 ,  C09D11/107 ,  B29C64/112 ,  B29K2033/08 ,  B29L2031/736 ,  B33Y10/00

Abstract: Polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes are provided. More particularly, implementations disclosed herein relate to composite polishing articles having tunable properties such as hydrophilicity and zeta potential. 3D printed chemical-mechanical planarization (CMP) pads composed of UV curable acrylic chemistry are generally hydrophobic in nature. Such hydrophobic behavior affects the wetting properties with abrasive-based polishing slurries such as ceria-base slurries. However, in order to increase the planarization and removal rate while decreasing defects, hydrophilic pads are preferred. In addition, it is desirable that the zeta potential (Zp) of the pads be tunable over a wide range of conditions at different pH values. Implementations of the present disclosure include methods for increasing the hydrophilicity and tuning the Zp of the pads with anionic additives and pads produced using these methods.

公开(公告)号：US11826876B2

公开(公告)日：2023-11-28

申请号：US16375506

申请日：2019-04-04

Applicant: Applied Materials, Inc.

Inventor： Sivapackia Ganapathiappan ,  Boyi Fu ,  Ashwin Chockalingam ,  Ankit Vora ,  Daniel Redfield ,  Rajeev Bajaj ,  Nag B. Patibandla ,  Hou T. Ng ,  Sudhakar Madhusoodhanan

IPC: B24B37/22 ,  B24B37/24 ,  B33Y70/00 ,  B29C64/112 ,  B33Y10/00 ,  B24B37/26 ,  B24B7/22 ,  B22F10/14 ,  B33Y80/00 ,  B22F10/12 ,  B22F10/18 ,  B22F10/25 ,  B22F10/28 ,  B22F10/68 ,  B22F12/55 ,  B22F12/58

CPC classification number: B24B7/22 ,  B22F10/14 ,  B24B37/24 ,  B24B37/26 ,  B29C64/112 ,  B33Y70/00 ,  B22F10/12 ,  B22F10/18 ,  B22F10/25 ,  B22F10/28 ,  B22F10/68 ,  B22F12/55 ,  B22F12/58 ,  B33Y10/00 ,  B33Y80/00 ,  B22F2999/00 ,  B22F1/10 ,  B22F10/10

Abstract: In one implementation, a method of forming a porous polishing pad is provided. The method comprises depositing a plurality of composite layers with a 3D printer to reach a target thickness. Depositing the plurality of composite layers comprises dispensing one or more droplets of a curable resin precursor composition onto a support. Depositing the plurality of composite layers further comprises dispensing one or more droplets of a porosity-forming composition onto the support, wherein at least one component of the porosity-forming composition is removable to form the pores in the porous polishing pad.

公开(公告)号：US20210054222A1

公开(公告)日：2021-02-25

申请号：US16996744

申请日：2020-08-18

Applicant: Applied Materials, Inc.

Inventor： Yingdong Luo ,  Sivapackia Ganapathiappan ,  Ashwin Murugappan Chockalingam ,  Daihua Zhang ,  Uma Sridhar ,  Daniel Redfield ,  Rajeev Bajaj ,  Nag B. Patibandla ,  Hou T. Ng ,  Sudhakar Madhusoodhanan

IPC: C09D11/107 ,  C09K3/14 ,  B24B37/24 ,  B33Y70/10 ,  B33Y80/00 ,  B33Y40/10 ,  B29C64/112 ,  B33Y10/00

Abstract: A formulation, system, and method for additive manufacturing of a polishing pad. The formulation includes monomer, dispersant, and nanoparticles. A method of preparing the formulation includes adding a dispersant that is a polyester derivative to monomer, adding metal-oxide nanoparticles to the monomer, and subjecting the monomer having the nanoparticles and dispersant to sonication to disperse the nanoparticles in the monomer.