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    ELECTRO-OPTICAL MODULATOR USING WAVEGUIDES WITH OVERLAPPING RIDGES
    1.
    发明申请
    ELECTRO-OPTICAL MODULATOR USING WAVEGUIDES WITH OVERLAPPING RIDGES 审中-公开

    公开(公告)号：US20200183198A1

    公开(公告)日：2020-06-11

    申请号：US16789317

    申请日：2020-02-12

    Applicant: Cisco Technology, Inc.

    Inventor： Donald ADAMS ,  Prakash B. GOTHOSKAR ,  Vipulkumar PATEL ,  Mark WEBSTER

    IPC: G02F1/025 ,  G02F1/225 ,  G02B6/136 ,  G02B6/132 ,  G02F1/01

    Abstract: An optical modulator may include a lower waveguide, an upper waveguide, and a dielectric layer disposed therebetween. When a voltage potential is created between the lower and upper waveguides, these layers form a silicon-insulator-silicon capacitor (also referred to as SISCAP) guide that provides efficient, high-speed optical modulation of an optical signal passing through the modulator. In one embodiment, at least one of the waveguides includes a respective ridge portion aligned at a charge modulation region which may aid in confining the optical mode laterally (e.g., in the width direction) in the optical modulator. In another embodiment, ridge portions may be formed on both the lower and the upper waveguides. These ridge portions may be aligned in a vertical direction (e.g., a thickness direction) so that ridges overlap which may further improve optical efficiency by centering an optical mode in the charge modulation region.

    ELECTRO-OPTICAL MODULATOR USING WAVEGUIDES WITH OVERLAPPING RIDGES
    2.
    发明申请
    ELECTRO-OPTICAL MODULATOR USING WAVEGUIDES WITH OVERLAPPING RIDGES 审中-公开

    公开(公告)号：US20170269393A1

    公开(公告)日：2017-09-21

    申请号：US15615290

    申请日：2017-06-06

    Applicant: Cisco Technology, Inc.

    Inventor： Donald ADAMS ,  Prakash B. GOTHOSKAR ,  Vipulkumar PATEL ,  Mark WEBSTER

    IPC: G02F1/025 ,  G02B6/132 ,  G02B6/136

    Abstract: An optical modulator may include a lower waveguide, an upper waveguide, and a dielectric layer disposed therebetween. When a voltage potential is created between the lower and upper waveguides, these layers form a silicon-insulator-silicon capacitor (also referred to as SISCAP) guide that provides efficient, high-speed optical modulation of an optical signal passing through the modulator. In one embodiment, at least one of the waveguides includes a respective ridge portion aligned at a charge modulation region which may aid in confining the optical mode laterally (e.g., in the width direction) in the optical modulator. In another embodiment, ridge portions may be formed on both the lower and the upper waveguides. These ridge portions may be aligned in a vertical direction (e.g., a thickness direction) so that ridges overlap which may further improve optical efficiency by centering an optical mode in the charge modulation region.

    PASSIVE PLACEMENT OF A LASER ON A PHOTONIC CHIP
    3.
    发明申请
    PASSIVE PLACEMENT OF A LASER ON A PHOTONIC CHIP 审中-公开
    激光在光子芯片上的被动放置

    公开(公告)号：US20170003463A1

    公开(公告)日：2017-01-05

    申请号：US14790925

    申请日：2015-07-02

    Applicant: Cisco Technology, Inc.

    Inventor： Mary NADEAU ,  Thomas DAUGHERTY ,  Ravi Sekhar TUMMIDI ,  Vipulkumar PATEL

    IPC: G02B6/42 ,  H01S5/022 ,  H01S5/02 ,  G02B6/13

    CPC classification number: H01S5/02272 ,  G02B6/4231 ,  G02B6/4238 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01S5/0224 ,  H01S5/02252 ,  H01L2924/00014

    Abstract: Embodiments disclosed herein generally relate to a method for manufacturing a photonic device that facilitates precise alignment of a laser with a waveguide. The method generally includes disposing the laser on a support member on a substrate such that the laser contacts the support member. The support member may extend in a direction perpendicular to a base plane of the substrate, and solder may be disposed on the base plane such that a height of the solder in the direction perpendicular to the base plane is less than a height of the support member so that a gap is created between the solder and the laser. Once the laser has been properly aligned with the waveguide, the solder may be heated (e.g., reflowed) so that the solder contacts the laser.

    Abstract translation: 本文公开的实施例一般涉及一种用于制造有助于激光与波导的精确对准的光子器件的方法。 该方法通常包括将激光器设置在基板上的支撑构件上，使得激光器接触支撑构件。 支撑构件可以在垂直于基底的基面的方向上延伸，并且焊料可以设置在基面上，使得焊料在垂直于基面的方向上的高度小于支撑构件的高度 从而在焊料和激光之间产生间隙。 一旦激光器已经正确地对准波导，则焊料可以被加热（例如回流），使得焊料接触激光器。

    ELECTRO-OPTICAL MODULATOR WITH A VERTICAL CAPACITOR STRUCTURE
    4.
    发明申请
    ELECTRO-OPTICAL MODULATOR WITH A VERTICAL CAPACITOR STRUCTURE 有权
    具有垂直电容结构的电光调制器

    公开(公告)号：US20150212386A1

    公开(公告)日：2015-07-30

    申请号：US14266397

    申请日：2014-04-30

    Applicant: Cisco Technology, Inc.

    Inventor： Vipulkumar PATEL ,  Prakash GOTHOSKAR

    IPC: G02F1/225

    CPC classification number: G02F1/025 ,  G02B6/132 ,  G02B6/136 ,  G02F1/011 ,  G02F1/2257 ,  G02F2001/0152

    Abstract: An optical modulator may include a leftmost waveguide, a rightmost waveguide, and a dielectric layer disposed therebetween. In one embodiment, the waveguides may be disposed on the same plane. When a voltage potential is created between the rightmost and leftmost waveguides, these layers form a silicon-insulator-silicon capacitor (also referred to as SISCAP) structure that provides efficient, high-speed optical modulation of an optical signal passing through the modulator. As opposed to a horizontal SISCAP structure where the dielectric layer is disposed between upper and lower waveguides, arranging the dielectric layer between waveguides disposed on the same plane results in a vertical SISCAP structure. In one embodiment, the leftmost and rightmost waveguide are both made from crystalline silicon.

    Abstract translation: 光调制器可以包括最左边的波导，最右边的波导和介于它们之间的电介质层。 在一个实施例中，波导可以设置在同一平面上。 当在最右侧和最左侧的波导之间产生电压电位时，这些层形成硅 - 绝缘体 - 硅电容器（也称为SISCAP）结构，其提供通过调制器的光信号的有效的高速光调制。 与水平SISCAP结构相反，其中介电层设置在上和下波导之间，将介质层布置在同一平面上的波导之间，导致垂直SISCAP结构。 在一个实施例中，最左侧和最右侧的波导均由晶体硅制成。

    ALIGNING OPTICAL COMPONENTS IN A MULTICHANNEL RECEIVER OR TRANSMITTER PLATFORM
    9.
    发明申请
    ALIGNING OPTICAL COMPONENTS IN A MULTICHANNEL RECEIVER OR TRANSMITTER PLATFORM 有权
    在多通道接收机或发射机平台中对准光学部件

    公开(公告)号：US20160050019A1

    公开(公告)日：2016-02-18

    申请号：US14462239

    申请日：2014-08-18

    Applicant: Cisco Technology, Inc.

    Inventor： Prakash GOTHOSKAR ,  Vipulkumar PATEL ,  Kalpendu SHASTRI ,  Rao V. YELAMARTY

    IPC: H04B10/40

    CPC classification number: H04B10/40 ,  G02B6/4215 ,  G02B6/423 ,  G02B6/4244 ,  G02B6/4249

    Abstract: Embodiments described herein describe a sub-mount that is etched to include respective cavities with at least two adjacent sides that align optical filters and a mirror. Moreover, the cavities are arranged on the sub-mount such that when the filters and mirror are disposed in the cavities, they align in a manner that enables the performance of a multiplexing or demultiplexing function as part of, for example, a zigzag multiplexer/demultiplexer. In one embodiment, the filters and mirrors are aligned passively rather than actively. The sub-mount may then be placed on a substrate that includes other components of a ROSA or TOSA. In one embodiment, the substrate is also etched to include a cavity two adjacent sides to align the sub-mount so that sub-mount is passively aligned once disposed into the cavity.

    Abstract translation: 本文所述的实施例描述了一种子座，其被蚀刻以包括具有对准光学滤光器和反射镜的至少两个相邻侧的相应空腔。 此外，空腔被布置在子安装座上，使得当滤光器和反射镜设置在空腔中时，它们以使得能够执行复用或解复用功能作为例如锯齿形复用器/ 解复用器 在一个实施例中，滤波器和反射镜被动地而不是主动对准。 然后可以将该子安装件放置在包括ROSA或TOSA的其它部件的基板上。 在一个实施例中，衬底也被蚀刻以包括两个相邻侧面的空腔以对准子安装座，使得一旦设置在空腔中，子安装座被动地对准。

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