公开(公告)号：US20170252894A1

公开(公告)日：2017-09-07

申请号：US15601575

申请日：2017-05-22

Applicant: EBARA CORPORATION

Inventor： Mitsuru MIYAZAKI ,  Seiji KATSUOKA ,  Naoki MATSUDA ,  Junji KUNISAWA ,  Kenichi KOBAYASHI ,  Hiroshi SOTOZAKI ,  Hiroyuki SHINOZAKI ,  Osamu NABEYA ,  Shinya MORISAWA ,  Takahiro OGAWA ,  Natsuki MAKINO

IPC: B24B37/34 ,  H01L21/677 ,  H01L21/306 ,  H01L21/67

CPC classification number: B24B37/345 ,  H01L21/30625 ,  H01L21/67219 ,  H01L21/67739 ,  H01L21/67742 ,  H01L21/67754 ,  Y10T137/0318 ,  Y10T137/8593

Abstract: An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.

公开(公告)号：US20140259728A1

公开(公告)日：2014-09-18

申请号：US14287616

申请日：2014-05-27

Applicant: EBARA CORPORATION

Inventor： Tomoatsu ISHIBASHI ,  Takahiro OGAWA ,  Kenichi SUGITA ,  Shinji KAJITA ,  Koichi FUKAYA ,  Akira NAKAMURA

IPC: H01L21/02

CPC classification number: H01L21/02054 ,  H01L21/02074 ,  H01L21/67034

Abstract: A substrate drying apparatus includes a drying gas nozzle configured so that, assuming that a surface WA of the substrate W is a projection plane, regarding the drying gas flow Gf in the nozzle moving direction Dr, a collision position Gfw with the substrate W is located downstream of a projected discharge position Gfv′, the projected discharge position Gfv′ being a discharge position from the drying gas nozzle projected on the projection plane. In a three-dimensional space, the drying gas flow Gf is inclined, such that an angle α formed by an axis Ga of the drying gas flow Gf and a vertical line Wp of the substrate W is in a range from a half contact angle θ/2 to an angle determined by deducting the half contact angle θ/2 from 90°, the half contact angle θ/2 being a half of the contact angle θ.

Abstract translation: 基板干燥装置包括干燥气体喷嘴，其构成为，假设基板W的表面WA为投影面，关于喷嘴移动方向Dr的干燥气体流量Gf，与基板W的碰撞位置Gfw位于 在喷出位置Gfv'的下游，喷出位置Gfv'是从投影在投影面上的干燥气体喷嘴的排出位置。 在三维空间中，干燥气体流Gf倾斜，使得由干燥气体流Gf的轴线Ga和基板W的垂直线Wp形成的角度α在半接触角度 ; / 2通过减去半接触角和角度确定的角度; / 2从90°，半接触角和角度; / 2是接触角的一半。

公开(公告)号：US20140302676A1

公开(公告)日：2014-10-09

申请号：US14309152

申请日：2014-06-19

Applicant: Ebara Corporation

Inventor： Mitsuru MIYAZAKI ,  Seiji KATSUOKA ,  Naoki MATSUDA ,  Junji KUNISAWA ,  Kenichi KOBAYASHI ,  Hiroshi SOTOZAKI ,  Hiroyuki SHINOZAKI ,  Osamu NABEYA ,  Shinya MORISAWA ,  Takahiro OGAWA ,  Natsuki MAKINO

IPC: H01L21/67 ,  H01L21/306

CPC classification number: B24B37/345 ,  H01L21/30625 ,  H01L21/67219 ,  H01L21/67739 ,  H01L21/67742 ,  H01L21/67754 ,  Y10T137/0318 ,  Y10T137/8593

Abstract: An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.

Abstract translation: 公开了一种用于处理衬底的设备。 该装置包括：抛光部，其被配置为对基板进行抛光;移动机构，被配置为传送基板;以及清洁部，其构造成清洁和干燥被研磨的基板。 清洗部具有多个用于清洗多个基板的清洗线。 多个清洁线具有多个清洁模块和用于传送基板的多个传送机器人。

公开(公告)号：US20130219740A1

公开(公告)日：2013-08-29

申请号：US13860787

申请日：2013-04-11

Applicant: EBARA CORPORATION

Inventor： Tomoatsu ISHIBASHI ,  Takahiro OGAWA ,  Kenichi SUGITA ,  Shinji KAJITA ,  Koichi FUKAYA ,  Akira NAKAMURA

IPC: H01L21/67

CPC classification number: H01L21/02054 ,  H01L21/02074 ,  H01L21/67034

Abstract: A substrate drying apparatus includes a drying gas nozzle configured so that, assuming that a surface WA of the substrate W is a projection plane, regarding the drying gas flow Gf in the nozzle moving direction Dr, a collision position Gfw with the substrate W is located downstream of a projected discharge position Gfv′, the projected discharge position Gfv′ being a discharge position from the drying gas nozzle projected on the projection plane. In a three-dimensional space, the drying gas flow Gf is inclined, such that an angle α formed by an axis Ga of the drying gas flow Gf and a vertical line Wp of the substrate W is in a range from a half contact angle θ/2 to an angle determined by deducting the half contact angle θ/2 from 90°, the half contact angle θ/2 being a half of the contact angle θ.

Abstract translation: 基板干燥装置包括干燥气体喷嘴，其构成为，假设基板W的表面WA为投影面，关于喷嘴移动方向Dr的干燥气体流量Gf，与基板W的碰撞位置Gfw位于 在喷出位置Gfv'的下游，喷出位置Gfv'是从投影在投影面上的干燥气体喷嘴的排出位置。 在三维空间中，干燥气体流Gf倾斜，使得由干燥气体流Gf的轴线Ga和基板W的垂直线Wp形成的角度α在半接触角θ / 2相对于从90°减去半接触角θ/ 2确定的角度，半接触角θ/ 2是接触角θ的一半。

公开(公告)号：US20150050863A1

公开(公告)日：2015-02-19

申请号：US14530589

申请日：2014-10-31

Applicant: EBARA CORPORATION

Inventor： Mitsuru MIYAZAKI ,  Seiji KATSUOKA ,  Naoki MATSUDA ,  Junji KUNISAWA ,  Kenichi KOBAYASHI ,  Hiroshi SOTOZAKI ,  Hiroyuki SHINOZAKI ,  Osamu NABEYA ,  Shinya MORISAWA ,  Takahiro OGAWA ,  Natsuki MAKINO

IPC: B24B37/34 ,  H01L21/677 ,  H01L21/67

CPC classification number: B24B37/345 ,  H01L21/30625 ,  H01L21/67219 ,  H01L21/67739 ,  H01L21/67742 ,  H01L21/67754 ,  Y10T137/0318 ,  Y10T137/8593

Abstract: An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.

Abstract translation: 公开了一种用于处理衬底的设备。 该装置包括：抛光部，其被配置为对基板进行抛光;移动机构，被配置为传送基板;以及清洁部，其构造成清洁和干燥被抛光的基板。 清洗部具有多个用于清洗多个基板的清洗线。 多个清洁线具有多个清洁模块和用于传送基板的多个传送机器人。