公开(公告)号：US20130055190A1

公开(公告)日：2013-02-28

申请号：US13523874

申请日：2012-06-14

Applicant: DAN-CHEN WU ,  SHOU-KUO HSU ,  CHUN-JEN CHEN

Inventor： DAN-CHEN WU ,  SHOU-KUO HSU ,  CHUN-JEN CHEN

IPC: G06F17/50

CPC classification number: G06F17/5081 ,  G06F2217/78

Abstract: A computing device reads a printed circuit board (PCB) layout file from a storage device. The PCB layout file includes arrangement information of signal lines, power lines, and power through-holes arranged on a PCB. Furthermore, the computing device sets a reference distance between a selected power through-hole and a neighboring signal line, and searches for one or more line segments of one or more signal lines where the a distance between each of the one or more line segment and the selected power through-hole is less than the reference distance.

Abstract translation: 计算设备从存储设备读取印刷电路板（PCB）布局文件。 PCB布局文件包括布置在PCB上的信号线，电源线和电源通孔的布置信息。 此外，计算装置设置所选功率通孔和相邻信号线之间的参考距离，并且搜索一个或多个信号线的一个或多个线段，其中，所述一个或多个线段中的每一个之间的距离和 所选功率通孔小于参考距离。

公开(公告)号：US20120268086A1

公开(公告)日：2012-10-25

申请号：US13340707

申请日：2011-12-30

Applicant: WEI-CHIEH CHOU ,  DUEN-YI HO ,  CHUN-JEN CHEN ,  TSUNG-SHENG HUANG

Inventor： WEI-CHIEH CHOU ,  DUEN-YI HO ,  CHUN-JEN CHEN ,  TSUNG-SHENG HUANG

IPC: G05F1/12 ,  H03F3/45

CPC classification number: H02M3/33523 ,  H02M2001/0003

Abstract: A power supply device includes a power supply unit and a feedback control unit. The power supply unit is configured for generating an electric potential to be provided to a load. The feedback control unit detects the electric potential and adjusts relevant parameters of the electrical potential to achieve predetermined values. The feedback control unit includes a first feedback circuit and a second feedback circuit electrically connected in series.

Abstract translation: 电源装置包括电源单元和反馈控制单元。 电源单元被配置为产生要提供给负载的电位。 反馈控制单元检测电位并调整电位的相关参数以实现预定值。 反馈控制单元包括串联电连接的第一反馈电路和第二反馈电路。

公开(公告)号：US20110238233A1

公开(公告)日：2011-09-29

申请号：US12774685

申请日：2010-05-05

Applicant: TSUNG-SHENG HUANG ,  CHUN-JEN CHEN ,  DUEN-YI HO ,  WEI-CHIEH CHOU

Inventor： TSUNG-SHENG HUANG ,  CHUN-JEN CHEN ,  DUEN-YI HO ,  WEI-CHIEH CHOU

IPC: G06F19/00

CPC classification number: G06F17/5063

Abstract: A system for optimizing a current overload protection circuit includes an input device, a data storage device, a central processing device, and a display. The central processing device includes a storage module, a control module, and a calculation module. The storage module stores a VI application therein. The control module receives instructions from the input device and selects virtual electronic components of the current overload protection circuit from the data storage device and connection of the selected electronic components. The current overload protection circuit is completed and run in the VI application; electronic components significantly affecting the maximum protection current are labeled. The calculation module calculates normal distribution samples of the current overload protection circuit based on the labeled electronic components. The display shows whether the current overload protection circuit meets a process capability standard.

Abstract translation: 用于优化电流过载保护电路的系统包括输入装置，数据存储装置，中央处理装置和显示器。 中央处理装置包括存储模块，控制模块和计算模块。 存储模块在其中存储VI应用。 控制模块从输入设备接收指令，并从数据存储设备中选择电流过载保护电路的虚拟电子部件，并选择电子部件的连接。 电流过载保护电路在VI应用中完成并运行; 显着影响最大保护电流的电子元件被标记。 计算模块基于标记的电子元件计算电流过载保护电路的正态分布样本。 显示屏显示电流过载保护电路是否符合过程能力标准。

公开(公告)号：US20130284508A1

公开(公告)日：2013-10-31

申请号：US13563856

申请日：2012-08-01

Applicant: WEI-CHIEH CHOU ,  CHUN-JEN CHEN ,  DUEN-YI HO ,  TSUNG-SHENG HUANG ,  PO-CHUAN HSIEH ,  CHUN-NENG LIAO

Inventor： WEI-CHIEH CHOU ,  CHUN-JEN CHEN ,  DUEN-YI HO ,  TSUNG-SHENG HUANG ,  PO-CHUAN HSIEH ,  CHUN-NENG LIAO

IPC: H05K1/11

CPC classification number: H05K1/0216 ,  H05K2201/09618

Abstract: A printed circuit board (PCB) includes a power layer and a signal layer. A signal line is arranged on the signal layer. A power via extends through the power layer and the signal layer, and is electrically connected to the power layer and the signal layer. A number of through holes is defined in the PCB, through the power layer and the signal layer, and arranged between the signal line and the power via. The through holes are insulated from the power via. The inside wall of the power via is made of conductive material.

Abstract translation: 印刷电路板（PCB）包括功率层和信号层。 信号线布置在信号层上。 功率通孔延伸通过功率层和信号层，并且电连接到功率层和信号层。 在PCB中通过功率层和信号层定义了多个通孔，并布置在信号线和电源通孔之间。 通孔与电源通孔绝缘。 电源通孔的内壁由导电材料制成。

公开(公告)号：US20120297356A1

公开(公告)日：2012-11-22

申请号：US13213072

申请日：2011-08-18

Applicant: DAN-CHEN WU ,  SHOU-KUO HSU ,  CHENG-HSIEN LEE ,  CHUN-JEN CHEN

Inventor： DAN-CHEN WU ,  SHOU-KUO HSU ,  CHENG-HSIEN LEE ,  CHUN-JEN CHEN

IPC: G06F17/50

CPC classification number: G06F17/5081

Abstract: In a method for inspecting the layout of a printed circuit board (PCB), a component to be checked is determined from an electronic layout diagram of the PCB, and a power transmission line which may be serving that component is selected. The layout diagram is checked to determine whether the component is connected to the power transmission line, and further checked to determine whether more than one ground pins of the component is connected to the power transmission line. Vias that are shared by two or more ground pins of the component are determined if more than one ground pin is connected to the power transmission line. Shared vias are marked on the layout diagram.

Abstract translation: 在用于检查印刷电路板（PCB）的布局的方法中，从PCB的电子布局图确定要检查的部件，并且可以选择可用于该部件的输电线。 检查布局图以确定组件是否连接到电力传输线，并进一步检查以确定组件的多个接地引脚是否连接到电力传输线。 如果多个接地引脚连接到电力传输线，则确定由组件的两个或更多个接地引脚共享的通孔。 共享通孔在布局图上标出。

公开(公告)号：US20120261175A1

公开(公告)日：2012-10-18

申请号：US13156348

申请日：2011-06-09

Applicant: TSUNG-SHENG HUANG ,  CHUN-JEN CHEN ,  DUEN-YI HO ,  WEI-CHIEH CHOU

Inventor： TSUNG-SHENG HUANG ,  CHUN-JEN CHEN ,  DUEN-YI HO ,  WEI-CHIEH CHOU

IPC: H05K1/11

CPC classification number: H05K1/0265 ,  H05K1/117 ,  H05K2201/0784 ,  H05K2201/09972

Abstract: A printed circuit board includes a first circuit area, a second circuit area, a plurality of connectors, and a connecting terminal. The first circuit area is electrically connected to the second circuit area via the connectors. The connecting terminal is placed on one side of the first circuit area for electrically connecting with a load. An imaginary center line of the connecting terminal is perpendicular to the one side of the printed circuit board. The less a horizontal distance between the center line of connecting terminal and one of the connectors, the larger a vertical distance between the side of the printed circuit board and the one of the connector.

Abstract translation: 印刷电路板包括第一电路区域，第二电路区域，多个连接器以及连接端子。 第一电路区域经由连接器电连接到第二电路区域。 连接端子位于第一电路区域的一侧，用于与负载电连接。 连接端子的假想中心线垂直于印刷电路板的一侧。 连接端子的中心线与其中一个连接器之间的水平距离越小，印刷电路板的侧面和连接器中的一个之间的垂直距离越大。

公开(公告)号：US20120243194A1

公开(公告)日：2012-09-27

申请号：US13087488

申请日：2011-04-15

Applicant: TSUNG-SHENG HUANG ,  CHUN-JEN CHEN ,  DUEN-YI HO ,  WEI-CHIEH CHOU

Inventor： TSUNG-SHENG HUANG ,  CHUN-JEN CHEN ,  DUEN-YI HO ,  WEI-CHIEH CHOU

IPC: H05K1/18

CPC classification number: H05K7/00 ,  H05K1/0201 ,  H05K1/0265 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/0979

Abstract: A printed circuit board includes a top layer and a bottom layer. A power supply and an electronic component are located on the top layer. The power supply is connected to the top layer and the bottom layer through a first via. A number of second vias extends through the top layer and the bottom layer, and is electrically connected to the top layer and the bottom layer. A right-angled triangular void area without vias defined therein is formed on the printed circuit board, between the second vias and the electronic component. The second vias are arranged on a hypotenuse of the void area.

Abstract translation: 印刷电路板包括顶层和底层。 电源和电子元件位于顶层。 电源通过第一通孔连接到顶层和底层。 多个第二通孔延伸穿过顶层和底层，并且电连接到顶层和底层。 在印刷电路板上，在第二通孔和电子部件之间形成没有限定在其中的通孔的直角三角形空隙区域。 第二个通孔布置在空隙区域的斜边上。

公开(公告)号：US20110106481A1

公开(公告)日：2011-05-05

申请号：US12700747

申请日：2010-02-05

Applicant: HSIEN-CHUAN LIANG ,  SHEN-CHUN LI ,  CHUN-JEN CHEN ,  SHOU-KUO HSU ,  YUNG-CHIEH CHEN ,  WEN-LAING TSENG

Inventor： HSIEN-CHUAN LIANG ,  SHEN-CHUN LI ,  CHUN-JEN CHEN ,  SHOU-KUO HSU ,  YUNG-CHIEH CHEN ,  WEN-LAING TSENG

IPC: G06F19/00 ,  G01R31/00

CPC classification number: G01R31/2806 ,  G01R31/2834

Abstract: A system and method for checking a ground via of control chips of a printed circuit board (PCB) provides a graphical user interface (GUI) displaying a layout of the PCB. The control chip has a plurality of ground pins. The computer searches for signal path routing of each ground pin and ground vias along each signal path routing of each ground pin. If there are any ground vias having the same absolute coordinates, the computer determines that the ground vias are shared by more than one ground pin.

Abstract translation: 用于检查印刷电路板（PCB）的控制芯片的接地通路的系统和方法提供了显示PCB布局的图形用户界面（GUI）。 控制芯片具有多个接地引脚。 计算机沿每个接地引脚的每个信号路径路由搜索每个接地引脚和接地通孔的信号路径路由。 如果有任何接地通孔具有相同的绝对坐标，则计算机确定接地通孔由多个接地引脚共用。

公开(公告)号：US20070059886A1

公开(公告)日：2007-03-15

申请号：US11308639

申请日：2006-04-15

Applicant: CHUN-JEN CHEN

Inventor： CHUN-JEN CHEN

IPC: H01L21/336 ,  H01L29/76

CPC classification number: G06F17/5036

Abstract: A system for automatically calculating parameters of an MOSFET is disclosed. The parameter calculating system runs in a computer. The parameter calculating system is used for receiving values inputted, and for calculating parameters of the MOSFET according to the input values. The parameter calculating system includes an operation selecting module (110), a value receiving module (120), a judging module (130), a parameter calculating module (140), and a circuit netlist generating module (150). A related method is also disclosed.

Abstract translation: 公开了一种用于自动计算MOSFET参数的系统。 参数计算系统在计算机中运行。 参数计算系统用于接收输入的值，并根据输入值计算MOSFET的参数。 参数计算系统包括操作选择模块（110），值接收模块（120），判断模块（130），参数计算模块（140）和电路网表生成模块（150）。 还公开了相关方法。

公开(公告)号：US20120241207A1

公开(公告)日：2012-09-27

申请号：US13097104

申请日：2011-04-29

Applicant: TSUNG-SHENG HUANG ,  CHUN-JEN CHEN ,  DUEN-YI HO ,  WEI-CHIEH CHOU

Inventor： TSUNG-SHENG HUANG ,  CHUN-JEN CHEN ,  DUEN-YI HO ,  WEI-CHIEH CHOU

IPC: H05K1/11

CPC classification number: H05K1/025 ,  H05K1/0265 ,  H05K3/429 ,  H05K2201/0979

Abstract: A printed circuit board (PCB) includes first to fourth layers. A power supply is arranged on the first layer. An electronic component is arranged on the fourth layer. A first via and a second via extend through the PCB and are electrically connected to the electronic component. The PCB further includes third to seventh vias. A length of a transmission path of the current flows from the power supply to electronic component through the third via and the seventh via is almost the same as a length of a transmission path of the current flows from the power supply to the electronic component through the fourth to sixth vias.

Abstract translation: 印刷电路板（PCB）包括第一至第四层。 电源设置在第一层上。 电子部件布置在第四层上。 第一通孔和第二通孔延伸穿过PCB并且电连接到电子部件。 PCB还包括第三至第七个通孔。 通过第三通孔和第七通孔从电源流向电子部件的电流的传输路径的长度与电流从电源流向电子部件的传输路径的长度几乎相同 第四至第六个通道。