公开(公告)号：US20160067996A1

公开(公告)日：2016-03-10

申请号：US14943808

申请日：2015-11-17

Applicant: BYD COMPANY LIMITED

Inventor： Qiang XU ,  Xinping LIN

IPC: B41M5/26 ,  B41M5/24 ,  C23C14/35

CPC classification number: B41M5/262 ,  B41M5/24 ,  C04B41/009 ,  C04B41/52 ,  C04B41/90 ,  C04B2111/80 ,  C23C14/35 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1868 ,  C23C18/38 ,  H05K1/0269 ,  H05K1/0306 ,  H05K3/027 ,  C04B35/10 ,  C04B35/48 ,  C04B41/4529 ,  C04B41/455 ,  C04B41/5049 ,  C04B41/5042 ,  C04B41/505 ,  C04B41/0036 ,  C04B41/4541 ,  C04B41/5127 ,  C04B41/5144 ,  C04B41/4564 ,  C04B41/522

Abstract: Embodiments of the present disclosure are directed to a method for forming a pattern on a surface of an insulating substrate and/or a ceramic article. The method comprises: forming a film on at least one surface of the insulating substrate, a material of the film comprising at least one of ZnO, SnO2, TiO2, or a combination thereof; and irradiating at least a part of the film by an energy beam to form the pattern in the film.

Abstract translation: 本公开的实施例涉及在绝缘基板和/或陶瓷制品的表面上形成图案的方法。 所述方法包括：在所述绝缘基板的至少一个表面上形成膜，所述膜的材料包含ZnO，SnO 2，TiO 2或其组合中的至少一种; 以及通过能量束照射所述膜的至少一部分以在所述膜中形成图案。

公开(公告)号：US20240123554A1

公开(公告)日：2024-04-18

申请号：US18398030

申请日：2023-12-27

Applicant: BYD COMPANY LIMITED

Inventor： Wei ZHOU ,  Yiming ZHU ,  Qiang XU ,  Wenyan ZHAO ,  Xiayang LI

IPC: B23K35/02 ,  B22F1/00 ,  B22F1/103 ,  B23K1/008 ,  B23K35/30

CPC classification number: B23K35/025 ,  B22F1/09 ,  B22F1/103 ,  B23K1/008 ,  B23K35/3006 ,  B23K2103/18

Abstract: Disclosed are an active metal brazing paste composition, a brazing paste and a method for brazing ceramics and metals. The composition includes a binder and metal powder. The metal powder includes active metal brazing powder and brazing-aid metal powder. The brazing-aid metal powder contains copper powder and/or copper-silver alloy powder. The active metal brazing powder is alloy powder containing copper, silver, and an active metal. With the total weight of the metal powder as a reference, the content of the active metal is 1.5 wt % or more, the content of silver is 40 wt % to 90 wt %, and the content of oxygen is 0.5 wt % or less.

公开(公告)号：US20190337856A1

公开(公告)日：2019-11-07

申请号：US16475039

申请日：2017-12-08

Applicant: BYD COMPANY LIMITED

Inventor： Chengchen LIU ,  Shanqing SONG ,  Changjian SHAO ,  Qiang XU ,  Xinping LIN

IPC: C04B35/581 ,  C04B35/622 ,  C04B38/00 ,  C22C1/10 ,  C04B41/48

Abstract: The present disclosure relates to the field of ceramics, and discloses a metal-based aluminum nitride composite material. The composite material includes an aluminum nitride ceramic skeleton and a metal filling at least part of pores of the aluminum nitride ceramic skeleton. The aluminum nitride ceramic skeleton contains aluminum nitride and CuAlO2, and the aluminum nitride ceramic skeleton has a porosity of 20 to 40 percent. The present disclosure further discloses a method for preparing the metal-based aluminum nitride composite material and the metal-based aluminum nitride composite material obtained by the method. A CuAlO2 substance is formed in the aluminum nitride ceramic skeleton obtained in the present disclosure.

公开(公告)号：US20160073497A1

公开(公告)日：2016-03-10

申请号：US14943747

申请日：2015-11-17

Applicant: BYD COMPANY LIMITED

Inventor： Qiang XU ,  Xinping LIN

IPC: H05K1/05 ,  H05K3/18 ,  H05K3/44

CPC classification number: H05K1/053 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1868 ,  C23C18/1879 ,  C23C18/40 ,  C25D11/08 ,  C25D11/10 ,  C25D11/16 ,  C25D11/246 ,  H05K3/185 ,  H05K3/44 ,  H05K2201/0116 ,  H05K2203/0315 ,  H05K2203/107 ,  H05K2203/1147

Abstract: Embodiments of the present disclosure are directed to a circuit board. The circuit board comprises: an aluminum-based substrate; an alumina layer formed on at least one surface of the aluminum-based substrate; and a circuit layer formed on the alumina layer. The alumina layer comprises alumina and an element selected from a group consisting of chromium, nickel, a rare earth metal, and a combination thereof.

Abstract translation: 本公开的实施例涉及电路板。 电路板包括：铝基底板; 形成在所述铝基基板的至少一个表面上的氧化铝层; 以及形成在氧化铝层上的电路层。 氧化铝层包括氧化铝和选自铬，镍，稀土金属及其组合的元素。

公开(公告)号：US20230269879A1

公开(公告)日：2023-08-24

申请号：US18003866

申请日：2021-06-28

Applicant: BYD COMPANY LIMITED

Inventor： Wei ZHOU ,  Qiang XU ,  Caicai XIE

IPC: H05K3/02 ,  H05K3/38 ,  H05K1/03 ,  C04B37/02

CPC classification number: H05K3/022 ,  C04B37/023 ,  H05K1/0306 ,  H05K3/385 ,  C04B2237/122 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/407 ,  C04B2237/525 ,  C23C22/52 ,  H05K2203/0786 ,  H05K2203/1105

Abstract: A method for preparing a ceramic copper clad laminate is provided, including following steps: providing a copper material; forming a copper oxide layer on a surface of the copper material; thermally treating the copper material on which the copper oxide layer is formed, to diffuse oxygen atoms in the copper material; removing the copper oxide layer on the thermally treated copper material; and soldering the copper-oxide-layer-removed copper material to a ceramic substrate to obtain a ceramic copper clad laminate.