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公开(公告)号：US07345885B2
公开(公告)日：2008-03-18
申请号：US11023213
申请日：2004-12-22
申请人： Brent A. Boudreaux , Shaun L Harris , Eric C. Peterson , Christian L Belady , Gary W. Williams , Stuart C. Haden
发明人： Brent A. Boudreaux , Shaun L Harris , Eric C. Peterson , Christian L Belady , Gary W. Williams , Stuart C. Haden
CPC分类号： H05K1/144 , H01L2924/0002 , H05K1/0204 , H05K3/0061 , H05K2201/09054 , H05K2201/1056 , H01L2924/00
摘要： A heat spreader with multiple stacked printed circuit boards (PCBS) includes top and side sections within which a first PCB is contained and bottom edges that extend to a second PCB. The heat spreader and second PCB substantially enclose the first PCB therein.
摘要翻译： 具有多个堆叠印刷电路板（PCBS）的散热器包括顶部和侧部，其中容纳第一PCB，并且底部边缘延伸到第二PCB。 散热器和第二PCB基本上围绕其中的第一PCB。
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公开(公告)号：US07289328B2
公开(公告)日：2007-10-30
申请号：US11021500
申请日：2004-12-21
申请人： Christian L. Belady , Gary W. Williams , Shaun L. Harris , Steven A. Belson , Eric C. Peterson , Stuart C. Haden
发明人： Christian L. Belady , Gary W. Williams , Shaun L. Harris , Steven A. Belson , Eric C. Peterson , Stuart C. Haden
IPC分类号： H05K7/20
CPC分类号： H05K7/20436 , H05K1/0204 , H05K1/0263 , H05K1/141 , H05K1/144 , H05K3/0061 , H05K2201/045 , H05K2201/064 , H05K2201/09054 , H05K2201/10189 , H05K2201/1056 , H05K2201/10689 , H05K2203/1572
摘要： Embodiments include apparatus, methods, and systems having a multi-chip module with a power system and pass-thru holes. An exemplary electronic module includes a first portion having a first printed circuit board (PCB) with a memory and plural processors. A second portion has a power system and a thermal dissipation device. The thermal dissipation device has plural extensions, and the power system has plural pass-thru holes. The first portion electrically couples to the second portion to form the electronic module when the plural extensions extend through the plural pass-thru holes of the power system and through plural pass-thru holes of a second PCB disposed between the first and second portions.
摘要翻译： 实施例包括具有电源系统和通孔的多芯片模块的装置，方法和系统。 示例性电子模块包括具有带存储器的第一印刷电路板（PCB）和多个处理器的第一部分。 第二部分具有动力系统和散热装置。 散热装置具有多个延伸部，电力系统具有多个通过孔。 当多个延伸部延伸穿过电力系统的多个通孔并且通过设置在第一和第二部分之间的第二PCB的多个通过孔时，第一部分电耦合到第二部分以形成电子模块。
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公开(公告)号：US07072185B1
公开(公告)日：2006-07-04
申请号：US11021527
申请日：2004-12-21
申请人： Christian L. Belady , Gary W. Williams , Shaun L Harris , Steven A. Belson , Eric C. Peterson , Stuart C. Haden
发明人： Christian L. Belady , Gary W. Williams , Shaun L Harris , Steven A. Belson , Eric C. Peterson , Stuart C. Haden
IPC分类号： H05K7/20
CPC分类号： H05K1/141 , G06F1/189 , G06F1/20 , H01L23/3677 , H01L2924/0002 , H05K1/0204 , H05K1/0263 , H05K1/144 , H05K3/0061 , H05K2201/045 , H05K2201/064 , H05K2201/09054 , H05K2201/10189 , H05K2201/1056 , H05K2201/10689 , H05K2203/1572 , H01L2924/00
摘要： Embodiments include apparatus, methods, and systems of an electronic module for a system board having at least one pass-thru hole. An exemplary electronic module, connectable to a system board with a pass-thru hole, includes a first portion coupled to one side of the system board. The first portion has a printed circuit board (PCB) with plural processors. A second portion of the electronic module couples to a second, opposite side of the system board. The second portion has a power system board electrically coupled to the first portion. The second portion also includes a thermal dissipation device that extends through the pass-thru hole of the system board.
摘要翻译： 实施例包括用于具有至少一个通过孔的系统板的电子模块的装置，方法和系统。 可连接到具有通孔的系统板的示例性电子模块包括耦合到系统板的一侧的第一部分。 第一部分具有多个处理器的印刷电路板（PCB）。 电子模块的第二部分耦合到系统板的第二相对侧。 第二部分具有电耦合到第一部分的电力系统板。 第二部分还包括延伸穿过系统板的通孔的散热装置。
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公开(公告)号：US06818835B2
公开(公告)日：2004-11-16
申请号：US10420572
申请日：2003-04-22
申请人： Stuart C. Haden , Shaun L. Harris , Michael C. Day , Christian L Belady , Lisa Heid Pallotti , Paul T. Artman , Eric C. Peterson
发明人： Stuart C. Haden , Shaun L. Harris , Michael C. Day , Christian L Belady , Lisa Heid Pallotti , Paul T. Artman , Eric C. Peterson
IPC分类号： H05K103
CPC分类号： H05K1/0231 , H05K1/0262 , H05K1/113 , H05K2201/09309 , H05K2201/0979 , H05K2201/10636 , Y02P70/611
摘要： A circuit comprising multiple circuit boards is disclosed herein. An embodiment of the circuit may comprise first and second printed circuit boards. The first printed circuit board may comprise first and second conductive planes. The first conductive plane has a first shape and the second conductive plane has a second shape, wherein the first shape is substantially similar to the second shape. The first conductive plane is located adjacent the second conductive plane, wherein the first conductive plane is parallel to and aligned with the second conductive plane. The second printed circuit board is connected to the first printed circuit board.
摘要翻译： 本文公开了包括多个电路板的电路。 电路的实施例可以包括第一和第二印刷电路板。 第一印刷电路板可包括第一和第二导电平面。 第一导电平面具有第一形状，第二导电平面具有第二形状，其中第一形状基本上类似于第二形状。 第一导电平面位于第二导电平面附近，其中第一导电平面平行于第二导电平面并与第二导电平面对准。 第二印刷电路板连接到第一印刷电路板。
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公开(公告)号：US07117929B2
公开(公告)日：2006-10-10
申请号：US10976033
申请日：2004-10-27
IPC分类号： F28F7/00
CPC分类号： H05K7/20418
摘要： A first heat sink is built including two sets of fins with a gap between the two fin sets. The gap is configured to allow the placement of a second heat sink between the two fin sets of the first heat sink. The first heat sink also includes slotted mounting lugs to allow the second heat sink to be mounted to the first heat sink allowing for varying stack up tolerances of the heat generating devices cooled by the first and second heat sinks.
摘要翻译： 建造了第一个散热器，其中包括两组散热片，两组散热片之间具有间隙。 间隙被配置为允许将第二散热器放置在第一散热器的两个翅片组之间。 第一散热器还包括开槽的安装凸耳，以允许第二散热器安装到第一散热器，从而允许由第一和第二散热器冷却的发热装置的叠加公差变化。
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公开(公告)号：US07096926B2
公开(公告)日：2006-08-29
申请号：US10831059
申请日：2004-04-22
IPC分类号： F28F7/00
CPC分类号： F28F23/00 , H01L23/433 , H01L2924/0002 , H01L2924/3011 , H05K3/0058 , H01L2924/00
摘要： A sealed pouch constructed of thermally conductive flexible material containing a low melting point, thermally conductive material is placed between two components that require thermal continuity. This assembly is then loaded in compression and heated to the melting point of the low melting point, thermally conductive material, which then melts within the sealed pouch, and conforms to the shape of the two components. The sealed pouch also may contain a springy material made of a metal, or a solder compatible plastic or organic to help maintain shape of the pouch in some applications.
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公开(公告)号：US07280364B2
公开(公告)日：2007-10-09
申请号：US10996722
申请日：2004-11-24
申请人： Shaun L. Harris , Steven A. Belson , Eric C. Peterson , Gary W. Williams , Christian L. Belady , Jeffrey P. Christenson
发明人： Shaun L. Harris , Steven A. Belson , Eric C. Peterson , Gary W. Williams , Christian L. Belady , Jeffrey P. Christenson
IPC分类号： H05K7/20
CPC分类号： H05K1/141 , G06F1/184 , G06F1/185 , G06F1/20 , H01L23/467 , H01L2924/0002 , H05K1/0203 , H05K1/0263 , H05K2201/10189 , H05K2201/1056 , H01L2924/00
摘要： One embodiment includes an electronic assembly having a first printed circuit board (PCB) coupled to a second PCB. The second PCB has at least two processors and is disposed above the first PCB. A thermal dissipation device is disposed above the second PCB, dissipates heat away from the two processors, and provides an airflow path. A power system is adjacent the thermal dissipation device and in a pathway of the airflow path.
摘要翻译： 一个实施例包括具有耦合到第二PCB的第一印刷电路板（PCB）的电子组件。 第二PCB具有至少两个处理器并且设置在第一PCB上方。 散热装置设置在第二PCB的上方，从两个处理器散热，并提供一个气流路径。 电力系统与散热装置相邻并且在气流路径的路径中。
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公开(公告)号：US07499281B2
公开(公告)日：2009-03-03
申请号：US11968520
申请日：2008-01-02
CPC分类号： H05K1/141 , H01L23/433 , H01L23/467 , H01L2924/0002 , H05K1/0203 , H05K1/0263 , H05K1/144 , H05K2201/10189 , H05K2201/1056 , H01L2924/00
摘要： Embodiments include apparatus, methods, and systems having a multi-chip module with a power system. An exemplary electronic module includes a printed circuit board (PCB) having a memory and plural processors. A power system couples to and is disposed vertically above the PCB. A thermal dissipation device is disposed between the power system and the PCB for dissipating heat, via a direct heat exchange, from both the power system and the plural processors.
摘要翻译： 实施例包括具有电力系统的多芯片模块的装置，方法和系统。 示例性电子模块包括具有存储器和多个处理器的印刷电路板（PCB）。 电力系统耦合到并垂直放置在PCB上方。 散热装置设置在电力系统和PCB之间，用于通过来自电力系统和多个处理器的直接热交换来散热。
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公开(公告)号：US07336490B2
公开(公告)日：2008-02-26
申请号：US10996721
申请日：2004-11-24
CPC分类号： H05K1/141 , H01L23/433 , H01L23/467 , H01L2924/0002 , H05K1/0203 , H05K1/0263 , H05K1/144 , H05K2201/10189 , H05K2201/1056 , H01L2924/00
摘要： Embodiments include apparatus, methods, and systems having a multi-chip module with a power system. An exemplary electronic module includes a printed circuit board (PCB) having a memory and plural processors. A power system couples to and is disposed vertically above the PCB. A thermal dissipation device is disposed between the power system and the PCB for dissipating heat, via a direct heat exchange, from both the power system and the plural processors.
摘要翻译： 实施例包括具有电力系统的多芯片模块的装置，方法和系统。 示例性电子模块包括具有存储器和多个处理器的印刷电路板（PCB）。 电力系统耦合到并垂直放置在PCB上方。 散热装置设置在电力系统和PCB之间，用于通过来自电力系统和多个处理器的直接热交换来散热。
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公开(公告)号：US07254027B2
公开(公告)日：2007-08-07
申请号：US11021504
申请日：2004-12-21
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , G06F2200/201 , H05K1/0203 , H05K1/0263 , H05K1/141 , H05K1/144 , H05K3/0061 , H05K2201/045 , H05K2201/064 , H05K2201/09054 , H05K2201/10189 , H05K2201/1056 , H05K2201/10689 , H05K2203/1572
摘要： Embodiments include apparatus, methods, and systems of a processor module for a system board. In one embodiment, an electronic module, having first and second portions, is removably connectable to the system board. The first portion connects to the system board and includes a thermal dissipation device and a printed circuit board (PCB) with a processor connected to a first side of the PCB. The thermal dissipation device dissipates heat, via a heat exchange, from the processor. The second portion is disposed in a space created between the first portion and the system board. The second portion has a power system board for providing power to the processor. The power system board extends adjacent and parallel to a second side of the PCB.
摘要翻译： 实施例包括用于系统板的处理器模块的装置，方法和系统。 在一个实施例中，具有第一和第二部分的电子模块可拆卸地连接到系统板。 第一部分连接到系统板，并且包括散热装置和印刷电路板（PCB），处理器连接到PCB的第一侧。 散热装置通过热交换从处理器散热。 第二部分设置在第一部分和系统板之间产生的空间中。 第二部分具有用于向处理器提供电力的电力系统板。 电源系统板相邻并平行于PCB的第二侧延伸。
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